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Process for forming a semiconductor device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/31
출원번호 US-0383238 (1999-08-26)
발명자 / 주소
  • Tobin Philip J.
  • Hegde Rama I.
  • Tseng Hsing-Huang
  • O'Meara David
  • Wang Victor
출원인 / 주소
  • Motorola, Inc.
대리인 / 주소
    Meyer
인용정보 피인용 횟수 : 26  인용 특허 : 23

초록

A method for forming an oxynitride gate dielectric layer (202, 204) begins by providing a semiconductor substrate (200). This semiconductor substrate is cleaned via process steps (10-28). Optional nitridation and oxidation are performed via steps (50 and 60) to form a thin interface layer (202). Bul

대표청구항

[ What is claimed is:] [1.]1. A method for forming a gate dielectric, the method comprising:loading a semiconductor substrate into a processing chamber of a processing tool;sealing the processing tool to form a seal;forming a dielectric region containing nitrogen and having a dielectric constant of

이 특허에 인용된 특허 (23)

  1. Kawamura Takao (17-11 ; Takakura-dai 1-chome Sakai-shi ; Osaka JPX) Iwano Hideaki (Kagoshima JPX) Miyamoto Naooki (Kagoshima JPX) Nishiguchi Yasuo (Kagoshima JPX), Electrophotographic sensitive member with amorphous Si barrier layer.
  2. Nakato Tatsuo (Vancouver WA), Graded implantation of oxygen and/or nitrogen constituents to define buried isolation region in semiconductor devices.
  3. Schmitt Jerome J. (265 College St. (12N) New Haven CT 06510), Method and apparatus for the deposition of solid films of a material from a jet stream entraining the gaseous phase of s.
  4. Ishikawa Hiraku (Tokyo JPX), Method for fabricating an oxynitride film for use in a semiconductor device.
  5. Aoki ; Teruaki ; Abe ; Motoaki, Method for manufacture of a semiconductor device.
  6. Fukuda Hisashi (Tokyo) Arajawa Tomiyuki (Tokyo JPX), Method of forming a nitrided silicon dioxide (SiOxNy) film.
  7. Schmitt ; III Jerome J. (New Haven CT) Halpern Bret L. (Bethany CT), Microwave plasma assisted supersonic gas jet deposition of thin film materials.
  8. Kauffman Ralph ; Lee Roger, Nonvolatile floating gate memory with improved interploy dielectric.
  9. Kim Young O. (Marlboro NJ) Manchanda Lalita (Aberdeen NJ) Weber Gary R. (Whitehouse Station NJ), Oxynitride-dioxide composite gate dielectric process for MOS manufacture.
  10. Woo Been-Jon K. (20675 Woodward Ct. Saratoga CA 95070) Atwood Gregory (2495 Marsha Way San Jose CA 95132) Lai Stefan K. C. (2613 Lincoln Ave. Belmont CA 94002) Ong T. C. (1820 Mayall Ct. San Jose CA , Process for fabricating a flash EPROM having reduced cell size.
  11. Okada Yoshio (Austin TX) Tobin Philip J. (Austin TX), Process for fabricating a semiconductor device having a high reliability dielectric material.
  12. Zhang Hongyong (Kanagawa JPX) Ohnuma Hideto (Kanagawa JPX) Takemura Yasuhiko (Kanagawa JPX), Process for fabricating thin film transistor.
  13. Ito Takashi (Kawasaki JPX) Nozaki Takao (Yokohama JPX), Process for producing a semiconductor device having a silicon oxynitride insulative film.
  14. Sung Janmye,TWX, Reduced mask DRAM process.
  15. Chapple-Sokol Jonathan D. (Poughkeepsie NY) Conti Richard A. (Mount Kisco NY) Kotecki David E. (Hopewell Junction NY) Simon Andrew H. (Fishkill NY) Tejwani Manu (Yorktown Heights NY), Safe method for etching silicon dioxide.
  16. Matsushita Takeshi (Sagamihara JPX) Hayashi Hisao (Atsugi JPX) Aoki Teruaki (Tokyo JPX) Yamoto Hisayoshi (Hatano JPX) Kawana Yoshiyuki (Atsugi JPX), Semiconductor device having oxygen doped polycrystalline passivation layer.
  17. Saitoh Manzoh (Tokyo JPX) Okamura Kenji (Tokyo JPX), Semiconductor device having polycrystalline silicon resistor.
  18. Yamazaki Kouji (Tokyo JPX) Gomi Hideki (Tokyo JPX), Semiconductor device having silicon oxynitride film with improved moisture resistance.
  19. Sakamoto Mitsuru (Tokyo JPX), Semiconductor integrated circuit device having improved trench isolation.
  20. Ping Er-Xang (Boise ID) Thakur Randhir P. S. (Boise ID), Semiconductor processing method of making a hemispherical grain (HSG) polysilicon layer.
  21. Kaloyeros Alain E. ; Arkles Barry C., Silicon nitrogen-based films and method of making the same.
  22. Kaganowicz Grzegorz (Belle Mead NJ) Enstrom Ronald E. (Skillman NJ) Robinson John W. (Levittown PA), Silicon oxynitride passivated semiconductor body and method of making same.
  23. Kaya Cetin (Dallas TX) Tigelaar Howard L. (Allen TX), Split metal plate capacitor and method for making the same.

이 특허를 인용한 특허 (26)

  1. Halliyal,Arvind; Ramsbey,Mark T.; Shiraiwa,Hidehiko; Yang,Jean Y., Integrated ONO processing for semiconductor devices using in-situ steam generation (ISSG) process.
  2. Polishchuk, Igor; Levy, Sagy Charel; Ramkumar, Krishnaswamy, Memory transistor with multiple charge storing layers and a high work function gate electrode.
  3. Polishchuk, Igor; Levy, Sagy Charel; Ramkumar, Krishnaswamy, Memory transistor with multiple charge storing layers and a high work function gate electrode.
  4. Mouli, Chandra, Memory with carbon-containing silicon channel.
  5. Mouli, Chandra, Method for fabricating stacked non-volatile memory with silicon carbide-based amorphous silicon thin film transistors.
  6. Balasubramanyam, Karanam; Biesemans, Serge; Park, Byeongju, Method for forming an electronic device.
  7. Gousev, Evgeni; Ajmera, Atul C.; D'Emic, Christopher P., Method for forming heavy nitrogen-doped ultra thin oxynitride gate dielectrics.
  8. Ramkumar, Krishnaswamy; Byun, Jeong; Levy, Sagy, Method of fabricating a nonvolatile charge trap memory device.
  9. Ramkumar, Krishnaswamy; Levy, Sagy; Byun, Jeong, Method of fabricating a nonvolatile charge trap memory device.
  10. Yang, Michael X.; Ho, Henry; Chen, Steven A., Method of forming a film in a chamber and positioning a substitute in a chamber.
  11. Cheng, Juing-Yi; Lee, T. L.; Chen, Chia Lin, Method of forming nitrogen enriched gate dielectric with low effective oxide thickness.
  12. Ramkumar, Krishnaswamy, Method of integrating a charge-trapping gate stack into a CMOS flow.
  13. Bertrand, Jacques; Ngo, Minh Van, Nickel silicide process using starved silicon diffusion barrier.
  14. Levy, Sagy Charel; Ramkumar, Krishnaswamy; Jenne, Fredrick B.; Geha, Sam G., Oxide-nitride-oxide stack having multiple oxynitride layers.
  15. Levy, Sagy; Ramkumar, Krishnaswamy; Jenne, Fredrick; Geha, Sam, Oxide-nitride-oxide stack having multiple oxynitride layers.
  16. Levy, Sagy, Oxynitride bilayer formed using a precursor inducing a high charge trap density in a top layer of the bilayer.
  17. Roizin,Yakov; Aloni,Efraim; Gutman,Micha; Vofsy,Menachem; Ben Gigi,Avi, Protection against in-process charging in silicon-oxide-nitride-oxide-silicon (SONOS) memories.
  18. Ramkumar, Krishnaswamy, Radical oxidation process for fabricating a nonvolatile charge trap memory device.
  19. Ramkumar, Krishnaswamy; Levy, Sagy Charel; Byun, Jeong Soo, Radical oxidation process for fabricating a nonvolatile charge trap memory device.
  20. Ramkumar, Krishnaswamy; Levy, Sagy; Byun, Jeong, Radical oxidation process for fabricating a nonvolatile charge trap memory device.
  21. Jenne, Fred; Lancaster, Loren Thomas, Semiconductor device having silicon-rich layer and method of manufacturing such a device.
  22. Ramkumar, Krishnaswamy; Levy, Sagy, Sequential deposition and anneal of a dielectic layer in a charge trapping memory device.
  23. Paul R. Besser ; Minh Van Ngo ; Christy Mei-Chu Woo ; George Jonathan Kluth, Silicon-starved nitride spacer deposition.
  24. Mouli, Chandra, Stacked non-volatile memory with silicon carbide-based amorphous silicon finFETs.
  25. Mouli,Chandra, Stacked non-volatile memory with silicon carbide-based amorphous silicon thin film transistors.
  26. Kane, Terence; Fischer, Lawrence S.; Herschbein, Steven B.; Hong, Ying; Tenney, Michael P., Structure and method for charge sensitive electrical devices.

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