초록 ▼

The present invention generally provides a fluid delivery system with particular application to electroplating. Two or more reservoirs are fluidly connected to one or more processing chambers by fluid delivery lines. A gas source is coupled to the reservoirs to selectively pressurize the reservoirs

The present invention generally provides a fluid delivery system with particular application to electroplating. Two or more reservoirs are fluidly connected to one or more processing chambers by fluid delivery lines. A gas source is coupled to the reservoirs to selectively pressurize the reservoirs and cause fluid flow therefrom to the processing chambers through the fluid delivery lines. The fluid levels in the reservoirs and the processing chambers are controlled to facilitate avity-assisted flow of fluid from the processing chambers to the reservoirs via the fluid delivery line when the fluid levels in the processing chambers are higher than the fluid levels in the reservoirs. In operation, the reservoirs are alternately filled and emptied with a fluid circulated between the reservoirs and the processing chambers. Alternately filling and emptying the reservoirs relative to one another at constant rates maintains the fluid level and flow rate in the processing chamber substantially constant.

대표청구항 ▼

[ What is claimed is:] [12.]12. A method for delivering a fluid between a pair of reservoirs and a substrate processing system wherein a first fluid level in the substrate processing system is maintained at a level higher than a second fluid level in the pair of reservoirs to provide a positive flui

[ What is claimed is:] [12.]12. A method for delivering a fluid between a pair of reservoirs and a substrate processing system wherein a first fluid level in the substrate processing system is maintained at a level higher than a second fluid level in the pair of reservoirs to provide a positive fluid pressure differential between the substrate processing system and the pair of reservoirs, the method comprising:(a) pressurizing a first reservoir and flowing fluid at a first rate from the first reservoir into the substrate processing system;(b) flowing fluid at a second rate from the substrate processing system into a second reservoir by utilizing the positive fluid pressure differential; and(c) reversing the fluid flow to provide fluid flow from the second reservoir to the substrate processing system and from the substrate processing system to the first reservoir.