초록 ▼

The present invention includes a process for forming an electrical device. In one embodiment, the process includes applying a solid patternable film over a substrate and forming a conductive material over the substrate while the solid patternable film overlies the substrate, wherein the conductive m

The present invention includes a process for forming an electrical device. In one embodiment, the process includes applying a solid patternable film over a substrate and forming a conductive material over the substrate while the solid patternable film overlies the substrate, wherein the conductive material extends at least partially within an opening in the patternable film. In another embodiment, the process includes applying a patterned film over a substrate having a pad and exposing the patterned film and the substrate to energy. The patterned film includes a first region that includes a conductor and a second region that does not have a conductor. The energy of the exposure forms an electrical connection between the conductor and the pad. In yet another embodiment, the process includes mechanically applying a film over a semiconductor device substrate, patterning the film to define a first opening to expose a conductive region within the semiconductor device substrate, forming a first conductive layer within the first opening, and forming a second conductive layer over the first conductive layer.

대표청구항 ▼

[ What is claimed is:] [1.]1. A process for forming an electrical device comprising:applying a solid patternable film over a substrate wherein the solid patternable film is further characterized as a tape film; andforming a first conductive material over the substrate while the solid patternable fil

[ What is claimed is:] [1.]1. A process for forming an electrical device comprising:applying a solid patternable film over a substrate wherein the solid patternable film is further characterized as a tape film; andforming a first conductive material over the substrate while the solid patternable film overlies the substrate,wherein the first conductive material extends at least partially within an opening in the solid patternable film.