초록 ▼

A gasket is provided as a substitute for metal dambars during a process of encapsulating an integrated circuit chip package. The gasket can be in the form of a straight strip for sealing one side of the lead frame or a structure which corresponds in shape and dimension to the entire perimeter of the

A gasket is provided as a substitute for metal dambars during a process of encapsulating an integrated circuit chip package. The gasket can be in the form of a straight strip for sealing one side of the lead frame or a structure which corresponds in shape and dimension to the entire perimeter of the lead frame. The gasket has grooves formed therein which are defined by projections between adjacent grooves. The depth of each groove is slightly greater than a thickness of the leads. When the gasket is compressed prior to injection of an encapsulation material, the gasket material deforms such that the projections sealingly fill the spaces between leads and the cross-sectional shape of each groove is substantially the same as the cross-sectional shape of the respective lead disposed within the groove.

대표청구항 ▼

[ What is claimed is:] [1.]1. A gasket for use in conjunction with a lead frame having at least one lead for encapsulating an integrated circuit chip package comprising:at least one preformed compressible strip having a groove corresponding to each of said at least one lead disposed in a surface the

[ What is claimed is:] [1.]1. A gasket for use in conjunction with a lead frame having at least one lead for encapsulating an integrated circuit chip package comprising:at least one preformed compressible strip having a groove corresponding to each of said at least one lead disposed in a surface thereof;each said groove having a depth and width when said gasket is in the uncompressed state dimensioned greater than said lead for encapsulation corresponding to said groove;said groove, in a compressed state, sealingly engaging said lead.