초록 ▼

The invention relates to an apparatus for lifting a substrate from a surface of a chuck subsequent to a processing step. The apparatus includes a perimeter pin for lifting the substrate from the surface of the chuck to a first position wherein the substrate is disposed on the perimeter pin during li

The invention relates to an apparatus for lifting a substrate from a surface of a chuck subsequent to a processing step. The apparatus includes a perimeter pin for lifting the substrate from the surface of the chuck to a first position wherein the substrate is disposed on the perimeter pin during lifting. The perimeter pin is configured to overcome a holding force at an interface of the substrate and the surface. Generally, the holding force is generated between the substrate and the surface during the processing step. The apparatus further includes a center pin for moving the substrate from the first position to a second position wherein the substrate is disposed on the center pin during moving. The second position is further away from the surface of the chuck than the first position.

대표청구항 ▼

[ What is claimed is:] [1.]1. An apparatus for lifting a substrate from a surface of a chuck subsequent to a processing step, said apparatus comprising:a perimeter pin for lifting said substrate from said surface of said chuck to a first position wherein said substrate is disposed on said perimeter

[ What is claimed is:] [1.]1. An apparatus for lifting a substrate from a surface of a chuck subsequent to a processing step, said apparatus comprising:a perimeter pin for lifting said substrate from said surface of said chuck to a first position wherein said substrate is disposed on said perimeter pin during said lifting, said perimeter pin beingconfigured to overcome a holding force at an interface of said substrate and said surface, said holding force being generated between said substrate and said surface during said processing step; anda center pin for moving said substrate from said first position to a second position wherein said substrate is disposed on said center pin during said moving, said second position being further away from said surface of said chuck than said first position.