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Enclosure for telecommunications equipment

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0388691 (1999-09-02)
발명자 / 주소
  • Hutchison Randy
  • Shiffbauer Robert
출원인 / 주소
  • Special Product Company
대리인 / 주소
    Hovey, Williams, Timmons & Collins
인용정보 피인용 횟수 : 33  인용 특허 : 13

초록

An enclosure (10) for protecting and dissipating heat from electronic equipment such as telecommunications repeater cards (12). The enclosure includes: exterior walls defining a substantially enclosed chamber (14); at least one shelf (16) positioned within the chamber for holding a plurality of repe

대표청구항

[ What is claimed is:] [1.]1. An enclosure for protecting telecommunications repeaters from exposure to harmful elements and for dissipating heat generated by the repeaters, the enclosure comprising:exterior walls defining a substantially enclosed chamber and an interior wall positioned within the c

이 특허에 인용된 특허 (13)

  1. Hilbrink Johan O. (Cincinnati OH), Apparatus for cooling electronic devices.
  2. Gates Frank Vernon, Apparatus for heat removal from a PC card array.
  3. Mauclere Bernard (Maurepas FRX) Jamet Daniel (Nozay FRX), Box for transmission line repeaters.
  4. Hayes Hasler R.,CAX ; Daniels Michael H.,CAX ; Atkinson John C.,CAX, Circuit packs and circuit pack and shelf assemblies.
  5. Bulante Roderick A. ; Duncan Gary L. ; Conwell Troy A. ; Quan Dennis ; Stafford John P. ; Lee Sung H., Composite heat sink/support structure.
  6. Leyssens Francois J. C. (Mortsel BEX) Rombouts Hendrikus M. J. (Zoersel BEX), Cooling system.
  7. Zapach Trevor,CAX ; Jeakins William D.,CAX ; Muegge Steven,CAX, Electronic unit.
  8. Beavers Roger L., Enclosure for high-density subscriber line modules.
  9. Hutchison Randy ; Shiffbauer Robert, Enclosure for telecommunications equipment.
  10. Baum Walter (Hanover DEX) Still Michael (Langenhagen DEX) Becker Erich (Seeheim-Jugenheim DEX), Heat-producing elements with heat pipes.
  11. Bartilson Bradley W., Large area, multi-device heat pipe for stacked MCM-based systems.
  12. Davis Aurthur A. (Harrold Wood GB2) Eady Robert W. (London GB2), Optical repeaters.
  13. Glover Richard John,CAX ; Bishop Michael Reginald,CAX ; Tencer Michal Stefan,CAX, Packaging system for thermally controlling the temperature of electronic equipment.

이 특허를 인용한 특허 (33)

  1. Owen, Gary R.; Posey, Ricky A., Battery cover.
  2. Gustine, Gary; Ham, Charles; Kusz, Matthew; Sawyer, Michael, Clamping case.
  3. Gustine,Gary; Ham,Charles; Kusz,Matthew J.; Sawyer,Michael, Clamping case.
  4. Gustine, Gary; Ham, Charles; Kusz, Matthew; Sawyer, Michael, Clamping receptacle.
  5. Gustine,Gary; Ham,Charles; Kusz,Matthew; Sawyer,Michael, Clamping receptacle.
  6. Nelson, Michael J.; Wayman, Michael J., Combination extruded and cast metal outdoor electronics enclosure.
  7. Wayman, Michael J.; Nelson, Michael J.; Zavadsky, Dean, Communication module component assemblies.
  8. Tantolin, Christian; Sarno, Claude, Cooling an electronic device.
  9. Fukuda, Hiroshi; Fujita, Kenji, Cooling structure for disk storage device.
  10. Ferris, Matthew D.; Petersen, Cyle D., Heat dissipation for electronic enclosures.
  11. Leon,Eduardo; Harwood,Walter; Bond,William; Hernandez,Frank; Vaidya,Avinash K., Heat pipe cooled electronics enclosure.
  12. Neudorfer, Julius, High efficiency heat removal system for rack mounted computer equipment.
  13. Sawyer, Michael; Kusz, Matthew J.; Gustine, Gary; Ham, Charles G.; Daniels, Fredrick A., Housings for circuit cards.
  14. Fried, Stephen Samuel; Maydanik, Yury F; Kozhin, Vladimir A., Liquid cooled condensers for loop heat pipe like enclosure cooling.
  15. Laetsch, Erich K., Local loop telecommunication repeater housing having mounting slots enabling replaceable repeater and voltage protector assemblies.
  16. Gustine, Gary; Ham, Charles G.; Sawyer, Michael; Daniels, Fredrick A.; Bishop, Michelle; King, Lane; Kusz, Matthew J., Mechanical housing.
  17. Gustine, Gary; Ham, Charles G.; Sawyer, Michael; Daniels, Fredrick; Bishop, Michelle; King, Lane; Kusz, Matthew, Mechanical housing.
  18. Gustine,Gary; Ham,Charles G.; Sawyer,Michael; Daniels,Frederick; Bishop,Michelle; King,Lane; Kusz,Matthew, Mechanical housing.
  19. Arney, Susanne; Cheng, Jen-Hau; Kolodner, Paul R.; Kota-Venkata, Krishna-Murty; Scofield, William; Salamon, Todd R.; Simon, Maria E., Mechanically-reattachable liquid-cooled cooling apparatus.
  20. Tracewell,Matthew S.; Chen,Gary G., Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology.
  21. Barth, Michael K.; Ham, Charles G.; Tennis, Gene; Kusz, Matthew; Sjodin, Chad J.; Ferris, Matthew; Petersen, Cyle D., Methods and systems of heat transfer for electronic enclosures.
  22. Wayman, Michael J.; Nelson, Michael J.; Thompson, Kevin, Solar shields.
  23. O'Baid, Amr Hassan; Kunimoto, Wallace Y., Stirling cycle cryocooler with improved magnet ring assembly and gas bearings.
  24. Nelson, Michael J.; Wayman, Michael J., Systems and methods for Venturi fan-assisted cooling.
  25. Thompson, Kevin; Nelson, Michael J.; Schatz, Paul, Systems and methods for retractable fan cooling of electronic enclosures.
  26. Nelson, Michael J.; Wayman, Michael J., Systems and methods for thermal management.
  27. Hutchison, Randall D.; Taubert, Tomasz, Telecommunications enclosure with individual, separated card holders.
  28. Lin, Wanlai; Hutchison, Randall D.; Smith, Kevan; Taubert, Tomasz, Telecommunications enclosure with individual, separated card holders.
  29. Randall D. Hutchinson ; Tomasz Taubert, Telecommunications enclosure with individual, separated card holders.
  30. Cosley,Michael; Garcia,Marvin; Teter,John, Thermal energy storage transfer system.
  31. Owens, Mark J.; Seiler, Chia; Brown, Brian Robert; Bonwick, Mark Henry; Scott, Quentin; Goh, Robert; Halgren, Ross, WDM add/drop multiplexer module.
  32. Owens, Mark J.; Seiler, Chia; Brown, Brian Robert; Bonwick, Mark Henry; Scott, Quentin; Goh, Robert; Halgren, Ross, WDM add/drop multiplexer module.
  33. Owens, Mark J.; Seiler, Chia; Brown, Brian Robert; Bonwick, Mark Henry; Scott, Quentin; Goh, Robert; Halgren, Ross, WDM add/drop multiplexer module.
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