초록 ▼

The bonding of components is facilitated by a conductive pattern which generates heat upon being irradiated with microwave or RF energy. The electrically conductive pattern is positioned on a first component surface and a curable resin having adhesive properties is applied thereto. A second componen

The bonding of components is facilitated by a conductive pattern which generates heat upon being irradiated with microwave or RF energy. The electrically conductive pattern is positioned on a first component surface and a curable resin having adhesive properties is applied thereto. A second component surface is placed in contacting relation with the resin and the conductive pattern is irradiated with microwave or RF energy to facilitate curing wherein the components are bonded together along the pattern. The conductive pattern can be utilized without adhesive resin wherein heat generated via the application of microwave or RF energy causes components to fuse together. The conductive pattern can be enveloped by polymeric material, wherein the polymeric material becomes the adhesive for bonding components when microwave or RF energy is applied.

대표청구항 ▼

[ What is claimed is:] [1.]1. A method of bonding components comprising the steps of:positioning an electrically conductive pattern on a first component surface;applying a curable resin having adhesive properties to said first component surface, wherein said resin is in contacting relation with said

[ What is claimed is:] [1.]1. A method of bonding components comprising the steps of:positioning an electrically conductive pattern on a first component surface;applying a curable resin having adhesive properties to said first component surface, wherein said resin is in contacting relation with said conductive pattern;positioning a second component surface in contacting relation with said resin; andsweeping said resin and said conductive pattern with variable frequency microwaves selected from at least one window of microwave frequencies, said at least one window selected to avoid damage to said first and second components, said sweeping performed at a rate selected to uniformly heat said conductive pattern and cure said resin wherein said first and second components are bonded together along said pattern.