초록 ▼

A resin-sealed power semiconductor device is provided. The thicknesses of a die pad (19) and a lead part (2) are made equal and as great as possible. A thick film substrate (8) is bonded with a bonding layer (20) onto a plurality of supporting inner leads (2AS) among first inner leads (2A1) position

A resin-sealed power semiconductor device is provided. The thicknesses of a die pad (19) and a lead part (2) are made equal and as great as possible. A thick film substrate (8) is bonded with a bonding layer (20) onto a plurality of supporting inner leads (2AS) among first inner leads (2A1) positioned above the die pad (19). Patterns of a control circuit of power semiconductor elements (1) are formed as thick film patterns (10) on an upper surface of the substrate (8), and a control circuit element (IC) (9) and all electronic components (12) are mounted on the patterns (10) by soldering. The constituents (9, 12, 10, 8, 1, 2A1, 19, 2B1) are sealed in a sealing resin (5). The resin-sealed power semiconductor device improves noise immunity while conventionally effectively dissipating heat generated by the power semiconductor elements, and is designed to be adaptable to increase in functionality thereof.

대표청구항 ▼

[ What is claimed is:] [1.]1. A resin-sealed power semiconductor device comprising:a frame part comprising a lead part having a plurality of inner leads and a plurality of outer leads continuous respectively with said plurality of inner leads, and a die pad equal in thickness to said lead part;a pow

[ What is claimed is:] [1.]1. A resin-sealed power semiconductor device comprising:a frame part comprising a lead part having a plurality of inner leads and a plurality of outer leads continuous respectively with said plurality of inner leads, and a die pad equal in thickness to said lead part;a power semiconductor element mounted on a portion of said die pad;a substrate bonded onto a support of said frame part except said portion of said die pad;a pattern of a control circuit of said power semiconductor element, said control circuit pattern being formed on at least a first main surface of said substrate;a semiconductor element mounted on said control circuit pattern for controlling said power semiconductor element;electronic components all mounted on said control circuit pattern and constituting said control circuit in conjunction with said semiconductor element; anda sealing resin for sealing therein said plurality of inner leads, said die pad, said power semiconductor element, said substrate, said semiconductor element and all of said electronic components.