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Cooling apparatus for electronic devices 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0579282 (2000-05-25)
발명자 / 주소
  • Cheon Kioan
대리인 / 주소
    Pauly
인용정보 피인용 횟수 : 90  인용 특허 : 32

초록

Cooling apparatus for computers and other electronic devices includes a heat transfer device having a passageway through which a liquid coolant circulates. The coolant circulates from the heat transfer device to a heat dissipation device and back. The heat dissipation device has a reservoir with fin

대표청구항

[ What is claimed is:] [16.]16. A computer comprising:a housing defining an interior space;at least one heat-producing component mounted inside said housing in said interior space;a heat transfer device having an internal passageway extending between an inlet port and an outlet port, said passageway

이 특허에 인용된 특허 (32)

  1. Burward-Hoy Trevor (Cupertino CA), Apparatus and method for cooling with noise control.
  2. Chien Chuan-Fu,TWX, CPU cooling system.
  3. Tracy Mark S. (Tomball TX), Computer cooling fan vibration isolation apparatus.
  4. Cree Roger W. (Stillwater MN), Computer cooling system.
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  6. Hileman Vincent P. (San Jose CA) Lajara Robert J. (San Jose CA) Stewart Thomas E. J. (Sunnyvale CA) Mitty Nagaraj P. R. (San Jose CA) Tombari Joseph A. (Mountain View CA) Grouell William L. (San Ramo, Computer housing with low noise cooling system.
  7. Kroener Hans-Juergen (Baiersdorf DEX), Computer tomography apparatus with a closed circulation cooling system.
  8. Samarov Victor M. (Carlisle MA) Larson ; Jr. Ralph I. (Bolton MA) Doumani George A. (No. Andover MA), Conformal heat sink for electronic module.
  9. Agonafer Dereje (Poughkeepsie NY) Anderson Timothy M. (Poughkeepsie NY) Chrysler Gregory M. (Poughkeepsie NY) Chao-fan Chu Richard (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY) Vader David T. , Convertible cooling module for air or water cooling of electronic circuit components.
  10. Agonafer Dereje (Poughkeepsie NY) Anderson Timothy M. (Poughkeepsie NY) Chrysler Gregory M. (Poughkeepsie NY) Chu Richard C. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY) Vader David T. (Mecha, Convertible heat exchanger for air or water cooling of electronic circuit components and the like.
  11. Mochizuki Masataka,JPX ; Mashiko Koichi,JPX ; Goto Kazuhiko,JPX ; Saito Yuji,JPX ; Eguchi Katsuo,JPX ; Nagaki Yoshihiro,JPX ; Takamiya Akihiro,JPX ; Nguyen Thang Toan,JPX, Cooler for electronic devices.
  12. Rockenfeller Uwe (Boulder City NV) Kirol Lance D. (Boulder City NV), Cooling apparatus for electronic and computer components.
  13. Rockenfeller Uwe (Boulder City NV) Kirol Lance D. (Boulder City NV), Cooling apparatus for electronic and computer components.
  14. Parmerlee James K. (Indianapolis IN) Tague B. Dale (Indianapolis IN), Cooling arrangement for plug-in module assembly.
  15. Arii Hiroshi (Kawasaki JPX) Kawada Hirohito (Mitaka JPX) Yoshida Takashi (Tokyo JPX) Nonaka Chiaki (Tokyo JPX), Cooling assembly for cooling electrical parts wherein a heat pipe is attached to a heat conducting portion of a heat con.
  16. Cheon Kioan, Cooling system for computer.
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  18. Tragen Barry J. (Forest Grove OR), Electronic computer cabinetry having fan and power supply drawers and connector port arrangement.
  19. Jeng Jian-Dih (Miau TWX) Leu Fang-Jun (Hsinchu TWX), Fanless convection cooling design for personal computers.
  20. Porter Warren W. (Escondido CA) Wall ; III Charles B. (Irmo SC), Focused CPU air cooling system including high efficiency heat exchanger.
  21. Alexander Arthur Ray ; Porter ; deceased Warren W., Focused air cooling employing a dedicated chiller.
  22. Hood ; III Charles D. ; Liu Peter, Heat sink assembly with rotating heat pipe.
  23. Koizumi Hisao (Zushi JPX), Heat transfer apparatus.
  24. Fox Leslie (Boxboro MA) Wade Paul C. (Shirley MA), Hybird cooling system for electronic components.
  25. Herbst ; II Gerhardt G. (1161 N. Woodsmill Rd. ; Apt C Chesterfield MO 63017), Integrated circuit cooling apparatus.
  26. Hatada Toshio (Tsuchiura) Matsushima Hitoshi (Ibaraki) Kondou Yoshihiro (Ibaraki) Inoue Hiroshi (Ibaraki) Otsuka Kanji (Higashiyamato) Shirai Yuji (Kodaira) Ohba Takao (Hadano) Yamagiwa Akira (Hadano, LSI cooling apparatus and computer cooling apparatus.
  27. Cutchaw John M. (7333 E. Virginia Ave. Scottsdale AZ 85257), Liquid cooled connector for integrated circuit packages.
  28. Koenen David J. (Houston TX), Microprocessor heat dissipation apparatus for a printed circuit board.
  29. Nelson Daryl (Beaverton OR), Multiple-fan microprocessor cooling through a finned heat pipe.
  30. Frey ; Jr. Sydney W. (Brookfield WI) Herson Mark I. (South Milwaukee WI), Natural convection cooling system for electronic components.
  31. Wyler Gregory T. (Winchester MA), Silent air cooled computer having a hard disk drive with an acoustic shield and a heat sink arranged exterior to the dri.
  32. Smoot ; III Edmond (233 Broadway ; Rm. 3615 New York NY 10007) Spector George (233 Broadway ; Rm. 3615 New York NY 10007), System cooler for a computer.

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