초록 ▼

A method of manufacturing thin foil alloys through a series of steps. A carrier having a polished carrier surface is placed within a deposition chamber. The carrier surface is generally polished to a mirrored surface finish. A sacrificial layer is applied atop the carrier surface. The sacrificial la

A method of manufacturing thin foil alloys through a series of steps. A carrier having a polished carrier surface is placed within a deposition chamber. The carrier surface is generally polished to a mirrored surface finish. A sacrificial layer is applied atop the carrier surface. The sacrificial layer is made of a material that may be easily dissolved or separated from the carrier surface to remove the metal foil. The carrier surface and sacrificial layer are placed within the deposition chamber. The sacrificial layer is exposed to an evaporated first metal which becomes deposited upon the sacrificial layer. An evaporated second metal is then applied concurrently or sequentially with the first metal. The first and second evaporated metals solidify on the sacrificial layer to form a multilayer foil. At this point, the multilayer foil includes discrete layers or areas of the evaporated metals.

대표청구항 ▼

[ What is claimed:] [1.]1. A hydrogen separating multilayer alloy foil comprising; a first Pd layer; and a second Cu layer; whereby said first and second layers form a self-supporting alloy foil having a composition between 59% and 60% Pd and the balance Cu and a combined thickness between 1 and 5 m

[ What is claimed:] [1.]1. A hydrogen separating multilayer alloy foil comprising; a first Pd layer; and a second Cu layer; whereby said first and second layers form a self-supporting alloy foil having a composition between 59% and 60% Pd and the balance Cu and a combined thickness between 1 and 5 microns.