|국가/구분||United States(US) Patent 등록|
|국제특허분류(IPC7판)||B29C-045/14 B29C-070/74 B29C-070/80|
|미국특허분류(USC)||264/267 ; 264/272.11 ; 264/276|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 6 인용 특허 : 7|
A molded structure formed in a mold having a space, the molded structure itself constituting a molding body when combined with an upper mold. The molded structure has a substrate which may be a carrier frame for an electrical connector. An insert which may be an elastomer is disposed on the substrate and formed in the space in the mold. A deformable (preferably elastic) molding seal is disposed directly on the substrate and under the elastomer, the molding seal preventing elastomer flash during molding. The molding seal may be a ridge surrounding the spa...
[ What is claimed:] [1.]1. A process of molding an insert on a substrate comprising the steps of:(a) providing a mold having an upper mold with a space, a lower mold, and a cavity disposed between the upper mold and the lower mold;(b) positioning a substrate, having a datum surface on which the upper mold locates;(c) positioning an elastic, deformable molding seal in the mold cavity so as to be positioned to outwardly surround an outer radial edge of an insert to be formed in the mold;(d) delivering an insert material to the space of the upper mold; and(...