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Heat-dissipating apparatus for an integrated circuit device

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0696903 (2000-10-25)
발명자 / 주소
  • Hsiao Chieh-Jen,TWX
대리인 / 주소
    Brooks & Kushman P.C.
인용정보 피인용 횟수 : 50  인용 특허 : 3

초록

A heat dissipating apparatus includes a base member that has an upright surrounding wall portion confining a receiving space, and a top wall for closing a top side of the receiving space. The base member is adapted to be disposed on a circuit board with an integrated circuit device accommodated with

대표청구항

[ I claim:] [1.]1. A heat dissipating apparatus for dissipating heat released from a heat-generating side of an integrated circuit device that is mounted on a circuit board, said heat-dissipating apparatus comprising:a base member having an upright surrounding wall portion that confines a receiving

이 특허에 인용된 특허 (3)

  1. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Dehumidified cooling assembly for IC chip modules.
  2. Kegler Andrew F. ; Harris Stephen L. ; Malchow Gregory L. ; Becht Charles, Dry cleaning vessel door opening apparatus with self-aligning and reduced stress locking lugs.
  3. Watanabe Hideo,JPX ; Tezuka Hirofusa,JPX ; Ogasawara Mitsutoshi,JPX ; Suzuki Nobuhiko,JPX ; Sato Kazuya,JPX, Thermoelectric apparatus.

이 특허를 인용한 특허 (50)

  1. Brewer,Richard Grant; Upadhya,Girish; Zhou,Peng; McMaster,Mark; Tsao,Paul, Apparatus and method of efficient fluid delivery for cooling a heat producing device.
  2. Kenny,Thomas; McMaster,Mark; Lovette,James, Apparatus and method of forming channels in a heat-exchanging device.
  3. Kenny, Jr.,Thomas William; Goodson,Kenneth E.; Santiago,Juan G.; Everett, Jr.,George Carl, Apparatus for conditioning power and managing thermal energy in an electronic device.
  4. Pokhama,Himanshu; Mongia,Rajiv K.; DiStefano,Eric, Apparatus to use a refrigerator in mobile computing device.
  5. Datta, Madhav; McMaster, Mark, Bonded metal and ceramic plates for thermal management of optical and electronic devices.
  6. Chen, Wilson, CPU cooling structure.
  7. Tavassoli,Kamran; Porreca,Paul J.; Sullivan,Robert C., Card cage with parallel flow paths having substantially similar lengths.
  8. Utsunomiya, Motoyasu, Circulation-type liquid cooling apparatus and electronic device containing same.
  9. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Closed-loop microchannel cooling system.
  10. Santiago,Juan G.; Zeng,Shulin, Control of electrolysis gases in electroosmotic pump systems.
  11. Joshi,Shrikant M.; Bhatti,Mohinder S.; Reyzin,Ilya E.; Johnson,Russell S., Cooling assembly with spirally wound fin.
  12. Furuya, Keizo, Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module.
  13. Shook,James Gill; Lovette,James, Decoupled spring-loaded mounting apparatus and method of manufacturing thereof.
  14. Correa, Adrian; Lin, Tien Chih (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  15. Correa, Adrian; Lin, Tien-Chieh (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  16. Goodson, Kenneth E.; Chen, Chuan-Hua; Huber, David E.; Jiang, Linan; Kenny, Thomas W.; Koo, Jae-Mo; Laser, Daniel J.; Mikkelsen, James C.; Santiago, Juan G.; Wang, Evelyn Ning-Yi; Zeng, Shulin; Zhang, Electroosmotic microchannel cooling system.
  17. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Electroosmotic microchannel cooling system.
  18. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Electroosmotic microchannel cooling system.
  19. Munch, Mark; Werner, Douglas E., Gimballed attachment for multiple heat exchangers.
  20. Tien-Lai Wang TW, Heat dissipater for a central processing unit.
  21. Tsai, Mei-Nan; Tsai, Cheng-Lung, Heat dissipating device.
  22. Gektin, Vadim; Novotny, Shlomo; Vogel, Marlin R., Heatsink with active liquid base.
  23. Werner,Douglas; Munch,Mark; Kenny,Thomas, Hermetic closed loop fluid system.
  24. Wayburn, Lewis S.; Gage, Derek E.; Hayes, Andrew M.; Barker, R. Walton; Niles, David W., Integrated circuit cooling apparatus.
  25. Hom, James; Upadhya, Girish; Werner, Douglas E.; Munch, Mark; Tsao, Paul; Conway, Bruce; Zhou, Peng; Brewer, Richard, Integrated liquid to air conduction module.
  26. Hom, James; Choi, Hae-won; Lin, Tien Chih (Eric); Werner, Douglas E.; Chow, Norman; Correa, Adrian; Leong, Brandon; Gopalakrishnan, Sudhakar; Brewer, Richard Grant; McMaster, Mark; Upadhya, Girish, Internal access mechanism for a server rack.
  27. Upadhya,Girish; Kenny,Thomas W.; Zhou,Peng; Munch,Mark; Shook,James Gill; Goodson,Kenneth; Corbin,David, Interwoven manifolds for pressure drop reduction in microchannel heat exchangers.
  28. Goodson,Kenneth; Kenny,Thomas; Zhou,Peng; Upadhya,Girish; Munch,Mark; McMaster,Mark; Horn,James, Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device.
  29. Upadhya,Girish; Brewer,Richard Grant; McMaster,Mark, Method and apparatus for controlling freezing nucleation and propagation.
  30. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,Dave; McMaster,Mark; Lovette,James, Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device.
  31. Datta, Madhav; McMaster, Mark; Brewer, Rick; Zhou, Peng; Tsao, Paul; Upadhaya, Girish; Munch, Mark, Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system.
  32. Brewer, Richard Grant; Chow, Norman; Hom, James, Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers.
  33. Corbin,David; Goodson,Kenneth; Kenny,Thomas; Santiago,Juan; Zeng,Shulin, Micro-fabricated electrokinetic pump.
  34. Kenny,Thomas W.; Shook,James Gill; Zeng,Shulin; Lenehan,Daniel J.; Santiago,Juan; Lovette,James, Micro-fabricated electrokinetic pump with on-frit electrode.
  35. Datta, Madhav; Leong, Brandon; McMaster, Mark, Microheat exchanger for laser diode cooling.
  36. Lovette,James; Zhou,Peng; Shook,James Gill, Multi-level microchannel heat exchangers.
  37. Upadhya, Girish; Herms, Richard; Zhou, Peng; Goodson, Kenneth; Hom, James, Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange.
  38. Zhou,Peng; van Der Heide,Dolf; Goodson,Kenneth; Upadhya,Girish, Optimized multiple heat pipe blocks for electronics cooling.
  39. Kenny, Jr., Thomas William; Goodson, Kenneth E.; Santiago, Juan G.; Everett, Jr., George Carl, Power conditioning module.
  40. Kenny, Jr.,Thomas William; Goodson,Kenneth E.; Santiago,Juan G.; Everett, Jr.,George Carl, Power conditioning module.
  41. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
  42. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
  43. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  44. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  45. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  46. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  47. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  48. Kim, Tae-Yong, System for controlling temperature of a secondary battery module.
  49. Kenny, Jr., Thomas William; Goodson, Kenneth E.; Santiago, Juan G.; Kim, John J.; Chaplinsky, Robert C.; Everett, Jr., George Carl, System including power conditioning modules.
  50. Zhou,Peng; Goodson,Kenneth; Suntiago,Juan, Vapor escape microchannel heat exchanger.
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