초록 ▼

A microwave solid interface module having transmit and receive functionality includes a substrate supporting microwave, logic, and DC bias circuits. In one embodiment, the substrate can be formed from BeO. The module can include a BGA package that provides a connector-less interface for RF, DC, and

A microwave solid interface module having transmit and receive functionality includes a substrate supporting microwave, logic, and DC bias circuits. In one embodiment, the substrate can be formed from BeO. The module can include a BGA package that provides a connector-less interface for RF, DC, and thermal connections to a supporting module. The BGA structure provides vertical connections between the BGA solder balls and a respective DC signal layer, a microwave signal layer, and a thermally conductive core within the supporting module.

대표청구항 ▼

[ What is claimed is:] [1.]1. A circuit assembly, comprising:a solid interface module includinga substrate; anda circuit disposed on the substrate;a multi-layer carrier having a thermally conductive core, the solid interface module being disposed on the carrier; anda thermal via extending from the s

[ What is claimed is:] [1.]1. A circuit assembly, comprising:a solid interface module includinga substrate; anda circuit disposed on the substrate;a multi-layer carrier having a thermally conductive core, the solid interface module being disposed on the carrier; anda thermal via extending from the solid interface module to the conductive core.