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Integrated heat dissipation apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
출원번호 US-0608820 (2000-06-30)
발명자 / 주소
  • Bookhardt Gary L.
  • McEuen Shawn S.
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    Blakely, Sokoloff, Taylor & Zafman LLP
인용정보 피인용 횟수 : 39  인용 특허 : 7

초록

An integrated heat dissipation apparatus includes an attachment area, a heat exchange area thermally connected to the attachment area, and an air flow generation area that is integrally formed with the attachment area and the heat exchange area. A thermally conductive member extends between the atta

대표청구항

[ What is claimed is:] [1.]1. A heat dissipation apparatus for a central processing unit on a substrate, comprising:an attachment block for positioning on the central processing unit and having a contoured recess to mate with a periphery of the central processing unit and a through hole down into th

이 특허에 인용된 특허 (7)

  1. Suzuki Masahiro,JPX, Cooling system for electronic packages.
  2. Nakamura Hiroshi,JPX ; Yamamoto Katsuhiko,JPX, Cooling unit for cooling a heat-generating components and electronic apparatus having the cooling unit.
  3. Hong Chen Fu-In (No. 3 ; Lane 45 ; Yi-Yung Road Kaohsiung TWX), Fan assembly for an integrated circuit.
  4. Liu Eric,TWX ; Lin Pao Lung,TWX ; Lu Chun-Hsin,TWX, Heat sink assembly.
  5. Sun Ming-Shen,TWX ; Lu Shao-Pai,TWX, Heat-dissipating module for an electronic device.
  6. Yu Shu-Jen,TWX, Heat-radiating structure for CPU.
  7. Lu Chun-Hsin,TWX, Thermal module.

이 특허를 인용한 특허 (39)

  1. Wintersteen, Douglas Charles; Chatt, David M.; Pinger, Chad S.; O'Dwyer, Luke E., Air distribution unit.
  2. Shih-Tsung, Chen, CPU cooling using a heat pipe assembly.
  3. Chang, Je-Young, Computer assembly providing cooling for more than one electronic component.
  4. Cheng,Stan, Computer chassis frame support.
  5. Lev, Jeffrey A.; Tracy, Mark S., Computer device heat dissipation system.
  6. Wintersteen, Douglas Charles; Chatt, David M.; Pinger, Chad S.; O'Dwyer, Luke E., Computer enclosure air distribution system.
  7. Ishikawa, Kenichi, Cooling device for cooling a heat-generating component, and electronic apparatus having the cooling device.
  8. Ishikawa,Kenichi, Cooling device for cooling a heat-generating component, and electronic apparatus having the cooling device.
  9. Cipolla, Thomas M; Jamal-Eddine, Tarek J; Mok, Lawrence S, Cooling mechanism for an electronic device.
  10. Kim,Ye Yong; Lee,Harrison Ford; Choi,Jin Kwan, Cooling system for a portable computer.
  11. Sarraf, David B.; DeHoff, Robert E.; Hartenstine, John; Todd, Jr., John J., Cooling system for electronics with improved thermal interface.
  12. Hata, Yukihiko; Tomioka, Kentaro, Cooling unit having a heat radiating portion, and electronic apparatus incorporating a cooling unit.
  13. Hata,Yukihiko; Tomioka,Kentaro; Tanimoto,Mitsuyoshi, Cooling unit having a plurality of heat-radiating fins, and electronic apparatus with the cooling unit.
  14. Lai, Chih-Hsi; Fang, Hawk, Double heat exchange module for a portable computer.
  15. Tadayon, Pooya; Monzon, Franklin G.; Dujari, Prateek, Electrical energy-generating heat sink system and method of using same to recharge an energy storage device.
  16. Tadayon, Pooya; Monzon, Franklin G.; Dujari, Prateek, Electrical energy-generating heat sink system and method of using same to recharge an energy storage device.
  17. Tadayon,Pooya; Zaerpoor,Koorosh, Electrical energy-generating system and devices and methods related thereto.
  18. Wong, Chun-Chieh; Wang, Cheng-Yu, Heat dissipating module and heat dissipating method thereof.
  19. Kim,Ye Yong, Heat dissipating structure for mobile device.
  20. Chen, Wen-Hsiang; Chang, Jung-Wen, Heat dissipation apparatus.
  21. Cheng, Nien Tien; Lin, Chen Shen, Heat dissipation apparatus.
  22. Chang,Juei Chi, Heat dissipation device having thermally conductive cover board.
  23. Chen,Yun Sheng, Heat dissipation module.
  24. Degner, Brett W.; Augenbergs, Peteris K.; Liang, Frank; Heresztyn, Amaury J.; Mathew, Dinesh; Wilson, Jr., Thomas W., Heat removal in compact computing systems.
  25. Degner, Brett W.; Augenbergs, Peteris K.; Liang, Frank; Heresztyn, Amaury J.; Mathew, Dinesh; Wilson, Thomas W., Heat removal in compact computing systems.
  26. Feng Ku Wang TW, Heat sink modular structure inside an electronic product.
  27. Cheng,Yi Lun; Lin,Chun Lung; Wang,Feng Ku, Heat sink module for dissipating heat from a heat source on a motherboard.
  28. Chen,Wei Liang; Wu,Wei Ming, Heat sink structure with flexible heat dissipation pad.
  29. Miyahara, Masaharu; Mehara, Koji; Yoshida, Shinji, Heat sink unit and electronic apparatus using the same.
  30. Zhang, Heng Yun; Pinjala, Damaruganath; Hayashi, Hidetaka; Chan, Poh Keong, Heat transfer apparatus.
  31. Huang,Yu Nien; Yu,Shun Ta; Wang,Cheng Yu; Tseng,Jim Fat; Chien,Tsan Nan; Liu,Yu, Heat-dissipation device with elastic member and heat-dissipation method thereof.
  32. Wang,Frank, Heatsink thermal module with noise improvement.
  33. Meng-Cheng Huang TW, Integral heat dissipating device.
  34. Prasher, Ravi; Watwe, Abhay A.; Chrysler, Gregory M.; Frutschy, Kristopher; Ofman, Leo; Sathe, Ajit V., Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment.
  35. Prasher, Ravi; Watwe, Abhay A.; Chrysler, Gregory M.; Frutschy, Kristopher; Ofman, Leo; Sathe, Ajit V., Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment.
  36. Liu,Tay Jian; Tung,Chao Nien; Hou,Chuen Shu; Yang,Chih Hao, Loop-type heat exchange module.
  37. Watwe, Abhay; Prasher, Ravi, Thermal cooling apparatus.
  38. Makley, Albert V.; Cipolla, Thomas M.; Hildner, Thomas R.; Kamath, Vinod; Kiyooka, Fumitoshi; Mok, Lawrence S.; Nakamura, Fusanobu, Thermal docking fansink.
  39. Degner, Brett W.; Reid, Gavin J.; Smith, Brandon S.; Shan, Raymond S., Thermal module accounting for increased board/die size in a portable computer.
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