초록 ▼

Microelectronic assemblies are encapsulated using disposable frames. The microelectronic assemblies are disposed within an aperture defined by a frame. The aperture is covered by top and bottom sealing layers so that the frame and sealing layers define an enclosed space encompassing the assemblies.

Microelectronic assemblies are encapsulated using disposable frames. The microelectronic assemblies are disposed within an aperture defined by a frame. The aperture is covered by top and bottom sealing layers so that the frame and sealing layers define an enclosed space encompassing the assemblies. The encapsulant is injected into this closed space. The frame is then separated from the encapsulation fixture and held in a curing oven. After cure, the frame is cut apart and the individual assemblies are severed from one another. Because the frame need not be held in the encapsulation fixture during curing, the process achieves a high throughput.

대표청구항 ▼

[ What is claimed is:] [1.]1. A method of encapsulating a plurality of microelectronic assemblies having oppositely-facing top and bottom surfaces comprising the steps of:(a) providing said assemblies within an opening in a frame having top and bottom surfaces, and providing top and bottom sealing l

[ What is claimed is:] [1.]1. A method of encapsulating a plurality of microelectronic assemblies having oppositely-facing top and bottom surfaces comprising the steps of:(a) providing said assemblies within an opening in a frame having top and bottom surfaces, and providing top and bottom sealing layers sealingly connected to the frame extending across the opening of the frame, said top and bottom sealing layers defining an enclosed space encompassing said assemblies;(b) engaging the frame, sealing layers and assemblies between top and bottom fixture elements; and(c) injecting a liquid encapsulant between the sealing layers and around the assemblies while the frame, sealing layer and assemblies are engaged between the top and bottom fixture elements, said sealing layers and frame containing the liquid encapsulant; and(d) curing the liquid encapsulant.