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Passive electronic parts, IC parts, and wafer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/12
  • H01L-023/15
  • H05K-001/03
  • H05I-001/00
  • H03T-007/00
출원번호 US-0147852 (1999-03-22)
우선권정보 JPX, 19970416, 9-099448
국제출원번호 PCT/JP97/03365 (1997-09-22)
§371/§102 date 19990322 (19990322)
국제공개번호 WO-9812744 (1998-03-26)
발명자 / 주소
  • Hayashi Katsuhiko,JPX
출원인 / 주소
  • TDK Corporation, JPX
대리인 / 주소
    Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
인용정보 피인용 횟수 : 48  인용 특허 : 24

초록 ▼

Passive electronic parts containing a substrate (1) and a passive circuit (2). The substrate (1) has an inorganic insulating layer (11) composed of a mixture of a ceramic component and glass component. The passive circuit (2) is composed of a conductor pattern in general and provided on one surface

대표청구항 ▼

[ What is claimed is:] [1.]1. A passive electronic part comprising:a substrate having an inorganic insulating layer comprising a mixture of a ceramic material and a glass material throughout the inorganic insulating layer, said inorganic insulating layer having a polished surface; anda passive circu

이 특허에 인용된 특허 (24)

  1. Knight Thomas F. (Belmont MA) Salzman David B. (Washington DC), Apparatus for non-conductively interconnecting integrated circuits using half capacitors.
    상세보기
  2. Nakatani Seiichi,JPX ; Hirano Kouichi,JPX, Circuit component built-in module and method for producing the same.
    상세보기
  3. Ahn Chong H. ; Sadler Daniel J. ; Zhang Wenjin, Electromagnetically driven microactuated device and method of making the same.
    상세보기
  4. Fukuoka Yoshitaka (Kawasaki JPX), Electronic apparatus.
    상세보기
  5. Spinelli, Thomas S.; Manns, William G.; Weirauch, Donald F., Electronic circuit interconnection system.
    상세보기
  6. Wojnarowski Robert John, Electronic device pad relocation, precision placement, and packaging in arrays.
    상세보기
  7. Onishi Keiji,JPX ; Iwaki Hideki,JPX ; Seki Shun-ichi,JPX ; Taguchi Yutaka,JPX ; Shiraishi Tsukasa,JPX ; Bessho Yoshihiro,JPX ; Kawasaki Osamu,JPX ; Eda Kazuo,JPX, Electronic part and a method of production thereof.
    상세보기
  8. Fillion Raymond A. (Niskayuna NY) Woinarowski Robert J. (Ballston Lake NY) Gdula Michael (Knox NY) Cole Herbert S. (Burnt Hills NY) Wildi Eric J. (Niskayuna NY) Daum Wolfgang (Schenectady NY), Embedded substrate for integrated circuit modules.
    상세보기
  9. Beall George H. (Big Flats NY) Pinckney Linda R. (Corning NY), Fine-grained glass-ceramics.
    상세보기
  10. Ohya Kazuyuki,JPX ; Sayama Norio,JPX, Metal-foil-clad composite ceramic board and process for the production thereof.
    상세보기
  11. Gonzales ; Jr. Frank (Poughkeepsie NY) Sobon Joseph (New Paltz NY), Method of forming a ceramic article with a glassy surface.
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  12. Beall George H. ; Chyung Kenneth ; Pierson Joseph E., Methods of making negative thermal expansion glass-ceramic and articles made thereby.
    상세보기
  13. Dohya Akihiro (El Cerrito CA), Module having a ceramic multi-layer substrate and a multi-layer circuit thereupon, and process for manufacturing the sam.
    상세보기
  14. Onyskevych Lubomyr Stephen ; Cherukuri Satyam C. ; Prabhu Ashok Narayan ; Yoc.o slashed.m P. Neil ; Salsman Kenneth E., Mounting structure for a tessellated electronic display having a multilayer ceramic structure and tessellated electron.
    상세보기
  15. Fukuoka Yoshitaka,JPX, Multi-chip module, an electronic device, and production method thereof.
    상세보기
  16. Miura Taro (Tokyo JPX) Kobayashi Makoto (Chiba JPX) Suzuki Kazuaki (Chiba JPX) Fujii Tadao (Chiba JPX), Multi-layer microwave circulator.
    상세보기
  17. Pace Benedict G, Package for power semiconductor chips.
    상세보기
  18. Dohya Akihiro (El Cerrito CA), Process for manufacturing a ceramic multi-layer substrate.
    상세보기
  19. Dickinson ; Jr. James E. ; Wheaton Bryan R., Processes for polishing glass and glass-ceramic surfaces using excimer laser radiation.
    상세보기
  20. Carter Kenneth Raymond ; Hawker Craig Jon ; Hedrick James Lupton ; Miller Robert Dennis ; Gaynes Michael Anthony ; Buchwalter Stephen Leslie, Reworkable thermoplastic hyper-branched encapsulant.
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  21. Annacone William R. (52 Rockview Rd. Southport CT 06490) Felis Kenneth P. (150 Gay Bowers Rd. Fairfield CT 06430) Speliotis Dennis E. (22 Ingleside Rd. Lexington MA 02173), Rigid disc substrate comprising a central hard core substrate with a hard, thermally and mechanically matched overlying.
    상세보기
  22. Hsiao Richard (Vestal NY) McCreary Jack M. (Apalachin NY) Markovich Voya R. (Endwell NY) Seraphim Donald P. (Vestal NY), Solder interconnection structure on organic substrates and process for making.
    상세보기
  23. Hayes George T. (Pleasanton CA) Brydon Louis B. (San Carlos CA), Spacecraft antenna reflectors and stowage and restraint system therefor.
    상세보기
  24. Iida Naoki,JPX ; Uchiyama Kazuyoshi,JPX ; Matsuta Katsuji,JPX ; Kawaguchi Masahiko,JPX, Variable inductor device.
    상세보기

이 특허를 인용한 특허 (48)

  1. Burtzlaff,Robert; Haba,Belgacem; Humpston,Giles; Tuckerman,David B.; Warner,Michael; Mitchell,Craig S., Back-face and edge interconnects for lidded package.
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  2. Hardin, Keith Bryan, Ball grid array systems for surface mounting an integrated circuit using a Z-directed printed circuit board component.
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  3. Hardin, Keith Bryan; Kratzer, Zachary Charles Nathan; Zhang, Qing, Continuous extrusion method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board.
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  4. Hardin, Keith Bryan, Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board.
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  5. Hall, Paul Kevin; Hardin, Keith Bryan; Kratzer, Zachary Charles Nathan; Zhang, Qing, Die press process for manufacturing a Z-directed component for a printed circuit board.
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  6. Wozniak, Uwe; Feichtinger, Thomas; Gruenbichler, Hermann; Dudesek, Pavol; Puerstinger, Thomas, Electrical component.
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  7. Emma,Philip G.; Zingher,Arthur R., Electronic substrate with inboard terminal array, perimeter terminal array and exterior terminal array on a second surface and module and system including the substrate.
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  8. Hardin, Keith Bryan, Extrusion process for manufacturing a Z-directed component for a printed circuit board.
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  9. Beroz,Masud; Warner,Michael; Smith,Lee; Urbish,Glenn; Kang,Teck Gyu; Park,Jae M.; Kubota,Yoichi, High frequency chip packages with connecting elements.
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  10. Lin, Mou-Shiung, High performance system-on-chip discrete components using post passivation process.
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  11. Lin, Mou-Shiung, High performance system-on-chip discrete components using post passivation process.
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  12. Lin, Mou-Shiung, High performance system-on-chip inductor using post passivation process.
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  13. Warner, Michael, High-frequency chip packages.
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  14. Warner, Michael, High-frequency chip packages.
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  15. Warner,Michael; Smith,Lee; Haba,Belgacem; Urbish,Glenn; Beroz,Masud; Kang,Teck Gyu, High-frequency chip packages.
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  16. Sakamoto,Noriaki; Kobayashi,Yoshiyuki; Sakamoto,Junji; Mashimo,Shigeaki; Okawa,Katsumi; Maehara,Eiju; Takahashi,Kouji, Hybrid integrated circuit device.
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  17. Lin, Wen-Hsin; Wang, Fa-Tai, Image sensing component package and manufacture method thereof.
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  18. Naoya Mori JP; Osamu Chikagawa JP, Insulating ceramic, multilayer ceramic substrate, ceramic electronic parts and laminated ceramic electronic parts.
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  19. Osamu Chikagawa JP; Naoya Mori JP, Insulator ceramic composition.
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  20. Chee,Soon Shin; Lin,Ann Chiuchin, Integrated circuit package with improved return loss.
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  21. Dornbusch, Andrew W.; Thompson, Charles D., Integrated circuit suitable for use in radio receivers.
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  22. Matsushita, Yosuke; Miyamoto, Masashi, Laminated filter.
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  23. Miks, Jeffrey Alan; Kaskoun, Kenneth; Liebhard, Markus; Foster, Donald Craig; Hoffman, Paul Robert; Bertholio, Frederic, Lead-frame method and assembly for interconnecting circuits within a circuit module.
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  24. Haba, Belgacem; Kubota, Yoichi, Manufacture of mountable capped chips.
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  25. Lin, Mou-Shiung; Lee, Jin-Yuan, Method for making high-performance RF integrated circuits.
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  26. Lin, Mou-Shiung; Lee, Jin-Yuan, Method for making high-performance RF integrated circuits.
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  27. Zilber, Gil; Katraro, Reuven; Aksenton, Julia; Oganesian, Vage, Methods and apparatus for packaging integrated circuit devices.
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  28. Zilber,Gil; Aksenton,Julia; Oganesian,Vage, Methods and apparatus for packaging integrated circuit devices.
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  29. Zilber,Gil; Aksenton,Julia; Oganesian,Vage, Methods and apparatus for packaging integrated circuit devices.
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  30. Zilber,Gil; Katraro,Reuven; Aksenton,Julia; Oganesian,Vage, Methods and apparatus for packaging integrated circuit devices.
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  31. Warner,Michael; Haba,Belgacem; Beroz,Masud, Microelectronic assemblies incorporating inductors.
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  32. Nystrom, Michael J.; Humpston, Giles, Microelectronic assembly with multi-layer support structure.
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  33. Nystrom, Michael J.; Humpston, Giles, Microelectronic assembly with multi-layer support structure.
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  34. Chee, Soon-Shin; Lin, Ann Chiuchin, Packaged integrated circuit.
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  35. Hardin, Keith Bryan; Hall, Paul Kevin; Kratzer, Zachary Charles Nathan; Zhang, Qing, Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material.
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  36. Hall, Paul Kevin; Hardin, Keith Bryan; Kratzer, Zachary Charles Nathan; Zhang, Qing, Screening process for manufacturing a Z-directed component for a printed circuit board.
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  37. Sakamoto,Noriaki; Kobayashi,Yoshiyuki; Sakamoto,Junji; Mashimo,Shigeaki; Okawa,Katsumi; Maehara,Eiju; Takahashi,Kouji, Semiconductor device and semiconductor module.
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  38. Iwakiri, Toshihiko, Semiconductor device having a die pad supported by a die pad supporter.
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  39. Yen, Hsiao-Tsung; Lin, Yu-Ling; Kuo, Chin-Wei; Chen, Ho-Hsiang; Jou, Chewn-Pu; Jeng, Min-Chie, Semiconductor structure.
    상세보기
  40. Honer, Kenneth Allen, Sequential fabrication of vertical conductive interconnects in capped chips.
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  41. Hall, Paul Kevin; Hardin, Keith Bryan; Kratzer, Zachary Charles Nathan; Zhang, Qing, Spin coat process for manufacturing a Z-directed component for a printed circuit board.
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  42. Iida, Naoki; Kawaguchi, Masahiko, Three-terminal variable inductor and method of making the same.
    상세보기
  43. Naoki Iida JP; Masahiko Kawaguchi JP, Variable inductance element.
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  44. Hardin, Keith Bryan; Fessler, John Thomas; Hall, Paul Kevin; Nally, Brian Lee; Oglesbee, Robert Aaron, Z-directed delay line components for printed circuit boards.
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  45. Hardin, Keith Bryan; Fessler, John Thomas; Hall, Paul Kevin; Nally, Brian Lee; Oglesbee, Robert Aaron, Z-directed pass-through components for printed circuit boards.
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  46. Hardin, Keith Bryan, Z-directed printed circuit board components having conductive channels for controlling transmission line impedance.
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  47. Hardin, Keith Bryan, Z-directed printed circuit board components having conductive channels for reducing radiated emissions.
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  48. Hardin, Keith Bryan, Z-directed printed circuit board components having different dielectric regions.
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