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Methods and apparatus for thermally processing wafers 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-016/00
출원번호 US-0550888 (2000-04-17)
발명자 / 주소
  • Mezey
  • Sr. James J.
출원인 / 주소
  • Avansys, LLC
대리인 / 주소
    Williams
인용정보 피인용 횟수 : 30  인용 특허 : 35

초록

The apparatus provides a temperature controlled environment for processing semiconductor wafers at elevated temperatures. A hot wall process chamber is used for the process steps. The process chamber includes three zones with independent temperature control capabilities. The apparatus is capable of

대표청구항

[ What is claimed is:] [1.]1. An apparatus for thermally processing a semiconductor wafer, the apparatus comprising:a housing, the housing having a port for loading and unloading the wafer, the housing having a purge gas inlet port and a purge gas exit port for flowing a purge gas through the housin

이 특허에 인용된 특허 (35)

  1. Muraoka Yusuke (Hazukashi JPX) Tamada Atsushi (Hazukashi JPX) Sakai Takamasa (Tenjinkita JPX) Haibara Hitoshi (Hazukashi JPX) Nakagawa Keiji (Hazukashi JPX), Apparatus for heat-treating wafers.
  2. Muething Kevin A. (Lawrence Township ; Mercer County NJ), CVD apparatus.
  3. MacLeish Joseph H. ; Mailho Robert D., CVD reactor having heated process chamber within isolation chamber.
  4. McNeilly Michael A. (Saratoga CA) Benzing Walter C. (Saratoga CA), Chemical vapor deposition coating process employing radiant heat and a susceptor.
  5. Monkowski Joseph R. (Carlsbad CA) Logan Mark A. (Carlsbad CA), Chemical vapor deposition reactor and method of use thereof.
  6. Pearce Charles W. (Emmaus PA) Schmidt Paul F. (Allentown PA), Diffusion furnace.
  7. Ide Shigeaki (Kumamoto JPX), Furnace equipped with independently controllable heater elements for uniformly heating semiconductor wafers.
  8. Kitayama Hirofumi (Aiko-gun JPX) Shibata Toshimitu (Yokohama JPX) Miyaju Toshiaki (Tsukui-gun JPX) Miyagi Katsushin (Sagamihara JPX), Heat treating apparatus.
  9. Nakao Ken (Sagamihara JPX), Heat treatment apparatus.
  10. Imai Masayuki (Kofu JPX) Kurebayashi Takeshi (Yamanashi JPX), Heat treatment boat.
  11. Muka Richard S. (Topsfield MA), Heater assembly for thermal processing of a semiconductor wafer in a vacuum chamber.
  12. Sahoda Tsutomu (Kanagawa JPX) Mizuki Hideyuki (Kanagawa JPX) Miyamoto Hidenori (Kanagawa JPX) Hori Hisashi (Kanagawa JPX) Sago Hiroyoshi (Kanagawa JPX), Heating apparatus.
  13. Tanaka Susumu (Hachioji JPX), Heating apparatus.
  14. Taheri Ramtin (P.O. Box 4316 Santa Clara CA 95056), Heating chamber.
  15. Robinson McDonald (Paradise Valley AZ) Ozias Albert E. (Aumsville OR), Heating system for reaction chamber of chemical vapor deposition equipment.
  16. Robinson McDonald (Paradise Valley AZ) Ozias Albert E. (Aumsville OR), Heating system for substrates.
  17. Toole Monte M. (Mill Valley CA) Klein Raphael (Los Altos CA), High-pressure, high-temperature gaseous chemical apparatus.
  18. Yu Chorng-Tao (Placentia CA) Fisk Michael A. (Anaheim CA) Emami Alan (Huntington Beach CA), Hot wall diffusion furnace and method for operating the furnace.
  19. Uchiyama Taroh,JPX ; Yoshikawa Yukio,JPX ; Tsukamoto Takashi,JPX ; Nishihama Jiro,JPX, Low pressure CVD system.
  20. Lofgren Peter,SEX ; Gu Chun Yuan,SEX ; Hallin Christer,SEX ; Liu Yujing,SEX, Method and a device for epitaxial growth of objects by chemical vapor deposition.
  21. Kaltenbrunner Guenter,DEX ITX 85551 ; Knarr Thomas,DEX ITX 89179 ; Nenyei Zsolt,DEX ITX 89134, Method and apparatus for rapid thermal processing.
  22. Hauf Markus,DEX ; Knarr Thomas,DEX ; Walk Heinrich,DEX ; Balthasar Horst,DEX ; Muller Uwe,DEX, Method of measuring electromagnetic radiation.
  23. Yoo Woo Sik, Mini batch furnace.
  24. Goldsmith Forest S. (Newton MA) Waugh Arthur (Winchester MA), Movable core fast cool-down furnace.
  25. Schietinger Charles W. (Portland OR) Adams Bruce E. (Portland OR), Non-contact techniques for measuring temperature or radiation-heated objects.
  26. Logar Roger E. (San Jose CA), Particulate-free epitaxial process.
  27. McNeilly ; Michael A. ; Benzing ; Walter C. ; Locke ; Jr. ; Richard M., Process for preparing semiconductor wafers with substantially no crystallographic slip.
  28. Tay Sing Pin ; Hu Yao Zhi ; Wasserman Yuval, Process for preventing gas leaks in an atmospheric thermal processing chamber.
  29. Olsen Aage ; Halpin Michael W., Reflective surface for CVD reactor walls.
  30. Yu Chienfan (Highland Mills NY) Kotecki David E. (Hopewell Junction NY) Natzle Wesley C. (New Paltz NY), Sealed chamber with heating lamps provided within transparent tubes.
  31. Nishizawa, Jun-ichi; Ohmi, Tadahiro, Semiconductor fabricating apparatus.
  32. Fiory Anthony T. (Summit NJ), Semiconductor processing technique, including pyrometric measurement of radiantly heated bodies.
  33. Fiory Anthony T. (Summit NJ), Semiconductor processing technique, including pyrometric measurement of radiantly heated bodies and an apparatus for pra.
  34. Sajoto Talex ; Selyutin Leonid ; Ku Vincent ; Zhao Jun ; Dornfest Charles, Temperature controlled liner.
  35. Persyn Steven C., Vertical LPCVD furnace with reversible manifold collar and method of retrofitting same.

이 특허를 인용한 특허 (30)

  1. Tanimura, Hideaki; Matsuo, Kaoru; Fuse, Kazuhiko; Kato, Shinichi, Apparatus and method for light-irradiation heat treatment.
  2. Na, Heung-Yeol; Jeong, Min-Jae; Hong, Jong-Won; Kang, Eu-Gene; Chang, Seok-Rak; Lee, Ki-Yong; Seo, Jin-Wook; Yang, Tae-Hoon; Chung, Yun-Mo; So, Byung-Soo; Park, Byoung-Keon; Lee, Dong-Hyun; Lee, Kil-Won; Baek, Won-Bong; Park, Jong-Ryuk; Choi, Bo-Kyung; Maidanchuk, Ivan; Jung, Jae-Wan, Apparatus for thermally processing substrate.
  3. Cho, Seong-Joon; Cho, Hyun-Su, Chemical vapor deposition apparatus and method of manufacturing light-emitting diode device using the same.
  4. Gurary, Alex; Belousov, Mikhail; Mitrovic, Bojan, Chemical vapor deposition with elevated temperature gas injection.
  5. Gurary, Alex; Belousov, Mikhail; Mitrovic, Bojan, Chemical vapor deposition with elevated temperature gas injection.
  6. Gurary, Alexander I.; Belousov, Mikhail; Mitrovic, Bojan, Chemical vapor deposition with elevated temperature gas injection.
  7. Tran,Daniel, Compact pinlifter assembly integrated in wafer chuck.
  8. Ke-Wei Tung TW, Cooling system of chamber with removable liner.
  9. Fink,Steven T., Cylinder-based plasma processing system.
  10. Yamazaki, Shunpei; Murakami, Masakazu, Evaporation method, evaporation device and method of fabricating light emitting device.
  11. Morisaki, Eisuke; Kobayashi, Hirokatsu; Yoshikawa, Jun, Film deposition apparatus and method.
  12. Murayama,Hiromi; Kusuda,Tatsufumi, Heat treatment apparatus by means of light irradiation.
  13. Matsuura, Masanari; Oi, Sotaro; Kubota, Tomoyuki; Tsuruta, Masaya, Heating furnace and heating method employed by heating furnace.
  14. Sumakeris,Joseph John; Paisley,Michael James, Housing assembly for an induction heating device including liner or susceptor coating.
  15. Sumakeris, Joseph John; Paisley, Michael James, Induction heating devices and methods for controllably heating an article.
  16. Nasu, Yuichi; Katou, Hirotaka; Narahara, Kazuhiro; Matsunaga, Hideyuki, Method and apparatus for manufacturing semiconductor wafer.
  17. Chen, AiHua; Todaka, Ryoji; Yin, Gerald, Method and apparatus for processing semiconductor work pieces.
  18. Yamazaki, Shunpei; Murakami, Masakazu, Method of fabricating light emitting devices.
  19. Shimizu, Akira; Fukuda, Hideaki; Kawano, Baiei; Sato, Kazuo, Method of film deposition using single-wafer-processing type CVD.
  20. Sumakeris, Joseph John; Paisley, Michael James, Methods for controllably induction heating an article.
  21. Yarlagadda, Srinivas; Speciale, Natale; Preti, Franco; Preti, Mario, Reaction chamber of an epitaxial reactor and reactor that uses said chamber.
  22. Matsui, Hiroyuki; Matsuki, Hirohisa; Otake, Koki, Reflow apparatus, a reflow method, and a manufacturing method of a semiconductor device.
  23. Matsui, Hiroyuki; Matsuki, Hirohisa; Otake, Koki, Reflow apparatus, a reflow method, and a manufacturing method of semiconductor device.
  24. Emerson, David Todd; Garner, Robert Allen; Bergmann, Michael John; Brown, Keenan Carlyle; Pennington, Michael Allen; Coleman, Thomas Goldthwaite, Restricted radiated heating assembly for high temperature processing.
  25. Hawkins, Mark; Goodman, Matthew G.; Jacobs, Loren, Substrate holder with deep annular groove to prevent edge heat loss.
  26. Yonemizu, Akira; Kojima, Shigeyoshi, Substrate processing apparatus and substrate processing method.
  27. Hirochi, Yukitomo; Tanaka, Akinori; Sato, Akihiro; Itoh, Takeshi; Hara, Daisuke; Shirako, Kenji; Morimitsu, Kazuhiro; Fukuda, Masanao, Substrate processing apparatus including shielding unit for suppressing leakage of magnetic field.
  28. Nakashima, Seiyo; Yamada, Tomoyuki; Shimada, Masakazu, Substrate processing apparatus, method for manufacturing semiconductor device, and process tube.
  29. Colvin, Ronald L.; Goodwin, Sr., Dennis; Mittendorf, Jeff; Moretti, Charles J.; Rose, John W.; Samuels, Earl Blake, Substrate processing apparatuses and systems.
  30. Chen, Shih-Yen; Shieh, Tzi-Yi; Chang, Yuh-Sen; Lee, Chung-Li, Tool and method of reflow.
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