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Tantalum sputtering target with fine grains and uniform texture and method of manufacture 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-014/34
출원번호 US-0497079 (2000-02-02)
발명자 / 주소
  • Turner Stephen P.
출원인 / 주소
  • Honeywell International Inc.
대리인 / 주소
    Wells St. John, P.S.
인용정보 피인용 횟수 : 59  인용 특허 : 27

초록 ▼

A method for producing a tantalum sputtering component includes a minimum of three stages each of which include a deformation step followed by an inert atmosphere high-temperature anneal. Temperatures of each of the anneal steps can be different from one another. A tantalum sputtering component incl

대표청구항

[ What is claimed is:] [4.]4. A tantalum sputtering component comprising a mean grain size of less than about 50 microns and a uniform texture that is predominately {111} throughout a thickness of the component.

이 특허에 인용된 특허 (27)

  1. Pouliquen Benoit (Spokane WA), Aluminum target for magnetron sputtering and method of making same.
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  2. Segal Vladimir (Bryan TX) Goforth Ramon E. (College Station TX) Hartwig K. Ted (College Station TX), Apparatus and method for deformation processing of metals, ceramics, plastics and other materials.
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  3. Dimigen Heinz (Hamburg DEX) Hbsch Hubertus (Hamburg DEX), Carbon-containing sliding layer.
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  4. Lum Andrew F. (La Mirada CA) Uribe Juan M. (Valinda CA) Hogan John M. (Long Beach CA) Persinger Richard A. (Winfield IL) Miller James F. (Rowland Heights CA) Navaratnam Ramesh A. (Plainfield IL), Carrier-free metalworking lubricant and method of making and using same.
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  5. Fang Que-Tsang (Murrysville PA) Kinosz Michael J. (Apollo PA), Fine grain casting by mechanical stirring.
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  6. Sawada Susumu,JPX ; Fukuyo Hideaki,JPX ; Nagasawa Masaru,JPX, High purity titanium sputtering targets.
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  7. Segal Vladimir (15719 E. Fourth Ave. #90 Veradale WA 99037), Method and apparatus for forming thin parts of large length and width.
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  8. Amato Richard A. (Cincinnati OH) Woodfield Andrew P. (Fairfield OH) Gigliotti ; Jr. Michael F. X. (Scotia NY) Hughes John R. (Scotia NY) Perocchi Lee C. (Schenectady NY), Method for developing enhanced texture in titanium alloys, and articles made thereby.
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  9. Lo Chi-Fung ; Draper Darryl, Method for fabricating randomly oriented aluminum alloy sputting targets with fine grains and fine precipitates.
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  10. Sata Nobuhiro (Sendai JPX), Method for reactive preparation of a shaped body of inorganic compound of metal.
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  11. Segal Vladimir (1831-A Wild Oak Cir. Bryan TX 77802) Segal Leonid (1831-A Wild Oak Cir. Bryan TX 77802), Method of and apparatus for processing tungsten heavy alloys for kinetic energy penetrators.
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  12. Segal Vladimir (1831A Wild Oak Cir. Bryan TX 77802), Plastic deformation of crystalline materials.
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  13. Kinoshita Makoto (Sanda JPX) Tamura Jun (Sanda JPX) Morikawa Masaki (Sanda JPX) Kishida Kunio (Tokyo JPX) Ishii Toshinori (Sanda JPX) Mishima Akifumi (Sanda JPX), Platinum-cobalt alloy sputtering target and method for manufacturing same.
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  14. Shaw Karl G. (Troy NY) Alman David E. (Troy NY) Cooper RenM. (Ballston Spa NY) German Randall M. (State College PA) McCoy Kazuo P. (Troy NY), Process for making finely divided intermetallic.
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  15. Shaw Karl G. (Spring Avenue Extension Troy NY 12180) Alman David E. (212 River St. ; Apt. #3 Troy NY 12180) Cooper ReneM. (70 Frederick St. Ballston Spa NY 12020) German Randall M. (1145 Outer Dr. St, Process for producing finely divided intermetallic and ceramic powders and products thereof.
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  16. Oikawa Hideo (Atsugi JPX) Amazawa Takao (Atsugi JPX) Honma Nakahachiro (Musashino JPX) Miyazaki Hideo (Toda JPX) Kyono Iwao (Toda JPX) Mori Nobuyuki (Tokyo JPX) Katoh Yoshiharu (Toda JPX) Kuroki Masa, Process for producing high-purity metal targets for LSI electrodes.
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  17. German Randall M. (Latham NY) Bose Animesh (Troy NY) Sims David (Bonners Ferry ID), Production of reactive sintered nickel aluminide material.
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  18. Parent Edward D. (Hamilton MA) Purinton Charles S. (Byfield MA) Sutter Charles W. (Spanaway WA), Refractory metal silicide sputtering target.
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  19. Fukasawa Yoshiharu (Yokohama JPX) Kawai Mituo (Yokohama JPX) Ishihara Hideo (Yokohama JPX) Yamanobe Takashi (Yokohama JPX), Sputtering target.
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  20. Satou Michio (Kanagawa JPX) Yamanobe Takashi (Kanagawa JPX) Ishigami Takashi (Kanagawa JPX) Kawai Mituo (Kanagawa JPX) Yagi Noriaki (Kanagawa JPX) Maki Toshihiro (Kanagawa JPX) Obata Minoru (Tokyo JP, Sputtering target and method of manufacturing the same.
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  21. Satou Michio (Yokohama JPX) Yamanobe Takasi (Yokohama JPX) Kawai Mituo (Yokohama JPX) Komatu Tooru (Yokosuka JPX) Shizu Hiromi (Fujisawa JPX) Yagi Noriaki (Yokohama JPX), Sputtering target and method of manufacturing the same.
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  22. Ohhashi Tateo (Kitaibaraka JPX) Fukuyo Hideaki (Kitaibaraka JPX) Sawamura Ichiroh (Kitaibaraka JPX) Nakamura Kenichirou (Kitaibaraka JPX) Fukushima Atsushi (Kitaibaraka JPX) Nagasawa Masaru (Kitaibar, Sputtering target assembly having solid-phase bonded interface.
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  23. Dunlop John A. (Veradale WA) Yuan Jun (Santa Clara CA) Kardokus Janine K. (Otis Orchards WA) Emigh Roger A. (Post Falls ID), Sputtering target with ultra-fine, oriented grains and method of making same.
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  24. Dunlop John Alden ; Yuan Jun ; Kardokus Janine Kiyabu ; Emigh Roger Alan, Sputtering target with ultra-fine, oriented grains and method of making same.
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  25. Dunlop John Alden ; Yuan Jun ; Kardokus Janine Kiyabu ; Emigh Roger Alan, Sputtering target with ultra-fine, oriented grains and method of making same.
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  26. Liu Yinshi, Titanium sputtering target.
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  27. Murata Hideo,JPX ; Taniguchi Shigeru,JPX, Titanium target for sputtering and production method for same.
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  3. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
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  4. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
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  5. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
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  6. Miller, Steven A.; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom.
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  7. Kumar, Prabhat; Wood, Charles; Rozak, Gary; Miller, Steven A.; Zeman, Glen; Wu, Rong-Chein Richard, High density refractory metals and alloys sputtering targets.
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  8. Michaluk, Christopher A.; Huber, Louis E.; Kawchak, Mark N.; Maguire, Jr., James D., High purity tantalum, products containing the same, and methods of making the same.
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  9. Michaluk, Christopher A.; Huber, Louis E.; Kawchak, Mark N.; Maguire, Jr., James D., High purity tantalum, products containing the same, and methods of making the same.
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  10. Michaluk,Christopher A.; Huber,Louis E.; Kawchak,Mark N.; Maguire, Jr.,James D., High purity tantalum, products containing the same, and methods of making the same.
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  11. Dary, Francois-Charles; Gaydos, Mark; Loewenthal, William; Miller, Steven A.; Rozak, Gary; Volchko, Scott Jeffrey; Zimmermann, Stefan; Stawovy, Michael Thomas, Large-area sputtering targets.
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  12. Miller, Steven A.; Kumar, Prabhat, Low-energy method of manufacturing bulk metallic structures with submicron grain sizes.
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  13. Kardokus, Janine K.; Pinter, Michael; Payton, Michael D.; Wu, Steven (Chi Tse); Akins, Jared; Hort, Werner, Manufacturing design and processing methods and apparatus for sputtering targets.
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  14. Zimmermann, Stefan; Papp, Uwe; Kreye, Heinrich; Schmidt, Tobias, Method for coating a substrate surface and coated product.
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  15. Michaluk, Christopher A., Method of forming metal blanks for sputtering targets.
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  16. Spreckelsen,Eric Von; Michaluk,Christopher A.; Ford,Robert B., Method of forming sputtering articles by multidirectional deformation.
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  17. Bozkaya, Dincer; Jepson, Peter R., Methods and apparatus for controlling texture of plates and sheets by tilt rolling.
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  18. Miller, Steven A.; Schmidt-Park, Olaf; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmermann, Stefan, Methods of forming sputtering targets.
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  19. Miller, Steven A.; Shekhter, Leonid N.; Zimmerman, Stefan, Methods of joining metallic protective layers.
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  20. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
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  22. Miller, Steven A.; Shekhter, Leonid N.; Zimmerman, Stefan, Methods of joining protective metal-clad structures.
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  23. Volchko, Scott Jeffrey; Zimmermann, Stefan; Miller, Steven A.; Stawovy, Michael Thomas, Methods of manufacturing high-strength large-area sputtering targets.
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  24. Loewenthal, William; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets.
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  25. Miller, Steven A.; Dary, Francois-Charles; Gaydos, Mark; Rozak, Gary, Methods of manufacturing large-area sputtering targets by cold spray.
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  26. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
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  27. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
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  28. Carpenter, Craig M.; Maguire, Jr., James D., Methods of producing deformed metal articles.
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  29. Carpenter, Craig M.; Maguire, Jr., James D., Methods of producing deformed metal articles.
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  30. Miller, Steven A.; Kumar, Prabhat; Wu, Rong-chein Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Methods of rejuvenating sputtering targets.
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  31. Miller, Steven A.; Schmidt-Park, Olaf; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmerman, Stefan, Methods of rejuvenating sputtering targets.
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  32. Shekhter, Leonid N.; Miller, Steven A.; Haywiser, Leah F.; Wu, Rong-Chein R., Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof.
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  33. Shekhter, Leonid N.; Miller, Steven A.; Haywiser, Leah F.; Wu, Rong-Chein Richard, Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof.
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  34. Miller, Steven A.; Shekhter, Leonid N.; Zimmerman, Stefan, Protective metal-clad structures.
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  35. Jepson, Peter R.; Bozkaya, Dincer, Refractory metal plates.
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  36. Jepson, Peter R.; Bozkaya, Dincer, Refractory metal plates with improved uniformity of texture.
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  37. Jepson, Peter R., Refractory metal pots.
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  38. Jepson, Peter R., Refractory metal pots.
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  39. Matera, John P.; Ford, Robert B.; Wickersham, Jr., Charles E., Sputter targets and methods of forming same by rotary axial forging.
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  40. Matera, John P.; Ford, Robert B.; Wickersham, Jr., Charles E., Sputter targets and methods of forming same by rotary axial forging.
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  41. Miyashita, Hirohito, Sputtering target.
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  42. Oda, Kunihiro; Fukushima, Atsushi, Sputtering target.
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  43. Oda, Kunihiro, Ta sputtering target and method for preparation thereof.
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  44. Michaluk, Christopher A., Tantalum and niobium billets and methods of producing the same.
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  45. Michaluk,Christopher A., Tantalum and niobium billets and methods of producing the same.
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  46. Fukushima, Atsushi; Oda, Kunihiro; Senda, Shinichiro, Tantalum sputtering target.
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  47. Oda, Kunihiro, Tantalum sputtering target.
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  48. Senda, Shinichiro; Fukushima, Atsushi, Tantalum sputtering target.
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  49. Oda, Kunihiro, Tantalum sputtering target and method for preparation thereof.
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  50. Oda, Kunihiro, Tantalum sputtering target and method for preparation thereof.
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  52. Rosenberg, Harry; Ozturk, Bahri; Wang, Guangxin; LaRue, Wesley, Tantalum sputtering target and method of manufacture.
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  53. Rosenberg, Harry; Ozturk, Bahri; Wang, Guangxin; LaRue, Wesley, Tantalum sputtering target and method of manufacture.
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  54. Rosenberg, Harry; Ozturk, Bahri; Wang, Guangxin; LaRue, Wesley, Tantalum sputtering target and method of manufacture.
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  58. Koenigsmann, Holger J.; Gilman, Paul S., Textured-grain-powder metallurgy tantalum sputter target.
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  59. Koenigsmann,Holger J.; Gilman,Paul S., Textured-grain-powder metallurgy tantalum sputter target.
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