초록 ▼

A method of manufacturing semiconductor devices using an improved chemical mechanical planarization process for the planarization of the surfaces of the wafer on which the semiconductor devices are formed. The improved chemical mechanical planarization process includes the formation of a flat planar

A method of manufacturing semiconductor devices using an improved chemical mechanical planarization process for the planarization of the surfaces of the wafer on which the semiconductor devices are formed. The improved chemical mechanical planarization process includes the formation of a flat planar surface from a deformable coating on the surface of the wafer filling in between the surface irregularities prior to the planarization of the surface through a chemical mechanical planarization process.

대표청구항 ▼

[ What is claimed is:] [1.]1. A method for planarizing a non-planar film surface of a wafer, said method comprising the steps of:providing a wafer;coating said surface of said wafer with a deformable material;contacting the deformable material with an object;forming a substantially flat planar surfa

[ What is claimed is:] [1.]1. A method for planarizing a non-planar film surface of a wafer, said method comprising the steps of:providing a wafer;coating said surface of said wafer with a deformable material;contacting the deformable material with an object;forming a substantially flat planar surface on said non-planar film surface of said wafer;performing one of group of curing, hardening, and solidifying the deformable material while the object is contacting the deformable material; andplanarizing said wafer using a chemical mechanical planarization process.