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Aerosol substrate cleaner 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-003/02
출원번호 US-0000518 (1997-12-30)
발명자 / 주소
  • Fishkin Boris
  • Brown Kyle A.
인용정보 피인용 횟수 : 24  인용 특허 : 47

초록

An apparatus for cleaning a substrate includes a source of pressurized carrier gas and a body of cleaning agent in liquid form. A first conduit directs the pressurized carrier gas from the carrier gas source to the body of cleaning agent. A second conduit carries a flow of the carrier gas away from

대표청구항

[ What is claimed is:] [1.]1. An apparatus for cleaning a semiconductor substrate, comprising:a source of pressurized carrier gas;a supply of liquid cleaning solution containing a cleaning agent;a first line that directs the pressurized carrier gas through the liquid cleaning solution to generate a

이 특허에 인용된 특허 (47)

  1. Srikrishnan Kris V. (Wappingers Falls NY) Wu Jin J. (Ossining NY), Aerosol cleaning method.
  2. Birang Manoocher ; Pyatigorsky Grigory, Apparatus and method for in-situ monitoring of chemical mechanical polishing operations.
  3. Ketchum Jeffrey M. (Austin TX), Apparatus and method for removing deposits from an APCVD system.
  4. Lee Je-cheol,KRX ; Kim Byung-jin,KRX, Apparatus for cleaning semiconductor wafers.
  5. Giffin James W. (4653 Columbia River Ct. San Jose CA 95136) De Santis Michael A. (3116 Penetencia Creek Rd. San Jose CA 95132) Burchard John S. (630 Dorrance Rd. Boulder Creek CA 95006), Apparatus for in-situ processing of photoplates.
  6. Williford ; Jr. John F. (7155 N.E. 126th St. Kirkland WA 98034), Apparatus for removing particulate matter.
  7. Stanasolovich David (Montgomery NY) Syverson William A. (Colchester VT) Warren Ronald A. (Troy NY), Apparatus for uniform cleaning of wafers using megasonic energy.
  8. Breunsbach Rex (Clackamas OR) Austen Paul M. (Milwaukie OR), Apparatus to clean printed circuit boards.
  9. O\Boyle Martin Patrick (Peekskill NY) Panner John Charles (Underhill VT) Sandwick Thomas Edwin (Hopewell Junction NY) van Kessel Theodore Gerard (Millbrook NY) Wickramasinghe Hemantha Kumar (Chappaqu, Assembly and method for making in process thin film thickness measurments.
  10. Miyazaki Takanori (Kumamoto JPX) Sakurai Hiroshi (Kumamoto JPX), Cleaning apparatus.
  11. Mori Shinichi (27-52 ; Kinugawa 1-chome Otsu-shi ; Shiga JPX) Nomura Tomohiro (1-1-10 ; Tsukamoto Yodogawa-ku ; Osaka-shi ; Osaka JPX), Cleaning process.
  12. Page John K. R. (Camberley GBX) Kalthod Dilip G. (St. Louis MO), Control of dissolved gases in liquids.
  13. Yoneda Kenji,JPX, Equipment for cleaning, etching and drying semiconductor wafer and its using method.
  14. Birang Manoocher ; Gleason Allan ; Guthrie William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.
  15. Chang Shih-chih (2339 Davison Ave. Richland WA 99352), Gas-liquid reaction method and apparatus.
  16. Jon Min-Chung (Princeton Junction NJ) Nicholl Hugh (Berthoud CO) Read Peter Hartpence (Morrisville PA), Method and apparatus for CO2 cleaning with mitigated ESD.
  17. Petvai Steve I. ; Bohnenkamp Leslie Jane ; Buet Michael P., Method and apparatus for decomposition of silicon oxide layers for impurity analysis of silicon wafers.
  18. Sandhu Gurtej Singh (Boise ID), Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers.
  19. Pickering Raymond E. (Vassalboro ME) Waitkus Patricia E. (Rockport MA) Parsons Delmar R. (Greenfield MA) Soule Lincoln (Wendell MA) Walker William T. (South Deerfield MA) Bedaw Robert E. (Turner Fall, Method and apparatus for the aqueous cleaning of populated printed circuit boards.
  20. Aoki Hidemitsu (Tokyo JPX) Nakajima Tsutomu (Tokyo JPX), Method and apparatus for wet treatment of solid surfaces.
  21. Griswold Bradley L. (1662 Westhaven Dr. San Jose CA 95132) Husain Syed A. (2022 Stratford Dr. Milpitas CA 95035), Method for low pressure rinsing and drying in a process chamber.
  22. Clark R. Scot (Fallbrook CA) Davison John B. (Laguna Hills CA) Persichini David W. (Oceanside CA) Yuan Wallace I. (Irvine CA) Lipisko Bruce A. (Encinitas CA) Jones Alan W. (Mountain View CA) Jones ; , Method for making ultrapure sulfuric acid.
  23. Suzuki Kuniyoshi (Fukushima-ken JPX), Method for rinsing wafers adhered with chemical liquid by use of purified water.
  24. Sakai Takamasa,JPX ; Hirae Sadao,JPX ; Matsunaga Minobu,JPX, Method of and apparatus for washing a substrate.
  25. Holzapfel Paul ; Schlueter James ; Karlsrud Chris ; Lin Warren, Methods and apparatus for detecting removal of thin film layers during planarization.
  26. Hoy Kenneth L. (St. Albans WV) Nielsen Kenneth A. (Charleston WV), Methods for cleaning apparatus using compressed fluids.
  27. Ferrell Gary W. ; Spencer Thomas D. ; Carter Rob E., Methods for drying and cleaning of objects using aerosols and inert gases.
  28. Bauer Tibor L. (Hopewell Junction NY) Cavaliere William A. (Verbank NY) Linnell David C. (Poughkeepsie NY) Wu Jin J. (Ossining NY), Nozzle apparatus for producing aerosol.
  29. Koos Daniel A. (Boise ID) Meikle Scott (Boise ID), Optical end point detection methods in semiconductor planarizing polishing processes.
  30. Dobson Joseph R. (Sterling Heights MI), Pallet cleaner.
  31. Takahashi Tsutomu (Yokohama JPX) Tohyama Keiichi (Kawasaki JPX) Takahashi Tamami (Yamato JPX), Polishing apparatus having endpoint detection device.
  32. Roberts John V. H. (Newark DE), Polishing pads.
  33. Bergman Eric J. (Kalispell MT) Reardon Timothy J. (Kalispell MT) Thompson Raymon F. (Lakeside MT) Owczarz Aleksander (Kalispell MT), Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization.
  34. Corliss Daniel A. (Leominster MA), Semiconductor wafer processing with across-wafer critical dimension monitoring using optical endpoint detection.
  35. Nafziger Charles P. (2445 E. Encanto Mesa AZ 85213), Single-chamber cleaning, rinsing and drying apparatus and method therefor.
  36. Menon Venugopal B. (Austin TX), Submicron particle removal using liquid nitrogen.
  37. Menon Venugopal B. (Austin TX), Submicron particle removal using liquid nitrogen.
  38. Sumnitsch Franz (Klagenfurt ATX), Support for slice-shaped articles and device for etching silicon wafers with such a support.
  39. McDermott Wayne T. (Allentown PA) Ockovic Richard C. (Allentown PA) Wu Jin J. (Ossining NY) Cooper Douglas W. (Millwood NY) Schwarz Alexander (Allentown PA) Wolfe Henry L. (Pleasant Valley NY), Surface cleaning using a cryogenic aerosol.
  40. Tamai Tadamoto (Tokyo JPX) Ikeya Yoichiro (Houya JPX), Surface cleaning with argon.
  41. Tanaka Masato (Shiga JPX), Surface treating apparatus and method using vapor.
  42. Lund Douglas E., System and method of automatically polishing semiconductor wafers.
  43. Liu Benjamin Y. H. (North Oaks MN) Ahn Kang H. (Minneapolis MN), System for surface and fluid cleaning.
  44. Mohindra Raj (Los Altos Hills CA) Bhushan Abhay (Palo Alto CA) Bhushan Rajiv (Mountain View CA) Puri Suraj (Los Altos CA) Anderson John H. (Milpitas CA) Nowell Jeffrey (San Francisco CA), Ultra-low particle semiconductor apparatus.
  45. Mohindra Raj ; Bhushan Abhay ; Bhushan Rajiv ; Puri Suraj ; Wong David, Ultra-low particle semiconductor cleaner using heated fluids.
  46. Kanno Itaru,JPX, Wafer cleaning apparatus.
  47. Tanaka Masato (Hikone JPX) Nishizawa Hisao (Hikone JPX) Hirai Nobuyuki (Hikone JPX) Shinbara Kaoru (Hikone JPX) Yoshioka Hitoshi (Hikone JPX), Wafer cleaning method and apparatus therefore.

이 특허를 인용한 특허 (24)

  1. Ko,Se Jong; Kim,Jung Gwan; Yoon,Cheol Nam; Lee,Jeong Ho, Apparatus for cleaning the edges of wafers.
  2. Collins, Jimmy D.; Cooper, Samuel A.; Eppes, James M.; Rose, Alan D.; Mekias, Kader, Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids.
  3. Collins, Jimmy D.; Cooper, Samuel A.; Eppes, James M.; Rose, Alan D.; Mekias, Kader, Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids.
  4. Collins, Jimmy D.; Cooper, Samuel A.; Eppes, James M.; Rose, Alan D.; Mekias, Kader, Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids.
  5. Collins, Jimmy D.; DeKraker, David P.; Gast, Tracy A.; Rose, Alan D., Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids.
  6. Collins, Jimmy D.; DeKraker, David; Gast, Tracy A.; Rose, Alan D., Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids.
  7. Rose, Alan D.; Carr, Darian D.; Eppes, James M.; Hanson, Stephen G., Compact duct system incorporating moveable and nestable baffles for use in tools used to process microelectronic workpieces with one or more treatment fluids.
  8. Gottenbos, Bart; Janssen, Jozef Johannes Maria; Jager, Marinus Karel Johannes; Cense, Adriaan Willem; Duineveld, Paulus Corenlis; Hayenga, Jon W.; Bryant, William E.; Dekker, Martijn Jeroen, Droplet jet system for cleansing.
  9. Suchecki, Tom, Engine drive system.
  10. Banerjee, Souvik; Chung, Harlan Forrest, Liquid-assisted cryogenic cleaning.
  11. Banerjee,Souvik; Chung,Harlan Forrest, Liquid-assisted cryogenic cleaning.
  12. Hong, Sukwon; Tran, Toan; Mallick, Abhijit; Liang, Jingmei; Ingle, Nitin K., Low shrinkage dielectric films.
  13. Chen, Kuo-Feng; Yu, Hsiu-Mei; Tseng, Charles; Lin, Ta-Yang, Method and apparatus for pretreating a substrate prior to electroplating.
  14. Collins, Jimmy D.; DeKraker, David P.; Gast, Tracy A.; Rose, Alan D., Method and apparatus for treating a workpiece with arrays of nozzles.
  15. Collins, Jimmy D.; DeKraker, David P.; Gast, Tracy A.; Rose, Alan D., Method and apparatus for treating a workpiece with arrays of nozzles.
  16. Collins, Jimmy D.; DeKraker, David P.; Gast, Tracy A.; Rose, Alan D., Method of removing liquid from a barrier structure.
  17. Bencher, Christopher Dennis; Luo, Lee, Methods and devices to reduce defects in dielectric stack structures.
  18. Vaupel, Mathias; Bernrieder, Sebastian; Koller, Adolf; Martens, Stefan, Separation of semiconductor devices from a wafer carrier.
  19. Okuda,Seiichiro; Sugimoto,Hiroaki; Kuroda,Takuya; Sato,Masanobu; Hirae,Sadao; Yasuda,Shuichi; Morinishi,Kenya; Imai,Masayoshi, Substrate processing apparatus.
  20. Martens, Stefan; Vaupel, Mathias, Testing process for semiconductor devices.
  21. Lauerhaas, Jeffrey M.; Collins, Jimmy D.; Gast, Tracy A.; Rose, Alan D., Tools and methods for processing microelectronic workpieces using process chamber designs that easily transition between open and closed modes of operation.
  22. Lauerhaas, Jeffrey M.; Collins, Jimmy D.; Gast, Tracy A.; Rose, Alan D., Tools and methods for processing microelectronic workpieces using process chamber designs that easily transition between open and closed modes of operation.
  23. Lauerhaas, Jeffrey M.; Collins, Jimmy D.; Gast, Tracy A.; Rose, Alan D., Tools and methods for processing microelectronic workpieces using process chamber designs that easily transition between open and closed modes of operation.
  24. Banerjee, Souvik; Chung, Harlan Forrest, Vapor-assisted cryogenic cleaning.
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