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Outside panel for an electronic device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H02B-001/04
  • H05K-007/20
출원번호 US-0241478 (1999-02-02)
우선권정보 JPX, 19980204, 10-023160
발명자 / 주소
  • Katsui Tadashi,JPX
  • Yamamoto Haruhiko,JPX
출원인 / 주소
  • Fujitsu Limited, JPX
대리인 / 주소
    Armstrong, Westerman, Hattori, McLeland & Naughton, LLP
인용정보 피인용 횟수 : 26  인용 특허 : 25

초록

To prevent an operator from being hurt by a hot outside panel of an electronic device when he touches the outside panel with his hand or a portion of his body, the outside panel is improved and an electronic device safe for the operator is provided. There are provided spaces for heat insulation in a

대표청구항

[ What is claimed is:] [1.]1. An electronic device, such as a notebook computer, an outside panel constructed of a single member body formed of high heat conduction resin material whose interior includes a plurality of integrally formed, parallelly disposed structural members which cooperate to form

이 특허에 인용된 특허 (25)

  1. Kociecki John, Card cage mounted power supply with heat dissipating architecture.
  2. Benson David K. (Golden CO) Potter Thomas F. (Denver CO), Compact vacuum insulation embodiments.
  3. Kondou Yoshihiro (Ibaraki JPX) Matsushima Hitoshi (Ryugasaki JPX) Hatada Toshio (Tsuchiura JPX) Inouye Hiroshi (Ibaraki JPX) Komatsu Toshihiro (Ibaraki JPX) Ohba Takao (Hadano JPX) Yamagiwa Akira (Ha, Cooling apparatus of electronic equipment.
  4. Haley Kevin ; O'Connor Michael ; Bhatia Rakesh, Cooling system for integrated circuit chips in a portable computer lid assembly.
  5. Hamid Lotfizadeh S., Disk drive test chamber.
  6. Howard Paul A. (Vienna VA) Durham James H. (Reston VA), Electrical cabinet with door-mounted heat exchanger.
  7. Chu Richard C. ; Chrysler Gregory M., Extended cooling for portable computers.
  8. Aakalu Nandakumar G. ; Cho Gihyun ; Costa Richard Sander ; Massa Peter J. ; Picot Walter J. ; Plaza Daniel, Heat dissipating structure for an electrical assembly.
  9. Aguilera Rafael E. (Simpsonville SC), Honeycomb celled-sheet layer composite panel for monitoring an LCD to a laptop computer.
  10. Mueller Lothar (Darmstadt DEX), Installation for several sound and/or heat emitting machines capable of being installed in a workroom.
  11. Hoyt Joshua K. (Woods Hole MA), Instrument for independently and kinetically measuring light transpassion through a plurality of samples.
  12. DeZurik Ted E. (2141 East Kenwood Dr. St. Paul MN 55117), Interior air conditioner cover.
  13. Nakajima Tadakatsu (Ibaraki JPX) Ohashi Shigeo (Tsuchiura JPX) Kuwahara Heikichi (Ibaraki JPX) Ashiwake Noriyuki (Tsuchiura JPX) Sato Motohiro (Ibaraki JPX) Hatsuda Toshio (Ibaraki JPX) Daikoku Takah, Liquid impingement cooling module for semiconductor devices.
  14. Steiner Ronald E. ; Chow Peter S., Long fin omni-directional heat sink.
  15. Kawamura Keizo,JPX ; Ashiwake Noriyuki,JPX ; Daikoku Takahiro,JPX ; Idei Akio,JPX ; Kasai Kenichi,JPX ; Kimura Hideyuki,JPX ; Nishihara Atsuo,JPX ; Hatada Toshio,JPX ; Sasaki Shigeyuki,JPX, Low thermal resistant, fluid-cooled semiconductor module.
  16. Bishop Eugene H. (Clemson SC) Liburdy James A. (Seneca SC) Figliola Richard S. (Central SC) Failla Gregory A. (Hauppauge NY), Method and apparatus for cooling a heat source.
  17. Mundinger David C. ; Worland D. Philip, Modular microchannel heat exchanger.
  18. Green Ross M. (Cambridge GB2) Kellaway Michael J. (Cambridge GB2) Shemmans David J. (Herts GB2) McShane David J. (Herts GB2), Mounting assembly for power semiconductors.
  19. Smith Grant M. (Bryn Athyn PA) Romania Samuel R. (Phoenixville PA) Gibbs Ronald T. (King of Prussia PA), Parallel-flow air system for cooling electronic equipment.
  20. Azar Kaveh, Plate fin heat exchanger having fluid control means.
  21. Kirchner ; Richard K. ; Andreadakis ; Nicholas Cleanthis ; Mayer ; Wil liam Norman, Portable keyboard/display terminal.
  22. Lee Ching-Pang (Cincinnati OH), Recuperative impingement cooling of jet engine components.
  23. Ashiwake Noriyuki,JPX ; Daikoku Takahiro,JPX ; Kasai Kenichi,JPX ; Kawamura Keizou,JPX ; Kimura Hideyuki,JPX ; Nishihara Atsuo,JPX ; Hatada Toshio,JPX ; Iino Toshiki,JPX, Semiconductor module.
  24. Kitano Junichi,JPX ; Shinya Hiroshi,JPX ; Katano Takayuki,JPX ; Yaegashi Hidetami,JPX ; Kawakami Yasunori,JPX ; Kawano Fumihiko,JPX, Substrate treating system and substrate treating method.
  25. Jondrow Timothy J., Thermal dissipation and EMI shielding structure for notebook computers.

이 특허를 인용한 특허 (26)

  1. Yu, Michelle; Lee, Ji Heun; Hayashida, Jeffrey, Apparatus related to a structure of a base portion of a computing device.
  2. MacDonald, Mark; McEuen, Shawn S., Apparatus, system and method for concealed venting thermal solution.
  3. Reber, David, Computer with door-mounted electronics.
  4. Reber, David; Garel, Michael, Computer with high intensity screen.
  5. Reber, David; Garel, Michael, Computer with high intensity screen.
  6. Reber, David; Garel, Michael, Computer with removable cartridge.
  7. Hayashida, Jeffrey, Computing device with heat spreader.
  8. Tanaka, Toshiyuki; Hata, Yukihiko, Cooling apparatus for electronic apparatus.
  9. Saito,Tomonori, Cooling system and projection-type image display apparatus using the same.
  10. Tanaka,Makoto, Electronic apparatus.
  11. Hata,Yukihiko; Tomioka,Kentaro; Tanimoto,Mitsuyoshi; Kusaka,Hiroyuki, Electronic apparatus having a heat-radiating unit for radiating heat of heat-generating components.
  12. Tsuji,Hiroyuki, Electronic apparatus with air cooling unit.
  13. Katsui, Tadashi; Yamamoto, Haruhiko, Electronic device.
  14. Fourie, Daniel, Graphite layer between carbon layers.
  15. Kim, Kyuwon; Jung, Jeeyoung; Park, Jongkil; Lee, Byungsu; Lee, Jiwoo, Heat dissipation apparatus and electronic device including the same.
  16. Hata, Yukihiko; Tomioka, Kentaro, Heat-Receiving apparatus and electronic equipment.
  17. Hata,Yukihiko; Tomioka,Kentaro, Heat-receiving apparatus and electronic equipment.
  18. Yang, Xiangyang; Jin, Linfang; Li, Hualin; Tang, Wenbing; Zou, Jie, Holder and mobile terminal.
  19. Kunz,Felix, Housing for a passively cooled computer.
  20. Hamburgen, William, Insulator module having structure enclosing atomspheric pressure gas.
  21. Manno, Vincent P.; Guarino, John R., Laminar air jet cooling of heat producing components.
  22. Tracy, Mark S.; Ashcraft, Britt C.; Lev, Jeffrey A.; Walker, Paul N., Laptop computer user thermal isolation apparatus.
  23. Ronzani, Peter A.; Wong, Andrew, Mobile computer.
  24. Tomioka,Kentaro; Hata,Yukihiko, Pump and electronic device having the pump.
  25. Hata,Yukihiko; Tomioka,Kentaro, Pump, electronic apparatus, and cooling system.
  26. Reber, David, System for mounting a display to a computer.
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