초록 ▼

A method and apparatus for fabricating and drying wafers, including micro-electro-mechanical system (MEMS) structures, in a second, supercritical processing fluid environment. The apparatus utilizes an inverted pressure vessel connected to a supercritical processing fluid supply and recover system,

A method and apparatus for fabricating and drying wafers, including micro-electro-mechanical system (MEMS) structures, in a second, supercritical processing fluid environment. The apparatus utilizes an inverted pressure vessel connected to a supercritical processing fluid supply and recover system, with an internal heat exchanger connected to external heating and cooling sources, which is closed with a vertically movable base plate. A wafer cassette configured for supporting multiple wafers is submerged in a first processing fluid within a container, which is installed on the base plate for insertion into the pressure vessel. Vessel inlet and outlet tubes extend vertically downward from the ceiling of the pressure vessel to nearly the base plate. Container inlet and outlet tubes extend vertically downward from the ceiling of the pressure vessel to inside the container and nearly to the bottom of the container. The tubes provide for displacement of the first processing fluid with the second processing fluid still in a liquid state, from which it is raised to supercritical state.

대표청구항 ▼

1. An apparatus for drying wafers in a supercritical environment, comprising:an inverted pressure vessel, a horizontal base plate, a wafer cassette configured for supporting at least one wafer for drying, a container sufficiently large to submerge said wafer cassette and said at least one wafer in a

1. An apparatus for drying wafers in a supercritical environment, comprising:an inverted pressure vessel, a horizontal base plate, a wafer cassette configured for supporting at least one wafer for drying, a container sufficiently large to submerge said wafer cassette and said at least one wafer in a first process fluid, said container also being sufficiently small to fit on said base plate and within said pressure vessel, means for aligning said wafer cassette within said container, means for aligning said container on said base plate, means for bringing said pressure vessel and said base plate into a closed and sealed relationship, means for displacing the air in said pressure vessel with a second process fluid in a gaseous state, means for elevating said second process fluid to a liquid state, means for displacing said first process fluid in said container with said second process fluid in said liquid state, means for elevating said second process fluid to a supercritical state, means for reducing pressure in said pressure vessel to ambient pressure, and means for cooling said second process fluid to below supercritical temperature.