초록 ▼

A method for preparing a copper pad surface for electrical connection that has superior diffusion barrier and adhesion properties is provided. In the method, a copper pad surface is first provided that has been cleaned by an acid solution, a protection layer of a phosphorus or boron-containing metal

A method for preparing a copper pad surface for electrical connection that has superior diffusion barrier and adhesion properties is provided. In the method, a copper pad surface is first provided that has been cleaned by an acid solution, a protection layer of a phosphorus or boron-containing metal alloy is then deposited on the copper pad surface, and then an adhesion layer of a noble metal is deposited on top of the protection layer. The protection layer may be a single layer, or two or more layers intimately joined together formed of a phosphorus or boron-containing metal alloy such as Ni-P, Co-P, Co-W-P, Co-Sn-P, Ni-W-P, Co-B, Ni-B, Co-Sn-B, Co-W-B and Ni-W-B to a thickness between about 1,000 .ANG. and about 10,000 .ANG.. The adhesion layer can be formed of a noble metal such as Au, Pt, Pd and Ag to a thickness between about 500 .ANG. and about 4,000 .ANG..

대표청구항 ▼

1. A method for preparing a copper pad surface for electrical connection comprising the steps of:providing a copper pad surface; selectively depositing a protection layer of phosphorus or boron-containing metal alloy on the copper pad surface; and selectively depositing an adhesion layer of a noble

1. A method for preparing a copper pad surface for electrical connection comprising the steps of:providing a copper pad surface; selectively depositing a protection layer of phosphorus or boron-containing metal alloy on the copper pad surface; and selectively depositing an adhesion layer of a noble metal on top of said protection layer.