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Method of fabricating an interconnection element 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-043/00
출원번호 US-0452255 (1995-05-26)
발명자 / 주소
  • Benjamin N. Eldridge
  • Gary W. Grube
  • Igor Y. Khandros
  • Gaetan L. Mathieu
대리인 / 주소
    David Larwood
인용정보 피인용 횟수 : 232  인용 특허 : 17

초록

Contact structures formed on an electronic component are useful for connecting the component to other electronic components. A contact tip structure can be formed on a sacrificial substrate, then combined with an interconnection element. A preferred contact structure includes some topography, genera

대표청구항

1. A method of fabricating an interconnection element having a contact tip structure, comprising:forming a contact tip structure on a sacrificial substrate; prior to constructing the contact tip structure, providing a selected topography in an area of the sacrificial substrate by imposing an articul

이 특허에 인용된 특허 (17)

  1. Matsumoto Kunio (Yokohama JPX) Oshima Muneo (Yokohama JPX) Sakaguchi Suguru (Chigasaki JPX), Connecting structure for electronic part and method of manufacturing the same.
  2. Herandez Jorge M. (1920 E. Jarvis Mesa AZ 85202) Simpson Scott S. (Senexet Rd. Woodstock CT 06281) Hyslop Michael S. (4147 W. Victoria La. Chandler AZ 85226), Device for interconnecting integrated circuit packages to circuit boards.
  3. Beaman Brian S. (Hyde Park NY), Elastomeric area array interposer.
  4. Carlomagno William D. (Redwood City CA) Cummings Dennis E. (Placerville CA) Gliga Alexandru S. (San Jose CA), Interconnection of electronic components.
  5. Carlommagno William D. (Redwood City CA) Cummings Dennis E. (Placerville CA) Gliga Alexandru S. (San Jose CA), Interconnection of electronic components.
  6. Mallik Debendra (Chandler AZ) Bhattacharyya Bidyut K. (Chandler AZ), Lead grid array integrated circuit.
  7. Akiyama, Yukiharu; Oshima, Yoshio, Method and apparatus for wire bonding.
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  10. Khandros Igor Y. (Peekskil NY), Method of manufacturing electrical contacts, using a sacrificial member.
  11. Shiba Takeshi (Ono JPX) Shimizu Toshiaki (Ono JPX) Yanase Fumihiro (Ono JPX), Method of thermal diffusion alloy plating for steel wire on continuous basis.
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  16. Simpson John P. (Apalachin NY), Surface mounted array strain relief device.
  17. Cray Seymour R. (Chippewa Falls WI) Krajewski Nicholas J. (Elk Mound WI), Three dimensionally interconnected module assembly.

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