초록 ▼

A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and mea

A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be good.

대표청구항 ▼

1. A method of measuring solder bumps formed on a work to be measured, comprising the steps ofirradiating a light beam on each solder bump disposed on the work set on a table; measuring an apex height of each solder bump by receiving a light reflected from each solder bump; determining a regression

1. A method of measuring solder bumps formed on a work to be measured, comprising the steps ofirradiating a light beam on each solder bump disposed on the work set on a table; measuring an apex height of each solder bump by receiving a light reflected from each solder bump; determining a regression plane constituted by said solder bumps by referring to said apex heights measured; and determining a relative apex height of each solder bump relative to said determined regression plane.