초록 ▼

A thermal hinge (20) designed for use in a hinged mobile computing device (22) having a base (24) and a display unit (26). The thermal hinge includes a first block (120) and a second block (122), both made from copper or other metal of equal or higher thermal conductivity. The blocks are mounted in

A thermal hinge (20) designed for use in a hinged mobile computing device (22) having a base (24) and a display unit (26). The thermal hinge includes a first block (120) and a second block (122), both made from copper or other metal of equal or higher thermal conductivity. The blocks are mounted in the base and display unit, respectively, adjacent the rotational axis (30) of the hinge assembly (28) that permits the display unit to move between open and closed positions relative to the base. The first block is connected to a first heat pipe (102) which is attached to a heat-generating device (32), and the second block is connected to a second heat pipe (104) which is connected to a heat dissipating device (34). At least one, and preferably a plurality of, braided wire(s) (160) are connected to the first and second blocks and conduct heat therebetween.

대표청구항 ▼

1. A thermal transfer hinge for transferring heat in a mobile computing device having a base, a display unit and a hinge assembly attached to the base and display unit for permitting the display unit to move between open and closed positions relative to the base, the hinge assembly having a rotation

1. A thermal transfer hinge for transferring heat in a mobile computing device having a base, a display unit and a hinge assembly attached to the base and display unit for permitting the display unit to move between open and closed positions relative to the base, the hinge assembly having a rotational axis, the thermal transfer hinge comprising:a. a first heat pipe; b. a second heat pipe; c. a first block having a thermal conductivity at least as high as copper, said first block connected to said first heat pipe; d. a second block having a thermal conductivity at least as high as copper, said second block connected to said second heat pipe; and e. at least one braided metal wire attached to said first block and said second block so as to be in thermal contact with said first block and said second block, said at least one braided metal wire having a thermal conductivity at least as high as copper.