초록 ▼

Foamable compositions which exhibit reduced surface tack and better handling characteristics are obtained through the use of specific combinations of epoxy resins. One or more solid epoxy resins are utilized together with liquid and/or semi-solid epoxy resins. The compositions, which preferably cont

Foamable compositions which exhibit reduced surface tack and better handling characteristics are obtained through the use of specific combinations of epoxy resins. One or more solid epoxy resins are utilized together with liquid and/or semi-solid epoxy resins. The compositions, which preferably contain hollow glass microspheres, are capable of providing foams which are useful in the manufacture of reinforced structural members.

대표청구항 ▼

1. A foamable dough useful for forming a structural reinforcement foam comprising(a) one or more base epoxy resins selected from the group consisting of liquid epoxy resins and semi-solid epoxy resins, wherein at least one of the base epoxy resins is a glycidyl ether of a first polyhydric phenol and

1. A foamable dough useful for forming a structural reinforcement foam comprising(a) one or more base epoxy resins selected from the group consisting of liquid epoxy resins and semi-solid epoxy resins, wherein at least one of the base epoxy resins is a glycidyl ether of a first polyhydric phenol and the base epoxy resins have an average of about two epoxy groups per molecule and epoxide equivalent weights in the range of from about 150 to about 350; (b) one or more chemical blowing agents; (c) one or more curatives, wherein at least one of the said curatives is a nitrogen-containing compound; (d) one or more fillers, wherein hollow-glass microspheres comprise at least part of said fillers; and (e) an amount of one or more solid epoxy resins effective to reduce the surface tackiness of the foamable dough as compared to the surface tackiness of an analogous foamable dough in the absence of the solid epoxy resins, wherein at least one of the solid epoxy resins is a glycidyl ether of a second polyhydric phenol and the solid epoxy resins have an average of about 2 epoxy groups per molecule, melting points in the range of from about 40.degree. C. to about 150.degree. C. and epoxide equivalent weights in the range of from about 350 to about 2000.