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Fan motor 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H02K-009/00
  • H02K-009/06
출원번호 US-0481898 (2000-01-12)
우선권정보 JP-0092819 (1999-03-31)
발명자 / 주소
  • Katsuhiko Yamamoto JP
출원인 / 주소
  • Toshiba Home Technology Corporation JP
대리인 / 주소
    Akerman Senterfitt
인용정보 피인용 횟수 : 33  인용 특허 : 7

초록

A fan motor with an improved inhaling structure so as to enhance ventilation efficiency and performance, as well as cooling performance. An outer housing member 7 has a respective face opposite to a drive unit 11. An intake hole 13 of an arbitrary diameter is provided in a first face of the outer ho

대표청구항

1. A fan motor to be mounted to an inside of a casing of a thin electronic appliance such as a personal computer, comprising:a fan for inhaling and exhausting air in a manner that an inhaling direction of air is perpendicular to an exhausting direction thereof; a drive unit for driving said fan; an

이 특허에 인용된 특허 (7)

  1. Lemont Andrew I. ; Radziunas Jeffrey, Active heat sink structure with flow augmenting rings and method for removing heat.
  2. Yokozawa Shinjiro (Tokyo JPX) Kodama Nobumasa (Ueda JPX) Ogawara Toshiki (Toubumachi JPX), Axial flow air fan having lateral suction and discharge ports for cooling electronic components.
  3. Ko Chun-Chin,TWX ; Kao Chai-Fong,TWX, CPU heat dissipating device with airguiding units.
  4. Yokozawa Shinjiro,JPX ; Kodama Nobumasa,JPX ; Ogawara Toshiki,JPX ; Kodaira Yuichi,JPX ; Watanabe Michinori,JPX, Electronic component cooling apparatus.
  5. Katsui Tadashi (Kawasaki JPX), Heat sink having air movement device positioned among tins and between heating elements.
  6. Khan Khan Mohamed Khirullah Genghis ; Johnson Roger Neal ; Jahns Thomas Merlin ; Stokes Vijay Kumar ; August ; Jr. John Leo ; Lown Harold, Integrated motor and blower apparatus having two back-to-back coupled rotors.
  7. Thomas Daniel L. (San Jose CA) Hoover John W. (Huntington CT) Marracino Charles R. (Torrington CT), Low profile fan body with heat transfer characteristics.

이 특허를 인용한 특허 (33)

  1. Tanner, James, Active cooling fin pack.
  2. Takeshita,Kazumi; Kitamura,Junpei, Centrifugal fan.
  3. Searls, Damion; Pearson, Tom; Jackson, James, Channeled heat dissipation device and a method of fabrication.
  4. Searls, Damion; Pearson, Tom; Jackson, James, Channeled heat dissipation device and a method of fabrication.
  5. Han, Tai-Sheng, Circuit board apparatus with induced air flow for heat dissipation.
  6. Hoffman, Mark S.; Drahms, David C., Circuit board cover with exhaust apertures for cooling electronic components.
  7. Lopatinsky,Edward L.; Schaefer,Dan K.; Rosenfeld,Saveliy T.; Fedoseyev,Lev A., Cooler for electronic devices.
  8. Tamaoka, Takehito; Fukushima, Kazuhiko, Cooling apparatus.
  9. Tanaka,Atsuko; Ohnishi,Masuo, Cooling device capable of reducing thickness of electronic apparatus.
  10. Tanaka,Atsuko; Ohnishi,Masuo, Cooling device capable of reducing thickness of electronic apparatus.
  11. Kobayashi,Sonomasa; Tanaka,Kaigo; Iwata,Masaki, Cooling device, substrate, and electronic equipment.
  12. Cipolla, Thomas M; Jamal-Eddine, Tarek J; Mok, Lawrence S, Cooling mechanism for an electronic device.
  13. Fujiwara, Nobuto, Cooling unit including fan and plurality of air paths and electronic apparatus including the cooling unit.
  14. Takasou, Kazuo, Electronic apparatus cooling structure.
  15. Tomioka, Kentaro; Nakamura, Hiroshi, Electronic apparatus having cooling unit for cooling heat-generating component.
  16. McGough, William L., Electronic assembly and heat sink.
  17. Goto, Katsuichi; Kobayashi, Sonomasa, Electronic device.
  18. Kaslusky, Scott F.; St. Rock, Brian, Electronics package with radial heat sink and integrated blower.
  19. Tamaoka, Takehito; Fukushima, Kazuhiko, Fan.
  20. Katsuhiko Yamamoto JP, Fan Motor.
  21. Yamamoto,Katsuhiko; Aoki,Hiroshi, Fan motor.
  22. Chuang, Wei-Pin; Cheng, Chih-Chuan, Heat dissipating device.
  23. Hwang, Ching Bai; Meng, Jin Gong, Heat dissipation apparatus.
  24. Lai, Chih-Hsi, Heat dissipation apparatus.
  25. Hong,Alex; Wang,Ko Chien, Heat dissipation device.
  26. Tamaoka, Takehito; Hatanaka, Koji; Ida, Kiyoto, Heat module.
  27. Aoki, Michimasa; Suzuki, Masumi, Heat sink with non-uniform fins and transverse protrusion.
  28. Blomquist, Mike, Modular cooling system.
  29. Machiroutu, Sridhar V., Radial air flow fan assembly having stator fins surrounding rotor blades.
  30. Yeh, Chia Ching; Huang, Lo Chi, Radiating module.
  31. Kitahara, Takashi; Shuto, Naoki, Semiconductor module apparatus and cooling apparatus.
  32. Loiler,Brian Roger; Sun,Xiaohua H., System for cooling a heat-generating electronic device with increased air flow.
  33. Makley, Albert V.; Cipolla, Thomas M.; Hildner, Thomas R.; Kamath, Vinod; Kiyooka, Fumitoshi; Mok, Lawrence S.; Nakamura, Fusanobu, Thermal docking fansink.
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