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Method and apparatus for tooless mating of liquid cooled cold plate with tapered interposer heat sink 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0675282 (2000-09-29)
발명자 / 주소
  • David J. Koenen
출원인 / 주소
  • Compaq Information Technologies Group, L.P.
대리인 / 주소
    Conley, Rose & Tayon, P.C.
인용정보 피인용 횟수 : 96  인용 특허 : 5

초록

A heat dissipating apparatus for use on a heat generating electric component inside a computer comprises an interposer mounted on the heat generating electric component and a heat absorbing member including a heat absorber, a bracing member, and a spring biasing said heat absorber toward the bracing

대표청구항

1. A heat dissipating apparatus for use on a heat generating electric component, comprising:a heat-transmitting interposer mounted on the heat generating electric component; and a heat absorbing member including: a heat absorber, a bracing member, and a spring biasing said heat absorber toward said

이 특허에 인용된 특허 (5)

  1. Koenig Philip C. (Bainbridge Island WA), Electronic conduction cooling clamp.
  2. Bhatia Rakesh, Heat exchanger for a portable computing device and docking station.
  3. Morrison Robert A. (Long Beach CA), Hydraulic thermal clamp for electronic modules.
  4. Koenen David J. (Houston TX), Microprocessor heat dissipation apparatus for a printed circuit board.
  5. Koenen David J. ; Jansen Kenneth A., Pivotable support and heat sink apparatus removably connectable without tools to a computer processor.

이 특허를 인용한 특허 (96)

  1. Pope, Steve L.; Riddoch, David J.; Mansley, Kieran, Avoiding delayed data.
  2. Pope, Steve Leslie; Roberts, Derek Edwards; Riddoch, David James, Checking data integrity.
  3. Pope, Steven L.; Riddoch, David J., Chimney onload implementation of network protocol stack.
  4. Lee, Sang Cheol, Chipset cooling device of video graphic adapter card.
  5. Zaffetti, Mark A., Compact two sided cold plate with threaded inserts.
  6. Zaffetti, Mark A.; Laurin, Michael B., Compact two sided cold plate with transfer tubes.
  7. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Compliant conduction rail assembly and method facilitating cooling of an electronics structure.
  8. Pope, Steven L.; Riddoch, David; Roberts, Derek, Controller integration.
  9. Inoue,Seiji, Coolant cooled type semiconductor device.
  10. Inoue,Seiji, Coolant cooled type semiconductor device.
  11. Inoue,Seiji, Coolant cooled type semiconductor device.
  12. Inoue,Seiji; Ohkouchi,Yasuyuki, Coolant cooled type semiconductor device.
  13. Ohkouchi, Yasuyuki, Coolant cooled type semiconductor device.
  14. Peterson, Eric C., Cooling manifold assembly.
  15. Anderl, William James; Colgan, Evan George; Gerken, James Dorance; Marroquin, Christopher Michael; Tian, Shurong, Cooling system for electronic components.
  16. Anderl, William James; Colgan, Evan George; Gerken, James Dorance; Marroquin, Christopher Michael; Tian, Shurong, Cooling system for electronic components.
  17. Hsieh, Cheng-Wen; Liao, Wen-Neng, Cycling heat dissipation module.
  18. Pope, Steven Leslie; Riddoch, David James, Data buffering.
  19. Pope, Steven Leslie; Riddoch, David James; Law, Greg, Data processing system with data transmit capability.
  20. Pope, Steven Leslie; Riddoch, David James; Law, Greg, Data processing system with data transmit capability.
  21. Pope, Steven Leslie; Riddoch, David James; Law, Greg, Data processing system with intercepting instructions.
  22. Pope, Steven Leslie; Riddoch, David James; Law, Greg, Data processing system with routing tables.
  23. Pope, Steven Leslie; Riddoch, David James; Law, Greg, Data processing system with routing tables.
  24. Pope, Steve L.; Roberts, Derek; Riddoch, David; Clarke, David, Data protocol.
  25. Pope, Steven L.; Riddoch, David J., Driver level segmentation.
  26. Pope, Steve Leslie; Riddoch, David James, Dual-driver interface.
  27. Pope, Steve Leslie; Riddoch, David James, Dual-driver interface.
  28. Bash,Cullen E.; Patel,Chandrakant D.; Sharma,Ratnesh K., Dynamic fluid sprayjet delivery system.
  29. Tadayon, Pooya; Monzon, Franklin G.; Dujari, Prateek, Electrical energy-generating heat sink system and method of using same to recharge an energy storage device.
  30. Tadayon, Pooya; Monzon, Franklin G.; Dujari, Prateek, Electrical energy-generating heat sink system and method of using same to recharge an energy storage device.
  31. Tadayon,Pooya; Zaerpoor,Koorosh, Electrical energy-generating system and devices and methods related thereto.
  32. Chikazawa, Nagahisa; Adachi, Katsumi, Electronic device and cooling unit.
  33. Pope, Steven L., Encapsulated accelerator.
  34. Pope, Steven L., Encapsulated accelerator.
  35. Pope, Steven L., Encapsulated accelerator.
  36. Pope, Steven L., Encapsulated accelerator.
  37. Pope, Steven L.; Riddoch, David J., Epoll optimisations.
  38. Pope, Steve L., Fast linkup arbitration.
  39. Pope, Steve L., Fast linkup arbitration.
  40. Pope, Steve L.; Roberts, Derek; Riddoch, David J.; Yu, Ching; Chiang, John Mingyung; Chu, Der-Ren, Hashing algorithm for network receive filtering.
  41. Pope, Steven L.; Roberts, Derek; Riddoch, David J.; Yu, Ching; Chiang, John Mingyung; Chu, Der-Ren, Hashing algorithm for network receive filtering.
  42. Pope, Steven L.; Riddoch, David; Kitariev, Dimitri; Roberts, Derek, Header processing engine.
  43. Pope, Steven L.; Riddoch, David; Kitariev, Dimitri; Roberts, Derek, Header processing engine.
  44. Gauche,Paul; Jackson,Robert T., Heat spreader.
  45. Chu, Chung-Jun, Heat-dissipating casing structure.
  46. Goth, Gary F.; Kemink, Randall G.; Pizzolato, Katie L., In-line memory module cooling system.
  47. Prasher, Ravi; Watwe, Abhay A.; Chrysler, Gregory M.; Frutschy, Kristopher; Ofman, Leo; Sathe, Ajit V., Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment.
  48. Prasher, Ravi; Watwe, Abhay A.; Chrysler, Gregory M.; Frutschy, Kristopher; Ofman, Leo; Sathe, Ajit V., Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment.
  49. Kamath,Vinod; Loebach,Beth F., Interposable heat sink for adjacent memory modules.
  50. Pope, Steven L.; Riddoch, David J., Interrupt management.
  51. Wilson,Michael J.; Wattelet,Jonathan; Lightner,Donald; DeKeuster,Richard; Dubble,Ernest H.; Baldassarre,Gregg J., Liquid cooled heat sink with cold plate retention mechanism.
  52. Babish, Eyal; Amarzoyev, Rafi; Waldman, Eyal, Liquid cooling system for modular electronic systems.
  53. Babish, Eyal; Amarzoyev, Rafi; Waldman, Eyal, Liquid cooling system for modular electronic systems.
  54. Pope, Steve L.; Roberts, Derek; Riddoch, David J., Locked down network interface.
  55. Pope, Steve L.; Roberts, Derek; Riddoch, David J., Locked down network interface.
  56. Pope, Steven L.; Riddoch, David; Kitariev, Dmitri, Mapped FIFO buffering.
  57. Pope, Steven L.; Riddoch, David; Kitariev, Dmitri, Mapped FIFO buffering.
  58. Stathakis,D. George, Memory heat sink.
  59. Pope, Steven L.; Riddoch, David J., Message acceleration.
  60. Riddoch, David J.; Porter, Martin W.; Pope, Steven L., Method and apparatus for multicast packet reception.
  61. Riddoch, David J.; Porter, Martin; Pope, Steven L., Method and apparatus for multicast packet reception.
  62. Koenen,David J., Method and apparatus for optimizing performance in a multi-processing system.
  63. Cipolla, Thomas M.; Tian, Shurong; Colgan, Evan George; Coteus, Paul W.; Hall, Shawn Anthony, Method and apparatus of water cooling several parallel circuit cards each containing several chip packages.
  64. Pope, Steven L.; Riddoch, David J.; Mansley, Kieran, Modifying application behaviour.
  65. Pope, Steve Leslie; Roberts, Derek Edward; Riddoch, David James; Clarke, David Julian, Network interface and protocol.
  66. Pope, Steve Leslie; Roberts, Derek Edward; Riddoch, David James; Clarke, David Julian, Network interface and protocol.
  67. Pope, Steven L.; Riddoch, David J., Onload network protocol stacks.
  68. Pope, Steve L.; Riddoch, David J.; Porter, Martin, Packet capture.
  69. Pope, Steve L.; Riddoch, David J.; Yu, Ching; Roberts, Derek, Packet validation in virtual network interface architecture.
  70. Pope, Steve L.; Riddoch, David J.; Yu, Ching; Roberts, Derek, Packet validation in virtual network interface architecture.
  71. Pope, Steven; Riddoch, David, Processing received data.
  72. Pope, Steve; Riddoch, David, Processing, on multiple processors, data flows received through a single socket.
  73. Pope, Steven Leslie; Roberts, Derek Edward; Riddoch, David James; Law, Greg; Grantham, Steve; Slattery, Matthew, Reception according to a data transfer protocol of data directed to any of a plurality of destination entities.
  74. Pope, Steven Leslie; Roberts, Derek Edward; Riddoch, David James; Law, Greg; Grantham, Steve; Slattery, Matthew, Reception according to a data transfer protocol of data directed to any of a plurality of destination entities.
  75. Pope, Steven Leslie; Roberts, Derek Edward; Riddoch, David James; Law, Greg; Grantham, Steve; Slattery, Matthew, Reception according to a data transfer protocol of data directed to any of a plurality of destination entities.
  76. Pope, Steven Leslie; Roberts, Derek Edward; Riddoch, David James; Law, Greg; Grantham, Steve; Slattery, Matthew, Reception according to a data transfer protocol of data directed to any of a plurality of destination entities for data extraction.
  77. Pope, Steven L.; Riddoch, David J.; Mansley, Kieran, Reducing network latency.
  78. Pope, Steven L.; Riddoch, David J.; Mansley, Kieran, Reducing network latency.
  79. Pope, Steven L.; Riddoch, David J.; Mansley, Kieran, Reducing network latency.
  80. Pope, Steven L.; Riddoch, David, Remote functionality selection.
  81. Arvelo, Amilcar R.; Brandon, Mark A.; Campbell, Levi A.; Doan, Tan D.; Ellsworth, Jr., Michael J.; Kemink, Randall G.; McKeever, Eric J., Selective clamping of electronics card to coolant-cooled structure.
  82. Arvelo, Amilcar R.; Brandon, Mark A.; Campbell, Levi A.; Doan, Tan D.; Ellsworth, Jr., Michael J.; Kemink, Randall G.; McKeever, Eric J., Selective clamping of electronics card to coolant-cooled structure.
  83. Arvelo, Amilcar R.; Brandon, Mark A.; Campbell, Levi A.; Doan, Tan D.; Ellsworth, Jr., Michael J.; Kemink, Randall G.; McKeever, Eric J., Selective clamping of electronics card to coolant-cooled structure.
  84. Colgan, Evan G.; Gaynes, Michael A.; Zitz, Jeffrey A., Semiconductor device cooling module.
  85. Kelty, Matthew James; Macall, Thomas George, Stacked cage optical module heat relay system.
  86. Pope, Steven L.; Riddoch, David, Switching API.
  87. Pope, Steve L.; Riddoch, David J., TCP processing for devices.
  88. Bash, Cullen E.; Patel, Chandrakant D.; Simon, Glenn C., Thermal connector for cooling electronics.
  89. Centola, Bruno; Gomez, Claude, Thermal connector for transferring heat between removable printed circuit boards.
  90. Regnier, Kent E., Thermally configured connector system.
  91. Pope, Steven Leslie; Riddoch, David James; Law, Greg, User-level re-initialization instruction interception.
  92. Pope, Steven Leslie; Riddoch, David James; Law, Greg, User-level re-initialization instruction interception.
  93. Pope, Steven L.; Riddoch, David J., User-level stack.
  94. Riddoch, David, Virtualised interface functions.
  95. Pope, Steven; Riddoch, David, Virtualised receive side scaling.
  96. Deeney, Jeffrey L.; Dutson, Joseph D.; Simon, Glenn C., Wrap-around cooling arrangement for printed circuit board.
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