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There is a disclosed a liquid delivery system (LDS) used upon deposition of a copper wire through chemical vapor deposition method in the process of manufacturing a semiconductor device. The LDS comprises a copper liquid materials supply [means] apparatus for providing copper liquid materials of a r

There is a disclosed a liquid delivery system (LDS) used upon deposition of a copper wire through chemical vapor deposition method in the process of manufacturing a semiconductor device. The LDS comprises a copper liquid materials supply [means] apparatus for providing copper liquid materials of a room temperature to a vaporizer [means] via an orifice which is rotating at a constant speed; a carrier gas supply [means] apparatus for jetting a carrier gas kept to the temperature at which copper will be vaporized via jet nozzles and forming the copper liquid materials to be supplied to said vaporizer [means] via said orifice with micro drops; and a jet [means] device for jetting vaporized copper stream to a reactive chamber, wherein said micro drops being vaporized in the vaporizer [means]. According to the present invention, it can solve the problems such as clogging of a vaporizer, a low reproduction and a low deposition speed, which are problematic in the conventional bubbler and direct liquid injection (DLI) apparatuses.

대표청구항 ▼

1. A liquid delivery system, comprising:a copper liquid materials supply means for supplying copper liquid materials at room temperature to a vaporizer means via an orifice which is rotating at a constant speed; a carrier gas supply means for jetting a carrier gas kept at a temperature at which copp

1. A liquid delivery system, comprising:a copper liquid materials supply means for supplying copper liquid materials at room temperature to a vaporizer means via an orifice which is rotating at a constant speed; a carrier gas supply means for jetting a carrier gas kept at a temperature at which copper will be vaporized via a jet nozzle, the carrier gas causing the copper liquid materials to be supplied to said vaporizer means via said orifice in micro drops; the copper liquid materials and carrier gas mixing to form a vaporized copper steam in the vaporizer; a jet means for jetting the vaporized copper steam into a reactive chamber, the jet means including a copper steam inlet line having a heating jacket for maintaining a temperature of the vaporized copper steam, a mass flow controller for controlling a mass flow of said vaporized copper steam introduced from the copper steam inlet line, and a copper steam outlet line for transferring the vaporized copper steam from the mass flow controller to a copper steam jet whereby the vaporized copper steam is introduced into the reactive chamber, wherein the copper steam inlet line extends from the vaporizer means at an upward angle of about 40.degree. to about 70.degree. so that incompletely vaporized copper byproducts cannot be supplied to said reactive chamber.