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High performance notebook PC cooling system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
출원번호 US-0859154 (1997-05-20)
발명자 / 주소
  • Herman W. Chu
  • Rakesh Bhatia
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    Blakely, Sokoloff, Taylor & Zafman LLP
인용정보 피인용 횟수 : 31  인용 특허 : 25

초록

The invention consists of a modular apparatus for cooling an integrated circuit chip in a compact computer. The apparatus includes a heat collector assembly operatively connected to the chip, a heat exchange assembly and a heat pipe extending from the heat collector assembly to the heat exchange ass

대표청구항

1. An apparatus comprising:(a) a heat collector assembly mounted on a circuit board and operatively connected to an integrated circuit chip, the circuit board being located in a computer chassis; (b) a heat exchange assembly mounted in the computer chassis, the heat exchange assembly comprising: (1)

이 특허에 인용된 특허 (25)

  1. Bhatia Rakesh, Airflow heat exchanger for a portable computing device and docking station.
  2. Haley Kevin (San Jose CA) Aghazadeh Mostafa (Chandler AZ) Xie Hong (Chandler AZ), Apparatus for dissipating heat in a hinged computing device.
  3. Gandre Jerry ; Schmitt Ty, Combination heat sink and air duct for cooling processors with a series air flow.
  4. Mochizuki Masataka,JPX ; Mashiko Koichi,JPX ; Goto Kazuhiko,JPX ; Saito Yuji,JPX ; Eguchi Katsuo,JPX ; Nagaki Yoshihiro,JPX ; Takamiya Akihiro,JPX ; Nguyen Thang Toan,JPX, Cooler for electronic devices.
  5. Butterbaugh Matthew A. (Rochester MN) Dingfelder Donald W. (Winona MN) Herman Peter M. (Oronoco MN) Kang Sukhvinder S. (Rochester MN), Cooling apparatus for electronic chips.
  6. Lin Shih-jen (No. 360 ; Tanan Rd. Taipei TWX), Cooling device for CPU.
  7. O'Connor Michael ; Haley Kevin ; Bhatia Rakesh ; Adams Daniel Thomas ; Kast Michael Andrew, Cooling system for thin profile electronic and computer devices.
  8. Chiou Ming D. (3F. ; No. 4 ; Alley 11 ; Lane 327 ; Sec. 2 ; Chung Shan Rd. Chung Ho City ; Taipei TWX), Dissipation case for a power supplier of direct current.
  9. Xie Hong (Chandler AZ) Aghazadeh Mostafa (Chandler AZ) Turturro Gregory (Chandler AZ) Chiu Chia-Pin (Chandler AZ), Dissipation of heat through keyboard using a heat pipe.
  10. Ouchi Katsunori (Hitachi JPX) Morihara Atsushi (Katsuta JPX) Naganuma Yoshio (Hitachi JPX) Sato Koji (Hitachi JPX) Kaji Ryuichi (Kitaibaraki JPX), Electronic equipment and computer with heat pipe.
  11. Steffes Karl M. (7302 Kapok La. Austin TX 78759) Crosby Joseph B. (4030 Westlake Dr. Austin TX 78746) Gandre Jerry D. (7408 Curly Leaf Cove Austin TX 78750) Swindler Dan E. (2404 Messick Loop W. Roun, Expansion card/riser card module for desktop computers.
  12. Hong Chen Fu-In (No. 3 ; Lane 45 ; Yi-Yung Road Kaohsiung TWX), Fan assembly for an integrated circuit.
  13. Tanaka Suemi (Yokohama JPX) Sotani Junji (Yokohama JPX) Nanba Kenichi (Tokyo JPX), Heat pipe type radiation for electronic apparatus.
  14. Papst Georg (St. Georgen DEX) Wrobel Guenter (Villingen DEX) Koletzki Ulrich (St. Georgen DEX), Heat sink for electronic devices.
  15. Mira Ali ; August ; deceased Mark, Heat sink with integral attachment mechanism.
  16. Hung Sung Chen,TWX ; Chen Ching Ming,TWX, Heat-radiating device.
  17. Lau Tim O. (Milpitas CA) Huang Alexander (Menlo Park CA) Lo Douglas P. (San Jose CA), Housing cooling system.
  18. Meyer ; IV George A. (Conestoga PA) Toth Jerome E. (Hatboro PA) Longsderff Richard W. (Lancaster PA), Integrated circuit cooling apparatus.
  19. Nelson Daryl J. (Beaverton OR) Tirumala Muralidhar (Portland OR) Butler Peter (Hillsboro OR) Budelman Gerald A. (Aloha OR), Integrated circuit package with an integral heat sink and fan.
  20. Nelson Daryl (Beaverton OR), Multiple-fan microprocessor cooling through a finned heat pipe.
  21. Roberts Roy D. (Newark CA) Kiss John (San Jose CA), Packaged arc lamp and cooling assembly in a plug-in module.
  22. Brown David W. (Bellingham MA), Plenum for air-impingement cooling of electronic components.
  23. Morley Richard E. (Mason NH) Baker David A. (Mason NH), Printed circuit board heat sink.
  24. Toedtman Thomas (Lake Forest CA) Welch Randall S. (Lake Forest CA), Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices.
  25. Larson Ralph I. (Bolton MA) Phillips Richard J. (Alachua FL) Beane Alan F. (Gilford NH), Two-phase cooling system for a laptop computer lid.

이 특허를 인용한 특허 (31)

  1. Hanewinkel, III,William H; Williams,Mark G, Aircraft heat sink and electronics enclosure.
  2. Stock, Michael; Campbell, Brenda; Robbins, Jonathan, Apparatus and method for cooling electrical components of a computer.
  3. Yang, Wei; Zhang, Chunbo; Eickhoff, Steven J; Gu, Alex, Blowerless heat exchanger based on micro-jet entrainment.
  4. Shih-Tsung, Chen, CPU cooling using a heat pipe assembly.
  5. Bruscoe, Ry, Case for computer.
  6. Cheng,Stan, Computer chassis frame support.
  7. Wilson, John Alexander; Garrett, Robert Haden, Cooling system for a computer and method for assembling the same.
  8. Sarraf, David B.; DeHoff, Robert E.; Hartenstine, John; Todd, Jr., John J., Cooling system for electronics with improved thermal interface.
  9. Fujiwara, Nobuto, Electronic apparatus.
  10. Fujiwara, Nobuto, Electronic apparatus.
  11. Maeda, Takashi, Electronic apparatus.
  12. Yang, Wei; Hilton, Leonard; Gu, Yuandong; Park, Jong, Fin fabrication process for entrainment heat sink.
  13. Gailus, David W; Clemens, Donald L., Heat collector with mounting plate.
  14. Wu, Hung-Yi; Ye, Zhen-Xing; Sun, Ke; Chen, Ming-Ke; Chen, Xiao-Zhu, Heat dissipation assembly.
  15. Tian,Wei Qiang; Xia,Wan Lin; Li,Tao, Heat dissipation device.
  16. Liu, Xin-Lei; Liu, Jin-Biao; Yang, Hong-Cheng; Chen, Chun-Chi, Heat dissipation device and method for manufacturing the same.
  17. Sheu, Young-Kwang, Heat dissipation of low flow resistance in a notebook computer.
  18. Stone, Lawrence A.; Lev, Jeffrey A.; Progl, Curt L., Heat dissipation structure for electronic apparatus component.
  19. Katsui, Tadashi, Heat sink and information processor using heat sink.
  20. Miyamura, Harold; Malone, Christopher G., Heat sink apparatus utilizing the heat sink shroud to dissipate heat.
  21. Gu, Yuandong; Yang, Wei, Heat sink fin including angular dimples.
  22. Peterson,Gregory A.; Stebner,Jeffrey S., Heat sink for printed circuit board components.
  23. Hsu Jui-Yuan TW; Chen Yu Timothy Yu TW, Heat-dissipating assembly and process for assembling the same.
  24. Toyoda, Shigeru, Information processing apparatus with a chassis for thermal efficiency and method for making the same.
  25. Wicks, Curtis; Lovaasen, Eric; Anderson, Kaleb; Boer, Jonathan, Integrated pipe heat exchanger.
  26. Tantoush, Mohammed A.; Kitlas, Kenneth, Method and apparatus for removing heat from an electronic device.
  27. Canfield, Brad; Daly, Ray, Modular cooling unit for x-ray device.
  28. Sheppard, Barbara L., Motorized height-adjustable table apparatus.
  29. Strader, Jason L., Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding.
  30. Lehman, Bret W.; Loebach, Beth Frayne; Makley, Albert Vincent; Matteson, Jason Aaron, Vibration isolation of computing device heat sink fans from attached fan shrouds and heat sinks.
  31. Cheng,Chia Chun, Water-cooling heat dissipator.
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