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A soldering apparatus has a solder container and a casing to accommodate a protective-gas atmosphere for soldering printed circuit boards. During transport of the circuit boards through a casing the circuit boards are brought into contact with a solder wave in the container. The casing has an inlet

A soldering apparatus has a solder container and a casing to accommodate a protective-gas atmosphere for soldering printed circuit boards. During transport of the circuit boards through a casing the circuit boards are brought into contact with a solder wave in the container. The casing has an inlet for printed circuit board on an inlet side and an outlet on its outlet side. In addition, the casing has a supply of non-oxidizing gas and an arrangement for admitting gas into the casing. The casing is designed as a modular construction kit having subassemblies and/or constructional elements which comprise an input tunnel, an entry tunnel, at least two covering elements, an outlet tunnel and a detachable connection on the solder container and/or the sub-assemblies and/or constructional elements to connect the sub-assemblies and/or constructional elements and the solder container.

대표청구항 ▼

1. A soldering apparatus having a solder container and a casing to accommodate a protective-gas atmosphere for the soldering of printed circuit boards which, during their transport through the casing, are brought into contact with a solder wave in the container, the casing having an inlet for printe

1. A soldering apparatus having a solder container and a casing to accommodate a protective-gas atmosphere for the soldering of printed circuit boards which, during their transport through the casing, are brought into contact with a solder wave in the container, the casing having an inlet for printed circuit boards on an inlet side and an outlet for printed circuit boards on an outlet side, as well as having a supply of non-oxidizing gas and having an arrangement for admitting gas into the casing, wherein the casing is designed as a modular construction kit having subassemblies and/or constructional elements, comprising-an input tunnel-an entry tunnel-at least two covering elements, in each case a covering element for the region of the solder container that accommodates the printed circuit boards and the solder wave, and a covering element for the region of the solder container that accommodates the devices and/or elements, the two covering elements having a connecting point that runs in the transport direction of the printed circuit boards and together forming a hood which covers the entire solder container and has a projecting apron-an outlet tunnel and detachable connecting structure on the solder container and/or the subassemblies and/or constructional elements to connect the subassemblies and/or constructional elements and the solder container.