초록 ▼

Manipulation of DNA molecules in solution has become an essential aspect of genetic analyses used for biomedical assays, the identification of hazardous bacterial agents, and in decoding the human genome. Currently, most of the steps involved in preparing a DNA sample for analysis are performed manu

Manipulation of DNA molecules in solution has become an essential aspect of genetic analyses used for biomedical assays, the identification of hazardous bacterial agents, and in decoding the human genome. Currently, most of the steps involved in preparing a DNA sample for analysis are performed manually and are time, labor, and equipment intensive. These steps include extraction of the DNA from spores or cells, separation of the DNA from other particles and molecules in the solution (e.g. dust, smoke, cell/spore debris, and proteins), and separation of the DNA itself into strands of specific lengths. Dielectrophoresis (DEP), a phenomenon whereby polarizable particles move in response to a gradient in electric field, can be used to manipulate and separate DNA in an automated fashion, considerably reducing the time and expense involved in DNA analyses, as well as allowing for the miniaturization of DNA analysis instruments. These applications include direct transport of DNA, trapping of DNA to allow for its separation from other particles or molecules in the solution, and the separation of DNA into strands of varying lengths.

대표청구항 ▼

1. A method of separating a target material comprising the steps of:a. flowing a bulk sample comprising target material and contaminant material through a microdevice; b. exerting a dielectrophoretic force upon said bulk sample within the microdevice to selectively separate said target material from

1. A method of separating a target material comprising the steps of:a. flowing a bulk sample comprising target material and contaminant material through a microdevice; b. exerting a dielectrophoretic force upon said bulk sample within the microdevice to selectively separate said target material from said contaminant material, said target material adhering to a dielectric outer layer of an electrode contained in said microdevice, and said dielectric outer layer having a thickness of less than about 2000 angstroms.