초록 ▼

A torsional micro-mechanical mirror system includes a mirror assembly rotatably supported by a torsional mirror support assembly for rotational movement over and within a cavity in a base. The cavity is sized sufficiently to allow unimpeded rotation of the mirror assembly. The mirror assembly includ

A torsional micro-mechanical mirror system includes a mirror assembly rotatably supported by a torsional mirror support assembly for rotational movement over and within a cavity in a base. The cavity is sized sufficiently to allow unimpeded rotation of the mirror assembly. The mirror assembly includes a support structure for supporting a reflective layer. The support structure is coplanar with and formed from the same wafer as the base. The torsional mirror support assembly includes at least one torsion spring formed of an electroplated metal. An actuator assembly is operative to apply a driving force to torsionally drive the torsional mirror support assembly, whereby torsional motion of the torsional mirror support assembly causes rotational motion of the mirror assembly. In another embodiment, a magnetic actuator assembly is provided to drive the mirror assembly. Other actuator assemblies are operative to push on the mirror assembly or provide electrodes spaced across the gap between the mirror assembly and the base. A process for fabricating the torsional micro-mirror is provided. The torsional micro-mirror is useful in various applications such as in biaxial scanner or video display systems.

대표청구항 ▼

1. A process for fabricating a torsional micro-mechanical mirror system, comprising:providing a wafer substrate of a substrate material; providing electrical contact pads and anchors for torsional spring structures on one surface of the wafer; forming the torsional spring structures on the anchors;

1. A process for fabricating a torsional micro-mechanical mirror system, comprising:providing a wafer substrate of a substrate material; providing electrical contact pads and anchors for torsional spring structures on one surface of the wafer; forming the torsional spring structures on the anchors; removing a portion of the substrate material to define a mirror support structure separated by a gap from surrounding substrate material; and providing a mirror on the mirror support structure.