초록 ▼

A thermally enhanced semiconductor package includes a sheet metal cap having flexible flanges provided with solder contacts for reliable attachment to a circuit board. The package assembly further includes a semiconductor chip with a contact-bearing front surface facing forwardly, and chip bonding c

A thermally enhanced semiconductor package includes a sheet metal cap having flexible flanges provided with solder contacts for reliable attachment to a circuit board. The package assembly further includes a semiconductor chip with a contact-bearing front surface facing forwardly, and chip bonding contacts overlying the front face of the chip. The flange bonding contacts are coplanar with the chip bonding contacts, or can be brought into coplanar alignment by flexure of the cap. The package can be surface-mounted to a circuit board by placing the package onto pads of solder paste, and then heating the assembly to melt the solder paste in order to join the bonding contacts on the chip and on the flange to corresponding contacts on the circuit board.

대표청구항 ▼

1. A method of making a plurality of chip assemblies comprising:(a) providing a metallic element having one or more rear regions and one or more flange regions offset from said rear regions in a forward direction; (b) placing a plurality of semiconductor chips into said one or more rear regions in f

1. A method of making a plurality of chip assemblies comprising:(a) providing a metallic element having one or more rear regions and one or more flange regions offset from said rear regions in a forward direction; (b) placing a plurality of semiconductor chips into said one or more rear regions in front-face-forward disposition and attaching a rear face of each chip to a rear region of the metallic element; (c) providing bondable flange contacts on the flange regions of the metallic element and providing bondable chip contacts overlying the front face of each chip; and (d) after said placing and attaching step, severing said metallic element to thereby form a plurality of assemblies, each including a metallic cap having a rear wall, one or more flanges with one or more flange contacts thereon, at least one said chip attached to the rear wall and chip contacts overlying the front face of each said chip.