초록 ▼

An improved manufacturing system for processing semiconductor wafers which includes a (1) plurality of processing stations, (2) a sealed transport tunnel located directly over the processing stations, (3) a transport to move wafers within the tunnel, (4) interconnection chambers joining the transpor

An improved manufacturing system for processing semiconductor wafers which includes a (1) plurality of processing stations, (2) a sealed transport tunnel located directly over the processing stations, (3) a transport to move wafers within the tunnel, (4) interconnection chambers joining the transport tunnel and the processing stations, (5) interface mechanisms in the interconnection chambers to move the wafers to and from the processing stations, and (6) a computer to control the operations of the transport, the interface mechanisms, and the processing equipment at the processing stations.

대표청구항 ▼

1. A manufacturing system for handling and individually processing semiconductor wafers through a plurality of processing stations that perform operations on semiconductor wafers to produce operable integrated circuit semiconductor devices comprising:a plurality of processing stations, each having a

1. A manufacturing system for handling and individually processing semiconductor wafers through a plurality of processing stations that perform operations on semiconductor wafers to produce operable integrated circuit semiconductor devices comprising:a plurality of processing stations, each having an enclosure that is capable of maintaining a controlled clean environment, with at least one processing apparatus contained within each of said enclosures, a sealed transport tunnel adapted to maintain a controlled clean environment within, said tunnel located directly above said plurality of processing stations, interconnection chambers that are adapted to maintain a clean environment within, each of said chambers connected to the top of one of said enclosures of said processing stations, and to said transport tunnel, an interface mechanism within each of said chambers to transfer wafers to and from said processing apparatus within said enclosure, and said transport tunnel, a means to move wafers to be processed between the said interface mechanisms in said chambers, and through said transport tunnel, and a means to maintain controlled clean environments in said (1) enclosures of said processing stations, (2) said transport tunnel, and (3) said interconnection chambers.