초록 ▼

Devices and methods for releasably attaching substrate assemblies to carrier heads of planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies. One aspect of the invention is directed toward a backing member for use in a carrier head

Devices and methods for releasably attaching substrate assemblies to carrier heads of planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies. One aspect of the invention is directed toward a backing member for use in a carrier head to selectively couple a substrate assembly to the carrier head via a vacuum force before, during and after planarizing the substrate assembly. The backing member can include a body having a first section with a first surface configured to be received by the carrier head and a second section with a second surface configured to support a backside of the substrate assembly. The first and second sections of the body are preferably composed of flexible, incompressible materials. The backing member also includes a first vacuum passageway extending, through the body and a plurality of second vacuum passageways coupled to the first passageway. The first passageway is configured to be coupled to a vacuum source, and each second passageway has an opening at the second surface of the body to transfer a vacuum force from the first passageway to the openings. The second passageways are preferably configured to distribute the vacuum force across the backside of the substrate assembly in a manner that prevents or at least substantially inhibits deformation of the substrate assembly.

대표청구항 ▼

1. A backing member for selectively coupling a microelectronic-device substrate assembly to a carrier head of a planarizing machine, comprising:a body having a first surface configured to be received by the carrier head and substantially contacting the carrier head, and a second surface configured t

1. A backing member for selectively coupling a microelectronic-device substrate assembly to a carrier head of a planarizing machine, comprising:a body having a first surface configured to be received by the carrier head and substantially contacting the carrier head, and a second surface configured to support a backside of a substrate assembly; a first vacuum passageway extending through the body, the first passageway being configured to be coupled to a vacuum source; and a plurality of second vacuum passageways extending through the body, each second passageway having an aperture exposed to the first vacuum passageway, and an opening exposed at the second surface of the body, each second vacuum passageway having a fluid impermeable wall and being coupled to the first passageway to transfer a vacuum force drawn in the first passageway through the openings for pulling the backside of the substrate assembly against the second surface of the body.