초록 ▼

A computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess. Operating heat from the die is removed by heat dissipation apparatus which automatically adapts to variations in the microprocessor bond line thickness and incl

A computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess. Operating heat from the die is removed by heat dissipation apparatus which automatically adapts to variations in the microprocessor bond line thickness and includes a sheet metal EMI shield wall overlying the microprocessor and having a condensing end portion of a thermosyphoning heat pipe secured to its bottom side, with an evaporating end portion of the heat pipe overlying the die recess and being resiliently deflectable toward a phase change thermal pad mounted on the top side of the die and inset into the housing die recess. A metal heat sink member is rotatably mounted on the heat pipe evaporating end portion and has a flat bottom side and an arcuate top side. The heat sink member is resiliently deflected into the die recess, and has its flat bottom side resiliently pressed against the thermal interface pad, by a spring plate portion of a clamping structure downwardly engaging the arcuate top side of the heat sink member. During operation of the microprocessor, die heat is transferred to the metal shield wall sequentially through the thermal pad, the heat sink member, and the heat pipe and then dissipated from the shield wall using fan-generated cooling air flowed along the shield wall.

대표청구항 ▼

1. An electronic apparatus comprising:a component having a surface through which operating heat is generated; and heat dissipation apparatus for dissipating operating heat from said surface, including: a heat transfer structure having a portion resiliently deflectable toward said surface, a heat sin

1. An electronic apparatus comprising:a component having a surface through which operating heat is generated; and heat dissipation apparatus for dissipating operating heat from said surface, including: a heat transfer structure having a portion resiliently deflectable toward said surface, a heat sink member rotatably carried by said heat transfer structure portion, in thermal communication therewith, for resilient deflection therewith into heat-receiving proximity with said surface; and a force exerting structure operative to resiliently deflect said heat sink member into heat-receiving proximity with said surface, wherein said heat sink member has a flat side facing said surface, and an arcuate side positioned opposite said flat side and engageable by said force exerting structure.