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특허 상세정보

Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01L-021/30    H01L-021/46   
미국특허분류(USC) 438/455; 438/106; 438/107; 438/149; 438/456; 438/459; 438/460
출원번호 US-0051966 (1998-04-24)
우선권정보 JP-0225643 (1996-08-27); JP-0300371 (1996-11-12); JP-0300373 (1996-11-12); JP-0315590 (1996-11-12); JP-0193081 (1997-07-03); JP-0193082 (1997-07-03)
국제출원번호 PCT/JP97/02972 (1997-08-26)
§371/§102 date 19980424 (19980424)
국제공개번호 WO98/09333 (1998-03-05)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Oliff & Berridge, PLC.
인용정보 피인용 횟수 : 603  인용 특허 : 3
초록

A method for transferring a thin film device on a substrate onto a transfer member, includes a step for forming a separation layer on the substrate, a step for forming a transferred layer including the thin film device on the separation layer, a step for adhering the transferred layer including the thin film device to the transfer member with an adhesive layer therebetween, a step for irradiating the separation layer with light so as to form internal and/or interfacial exfoliation of the separation layer, and a step for detaching the substrate from the s...

대표
청구항

1. An exfoliating method for detaching a detached member disposed on a substrate with a separation layer therebetween, comprising:irradiating said separation layer with incident light from a side of said substrate causing exfoliation in said separation layer and/or at an interface of said separation layer and said substrate, and detaching said detached member from said substrate.

이 특허를 인용한 특허 피인용횟수: 603

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