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Microencapsulated adhesive 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B01J-013/16
  • B01J-013/20
  • C09J-133/08
출원번호 US-0977834 (1992-11-17)
발명자 / 주소
  • Hung Ya Chao
출원인 / 주소
  • Moore Business Forms
대리인 / 주소
    Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
인용정보 피인용 횟수 : 27  인용 특허 : 26

초록

A microencapsulated adhesive and a method for producing that microencapsulated adhesive is disclosed. The adhesive is produced from an alkyl acrylate or methacrylate monomer having about 4 to about 12 carbon atoms, or a mixture thereof. The monomer is encapsulated by interfacial polymerization, gela

대표청구항

1. A method of producing a microencapsulated adhesive comprising:providing a mixture containing as a major component an alkyl acrylate or methacrylate monomer, or a mixture thereof, and a free radical initiator; microencapsulating said mixture of monomer and initiator; heating said microencapsulated

이 특허에 인용된 특허 (26)

  1. Sweeney Theodore J. (Grosse Pointe City MI) Haviland John G. (Orchard Lake MI), Adhesive assembly.
  2. Cooke Bernard (Mullingan IEX) Wrobel Peter (Dublin IEX), Adhesive composition adapted for setting at a time later than the time of application.
  3. Sweeney Theodore J. (Grosse Pointe City MI), Adhesively securable fastener.
  4. Sweeney Theodore J. (Grosse Pointe City MI), Adhesively securable fastener.
  5. Sweeney Theodore J. (Grosse Pointe MI), Adhesively securable fastener.
  6. Sweeney, Theodore J., Adhesively securable fastener.
  7. Short ; William T., Dual-walled microcapsules and a method of forming same.
  8. Shank Joseph L. (Matteson IL), Encapsulation process utilizing microorganisms and products produced thereby.
  9. Petrie ; Edward M., Epoxy-amine adhesive compositions.
  10. Charnock Ronald S. (Celbridge IEX), Heat resistant toughened adhesive composition.
  11. Li ; Norman N. ; Shrier ; Adam L., Liquid membrane encapsulated reactive products.
  12. Irii Shinsuke (Nishinomiya JPX) Shiozaki Tomoharu (Amagasaki JPX), Method for the production of microcapsules.
  13. Nakazawa ; Atushi ; Ono ; Muneichi, Method of producing microcapsules.
  14. Ozono Masayoshi (Hachioji JPX), Micro-capsules and method of preparing same.
  15. Hart, Ronald L.; Work, Dale E.; Davis, Colin E., Microencapsulated epoxy adhesive system.
  16. Jaffe Howard (Gaithersburg MD), Microencapsulation process.
  17. Tice Thomas R. (Helena AL) Lewis Danny H. (Gardendale AL), Microencapsulation process.
  18. Wolinski ; Leon E. ; Berezuk ; Peter David, One-liquid cold setting adhesive with encapsulated catalyst initiator.
  19. Matkan Josef (Malvern AUX) Treleaven Richard J. (Toorak Gardens AUX), Particles containing releasable fill material and method of making same.
  20. Mathiowitz Edith (Brookline MA) Langer Robert S. (Somerville MA), Preparation of multiwall polymeric microcapsules.
  21. Sawai Yuji (Tokyo JPX) Ushiyama Hisayuki (Tokyo JPX) Tsuiki ; deceased Harunobu (late of Tokyo JPX) Tsuiki ; a legal representative by Noriko (Chigasaki JPX) Tsuiki ; legal representive Tomohiro (Chi, Pressure sensitive adhesive toner of clustered encapsulated porous particles for use in electrostatic photography.
  22. Delgado Joaquin (St. Paul MN) Leinen Roger W. (St. Paul MN) Silver Spencer F. (St. Paul MN), Pressure-sensitive adhesive comprising hollow tacky microspheres and macromonomer-containing binder copolymer.
  23. Dahm Manfred (Leverkusen DEX) Weimann Norbert (Leverkusen DEX) Nehen Ulrich (Leverkusen DEX) Mller Hanns P. (Odenthal-Blecher DEX) Jabs Gert (Odenthal DEX) Awater Albert (Odenthal DEX) Barnes James M, Production of microcapsules having walls of polyaddition products of water-insoluble polyamines with water-soluble polyi.
  24. Austin Robert A. (Chillicothe OH) Shackle Dale R. (Chillicothe OH), Production of radiation curable microcapsular coating compositions, pressure-sensitive transfer paper and its production.
  25. Suzuki Koji (Kasugai JPX) Sakai Jun (Nagoya JPX) Higashiyama Shunichi (Nagoya JPX) Suzuki Keiko (Okazaki JPX) Imaeda Mikio (Bisai JPX), Recording medium.
  26. Wallace Richard B. (Bloomfield Hills MI), Thread lock.

이 특허를 인용한 특허 (27)

  1. Schwantes, Todd Arlin; Krzoska, Michael Curley; Kulibert, Gregory Stephen; Malofsky, Adam Gregg; Malofsky, Bernard Miles; Ward, Nagib Maurice, Adhesively securable stock materials.
  2. Schwantes, Todd Arlin; Krzoska, Michael Curley; Kulibert, Gregory Stephen; Malofsky, Adam Gregg; Malofsky, Bernard Miles; Ward, Nagib Maurice, Adhesively securable stock packaging materials.
  3. Rosenthal, Guy; Heisserer, Jamie; Stolarski, Victoria L.; Perrine, Paul T., Bonded interlocking flooring.
  4. Schwantes, Todd Arlin, Cationic microcapsule particles.
  5. Dihora, Jiten Odhavji; Hasegawa, Jun, Conditioner compositions with increased deposition of polyacrylate microcapsules.
  6. Dihora, Jlten Odhavji; Hasegawa, Jun, Conditioner compositions with increased deposition of polyacrylate microcapsules.
  7. Dihora, Jiten Odhavji; Smets, Johan; Schwantes, Todd Arlin, Delivery particle.
  8. Dihora, Jiten Odhavji; Smets, Johan; Schwantes, Todd Arlin, Delivery particles.
  9. Schwantes, Todd Arlin; Krzoska, Michael Curley; Kulibert, Gregory Stephen; Malofsky, Adam Gregg; Malofsky, Bernard Miles; Ward, Nagib Maurice, Encapsulated cure systems.
  10. Schwantes, Todd Arlin, Encapsulated solid hydrophilic particles.
  11. Schwantes, Todd Arlin, Encapsulated solid hydrophilic particles.
  12. Yan, Nianxi; Sands, Peggy Dorothy; Guinebretiere, Sandra Jacqueline, Encapsulated structural adhesive.
  13. Diehl, Oliver; Humpert, Richard, Functional element for attachment to a plastic component and a component assembly.
  14. Diehl, Oliver; Humpert, Richard, Functional element for attachment to a plastic component and a component assembly.
  15. Schwantes, Todd Arlin, Hydrophilic liquid encapsulates.
  16. Schwantes, Todd Arlin, In situ microencapsulated adhesive.
  17. Thiel,George H., Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls.
  18. Virtanen, Jorma Antero; Hawkins, Todd, Method for corrosion prevention.
  19. Sakimura, Tomoo; Ogura, Kunihiro, Method for production of hollow particle.
  20. Dihora, Jiten Odhavji; Brown, Mark Anthony, Personal cleansing compositions with increased deposition of polyacrylate microcapsules.
  21. Virtanen, Jorma Antero, Self-healing polymer compositions.
  22. Virtanen, Jorma Antero, Self-healing polymer compositions.
  23. Virtanen, Jorma Antero, Self-healing polymer compositions.
  24. Dihora, Jiten Odhavji; Brown, Mark Anthony, Shampoo compositions with increased deposition of polyacrylate microcapsules.
  25. Dihora, Jiten Odhavji; Brown, Mark Anthony, Shampoo compositions with increased deposition of polyacrylate microcapsules.
  26. Sakamoto,Hiroyuki, Tapping screw having function of holding female screw shavings.
  27. Gard, Eric; Pinel, Eliette; Petit, Mikael, Threaded tubular component and resulting connection.
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