초록 ▼

A process for providing one or more protected copper elements on a surface of a workpiece is set forth. In accordance with the process, a barrier layer is applied to the workpiece. If the barrier layer is not suitable as a seed layer for subsequent electroplating processes, a separate seed layer is

A process for providing one or more protected copper elements on a surface of a workpiece is set forth. In accordance with the process, a barrier layer is applied to the workpiece. If the barrier layer is not suitable as a seed layer for subsequent electroplating processes, a separate seed layer is applied over the surface of the barrier layer. One or more copper elements are then electroplated on selected portions of the seed layer or, if suitable, the barrier layer. If used, the seed layer is then substantially removed. At least a portion of a surface of the barrier layer is rendered unplatable while leaving the copper elements suitable for electroplating. A protective layer is then electroplated onto surfaces of the one or more copper elements.

대표청구항 ▼

1. A process for providing one or more protected copper elements on a surface of a workpiece, the process comprising the steps of:applying a barrier layer to the workpiece; applying a seed layer on the barrier layer; electroplating one or more copper elements on selected portions of the seed layer;

1. A process for providing one or more protected copper elements on a surface of a workpiece, the process comprising the steps of:applying a barrier layer to the workpiece; applying a seed layer on the barrier layer; electroplating one or more copper elements on selected portions of the seed layer; substantially removing the seed layer; rendering at least a portion of a surface of the barrier layer unplatable; and electroplating a protective layer onto surfaces of the one or more copper elements.