초록 ▼

A self-contained field replaceable module that is adapted for low thermal resistance slideable contact with a heat sink that does not require interface pressure to ensure the contact and that is tolerant of misalignment is presented. The invention includes an interdigitated arrangement of the heat s

A self-contained field replaceable module that is adapted for low thermal resistance slideable contact with a heat sink that does not require interface pressure to ensure the contact and that is tolerant of misalignment is presented. The invention includes an interdigitated arrangement of the heat sink and field replaceable module. The field replaceable module includes a lid which forms a sealed cavity around at least one electronic component on the printed circuit board of the field replaceable module. The lid provides spray cooling or conduction cooling to the sealed electronic components. The lid includes a major surface having digit members extending longitudinally therefrom. The heat sink includes a major surface having digit members extending longitudinally therefrom. The digit members of the heat sink and field replaceable module are arranged in interdigitated arrangement for transferring heat from the field replaceable module to the heat sink. The digit members of the field replaceable module are particularly adapted and arranged for slideable contact with the digit members of the heat sink, so as to provide for ease of maintainability and exchangeability of the field replaceable module.

대표청구항 ▼

1. A field replaceable module electrically connectable for operation to a computer system to allow for easy exchangeability of said field replaceable module in said computer system, said field replaceable module comprising:a printed circuit board; one or more electronic components electrically conne

1. A field replaceable module electrically connectable for operation to a computer system to allow for easy exchangeability of said field replaceable module in said computer system, said field replaceable module comprising:a printed circuit board; one or more electronic components electrically connected to said printed circuit board; a lid having an inner cavity therein, said lid sealed over at least one of said electronic components to seal said at least one electronic components within said inner cavity, said lid comprising a plurality of fins extending longitudinally from a major surface of said lid; and a self-contained liquid cooled system for transferring heat from said at least one electronic components sealed in said inner cavity to said lid, wherein said self-contained liquid cooled system comprises: a liquid flow path formed inside said lid; at least one spray nozzle coupled between said flow path and said inner cavity; a cooling liquid circulating in said flow path; and a spray pump which circulates said cooling liquid through said flow path thereby causing said cooling liquid to spray into said inner cavity through said at least one spray nozzle.