초록 ▼

A cooling assembly for cooling chips is disclosed. The assembly includes a heat sink, a plate member, and a heat pipe. The heat sink is attachable to a first chip. The plate member is attachable to a second chip. The heat pipe is arranged between the heat sink and plate member such that one end of t

A cooling assembly for cooling chips is disclosed. The assembly includes a heat sink, a plate member, and a heat pipe. The heat sink is attachable to a first chip. The plate member is attachable to a second chip. The heat pipe is arranged between the heat sink and plate member such that one end of the heat pipe attaches to the heat sink and the other end of the heat pipe attaches to the plate member. A system for cooling chips and method for dissipating heat generated by chips are also disclosed.

대표청구항 ▼

1. A chip cooling assembly, comprising:a heat sink attachable to a first chip; a plate member attachable to a second chip; and a heat pipe having a first end attached to the heat sink and a second end attached to the plate member; wherein the heat sink comprises: a base portion, a plurality of protr

1. A chip cooling assembly, comprising:a heat sink attachable to a first chip; a plate member attachable to a second chip; and a heat pipe having a first end attached to the heat sink and a second end attached to the plate member; wherein the heat sink comprises: a base portion, a plurality of protruding members extending from the base portion, and a groove formed through the protruding members; and wherein the first end of the heat pipe is positioned in the groove.