초록 ▼

A method of fabricating electronic parts is provided which is capable of forming fine patterns with high accuracy as well as easily fabricating a multilayered structure of a conductor pattern with high performance. The disclosed method includes the steps of forming a pattern on a surface of a flexib

A method of fabricating electronic parts is provided which is capable of forming fine patterns with high accuracy as well as easily fabricating a multilayered structure of a conductor pattern with high performance. The disclosed method includes the steps of forming a pattern on a surface of a flexible resin sheet by laser process, and then forming a release layer on the surface of the thus obtained pattern, thereby forming an intaglio plate. Next, the intaglio plate is filled with Ag paste, dried and laminated onto an insulating substrate, on which a thermoplastic resin layer is formed. Thereafter, the intaglio plate is peeled from the substrate so that the pattern of the paste is transferred thereon, and a conductor pattern is formed. Further, an insulating layer is formed to cover the conductor pattern and another conductor pattern is formed on the insulating layer, thereby forming a multilayered structure.

대표청구항 ▼

1. A method for fabricating an electronic part wherein a conductor pattern is transferred onto a substrate by intaglio printing, the method comprising the steps of:(a) forming a groove on a surface of an intaglio plate; (b) filling a conductive paste into the groove; (c) laminating the substrate wit

1. A method for fabricating an electronic part wherein a conductor pattern is transferred onto a substrate by intaglio printing, the method comprising the steps of:(a) forming a groove on a surface of an intaglio plate; (b) filling a conductive paste into the groove; (c) laminating the substrate with the intaglio plate whose groove has been filled with the conductive paste; and (d) forming a conductor pattern by peeling the intaglio plate from the substrate so as to transfer the conductive paste onto the substrate, wherein the intaglio plate comprises a flexible resin sheet.