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Heat exchanger with transpired, highly porous fins 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-001/24
출원번호 US-0453386 (1999-12-02)
발명자 / 주소
  • Charles F. Kutscher
  • Keith Gawlik
출원인 / 주소
  • Midwest Research Institute
대리인 / 주소
    Paul J. White
인용정보 피인용 횟수 : 36  인용 특허 : 8

초록

The heat exchanger includes a fin and tube assembly with increased heat transfer surface area positioned within a hollow chamber of a housing to provide effective heat transfer between a gas flowing within the hollow chamber and a fluid flowing in the fin and tube assembly. A fan is included to forc

대표청구항

1. A heat exchanger for exchanging heat between a fluid and a gas having improved gas-side heat transfer characteristics, said heat exchanger comprising:a housing having a hollow chamber that defines a flow path for gas flowing through said heat exchanger; a conduit extending through said chamber tr

이 특허에 인용된 특허 (8)

  1. Kawabata Katsuhiro (Osaka JPX) Yamashita Hiroyuki (Osaka JPX) Hasegawa Isao (Osaka JPX) Tanaka Junichiro (Osaka JPX) Matsushima Junji (Osaka JPX), Air conditioner.
  2. Takeshita Michimasa,JPX ; Yoshida Takayuki,JPX ; Tanimura Yoshiaki,JPX ; Iijima Hitoshi,JPX ; Gotoh Takashi,JPX ; Yumikura Tsuneo,JPX, Air conditioner and heat exchanger used therefor.
  3. Shin Jun-Chul,KRX, Evaporator of refrigerator.
  4. Leedham Harry W. T. (Kitchener CA), Finned tube bundle heat exchanger.
  5. Shikazono Naoki,JPX ; Itoh Masaaki,JPX ; Uchida Mari,JPX ; Fukushima Toshihiko,JPX, Heat exchanger.
  6. Tsukamoto Ikuo (Shizuoka JPX) Sakuma Kiyoshi (Shizuoka JPX) Tanimura Yoshiaki (Shizuoka JPX) Umemura Hiroyuki (Shizuoka JPX) Seshimo Yu (Amagasaki JPX) Fujii Masao (Amagasaki JPX) Yamada Makoto (Shiz, Heat exchanger with corrugated heat transfer plates.
  7. Hayashi Masakatsu (Ushikumachi JPX) Tanaka Takeo (Minorimachi JPX) Natori Tatsuo (Kashiwa JPX) Aizawa Tatsushi (Shimoinayoshi JPX) Kojima Shigeru (Kasukabe JPX) Senshu Takao (Shimizu JPX), Method for the production of heat exchangers.
  8. Bemisderfer Charles H. (Granger IN), Vortex jet impingement heat exchanger.

이 특허를 인용한 특허 (36)

  1. Castrén, Markus; Castrén, Risto, Air conditioning device.
  2. Mori, Nobuyuki; Sakamoto, Akihiro, Air cooling equipment for heat treatment process for martensitic stainless steel pipe or tube.
  3. Akiyoshi, Masao; Michihata, Satoshi; Yamada, Shoji; Fukui, Tomoya, Air-conditioning indoor unit with axial fans and heat exchanger partition.
  4. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem.
  5. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow.
  6. Yang, Wei; Zhang, Chunbo; Eickhoff, Steven J; Gu, Alex, Blowerless heat exchanger based on micro-jet entrainment.
  7. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Condenser block structures with cavities facilitating vapor condensation cooling of coolant.
  8. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Condenser fin structures facilitating vapor condensation cooling of coolant.
  9. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Condenser fin structures facilitating vapor condensation cooling of coolant.
  10. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Condenser structures with fin cavities facilitating vapor condensation cooling of coolant.
  11. Haydock, Paul M.; Rieke, Larry D.; Vargo, Mathew S., Condensing heat exchanger fins with enhanced airflow.
  12. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling.
  13. Daniel, Steven A.; Vannette, Avert Glen; Sergison, Daniel Peter; Thomson, Norval P., Cooling system packaging arrangement for a machine.
  14. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Direct jet impingement-assisted thermosyphon cooling apparatus and method.
  15. Yang, Wei; Hilton, Leonard; Gu, Yuandong; Park, Jong, Fin fabrication process for entrainment heat sink.
  16. Sheng, Jian Qing; Lee, Meng Tzu; Lin, Shu Ho, Heat dissipating device.
  17. Karl, Stefan; Taklanti, Abdelmajid; Labaste Mauhe, Laurent, Heat exchange device containing heat storage material.
  18. Gerstler, William Dwight; Kupiszewski, Thomas; Kenworthy, Michael Thomas; Erno, Daniel Jason, Heat exchanger including passageways.
  19. Gu, Yuandong; Yang, Wei, Heat sink fin including angular dimples.
  20. Sperandei, Bryan; Evans, Bruce; So, Allan K.; Cotton, James Scott, Heat transfer surfaces with flanged apertures.
  21. Sperandei, Bryan; Evans, Bruce; So, Allan K.; Cotton, James Scott, Heat transfer surfaces with flanged apertures.
  22. Tamburello, David A.; Kesterson, Matthew R.; Hardy, Bruce J., Heat transfer unit and method for prefabricated vessel.
  23. Tamburello, David A.; McWilliams, Anthony J.; Hardy, Bruce J.; Kesterson, Matthew R., Heat transfer unit and method for prefabricated vessel.
  24. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
  25. Yamada, Shoji; Sakoda, Kenichi; Akiyoshi, Masao; Takamori, Akira; Uehara, Nobuaki; Fukui, Tomoya; Nakashima, Seiji; Iwamoto, Naoki; Michihata, Satoshi; Otsuka, Isao; Tsuji, Masayuki, Indoor unit of air conditioner and air conditioner including a heat exchanger on a downstream side of a blower.
  26. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
  27. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems.
  28. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus.
  29. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus.
  30. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems.
  31. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit.
  32. Chiang, Robert Hong Leung; Daddis, Jr., Eugene Duane; Fung, Kwok Kwong; Chuang, Sue-Li Kingsley, Medium temperature refrigerated merchandiser.
  33. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Open flow cold plate for immersion-cooled electronic packages.
  34. Northrop,William F., Perforated fin heat exchangers and catalytic support.
  35. Berukhim, David; Leishman, Andrew; Avanessian, Vahe, Plate-fin heat exchanger with a porous blocker bar.
  36. Lee, Dae-Young; Kim, Seo-Young, Rapid thermal storage/release system using a porous member.
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