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Temperature controlled gas distribution plate 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-016/00
  • C23C-014/00
  • F28F-003/12
출원번호 US-0238598 (1994-05-05)
발명자 / 주소
  • Turgut Sahin
  • Salvador Umotoy
  • Avi Tepman
  • Ronald Lloyd Rose
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Moser Patterson & Sheridan, LLP
인용정보 피인용 횟수 : 12  인용 특허 : 32

초록

The temperature controlled gas distribution plate of the present invention includes a liquid cooling passage, with inlet and outlet ports, that is formed within the gas distribution plate. In the preferred embodiment, the plate is formed with an upper passage cover and a lower base having a liquid p

대표청구항

1. An apparatus, comprising:a chemical vapor deposition chamber; a gas injection cover member having a process gas inlet in communication with said chemical vapor deposition chamber and a coolant system configured to cool said process gas inlet; a gas distribution plate interconnected to said gas in

이 특허에 인용된 특허 (32)

  1. Bernacki Stephen E. (Northboro MA) Kosicki Bernard B. (Acton MA), Anisotropic plasma etching of semiconductors.
  2. Rose Alan D. (Wylie TX), Apertured ring for exhausting plasma reactor gases.
  3. Davis Cecil J. (Greenville TX) Carter Duane E. (Plano TX) Jucha Rhett B. (Celeste TX), Apparatus and method for plasma-assisted etching.
  4. Kalbskopf Reinhard (Vordemwald CHX) Baumberger Otto (Carouge CHX) Masson Serge (Orange FRX), Apparatus for continuously depositing a layer of a solid material on the surface of a substrate brought to a high temper.
  5. Awaya Nobuyoshi (Isehara JPX) Arita Yoshinobu (Atsugi JPX), Apparatus for growing a thin metallic film.
  6. Gruenwald Heinrich (Gomaringen DEX) Ramisch Hans (Frankfurt DEX) Pawlakowitsch Anton (Alzenau DEX), Apparatus for plasma etching.
  7. Mller Rainer (Dresden DEX) Resch Dietmar (Dresden DEX) Fabian Lutz (Dresden DEX), Apparatus for the gas-phase processing of disk-shaped workpieces.
  8. Harra David J. (Santa Cruz CA), Apparatus for thermal treatment of semiconductor wafers by gas conduction incorporating peripheral gas inlet.
  9. Bartholomew Lawrence D. (Santa Cruz CA) Gralenski Nicholas M. (Aptos CA) Richie Michael A. (Santa Cruz CA) Hersh Michael L. (Boulder Creek CA), Atmospheric pressure chemical vapor deposition apparatus.
  10. Wang David N. (Cupertino CA) White John M. (Hayward CA) Law Kam S. (Union City CA) Leung Cissy (Union City CA) Umotoy Salvador P. (Pittsburg CA) Collins Kenneth S. (San Jose CA) Adamik John A. (San R, CVD of silicon oxide using TEOS decomposition and in-situ planarization process.
  11. Degner Raymond L. (Los Altos CA) Lenz Eric H. (Palo Alto CA), Composite electrode for plasma processes.
  12. Coffinberry ; George A. ; Kast ; Howard B., Concentric-tube stacked plate heat exchanger.
  13. Kurasaki Howard S. (San Jose CA) Westlund Barbara F. (Saratoga CA) Nulty James E. (San Jose CA) Vowles E. John (Deering NH), Dry etch process for forming champagne profiles, and dry etch apparatus.
  14. Tracy David H. (Norwalk CT) Smith Donald L. (Palo Alto CA), Electrode for plasma etching system.
  15. Hijikata Isamu (Kanagawa JPX) Uehara Akira (Kanagawa JPX) Samezawa Mitsuo (Kanagawa JPX), Electrode for use in the treatment of an object in a plasma.
  16. Kagatsume Satoshi (Nirasaki JPX) Fukasawa Kazuo (Kofu JPX), Etching device, and etching method.
  17. Horiuchi Takao (Fuchu JPX) Arai Izumi (Yokohama JPX) Tahara Yoshifumi (Yamato JPX), Etching method and etching apparatus.
  18. Niggemann Richard E. (Rockford IL), Gas-liquid impingement plate type heat exchanger.
  19. Kessler Peter H. (Round Rock TX) Calvert ; Sr. Wilson D. (Round Rock TX) Pintchovski Faivel S. (Austin TX), Heat exchange apparatus for high temperature LPCVD equipment.
  20. Bartholomew Lawrence D. (Santa Cruz County CA) Provancha Kenneth M. (Santa Cruz County CA) Kamian George (Santa Cruz County CA) DeDontney Jay B. (Santa Cruz County CA) McDaniel Gregory M. (Santa Cruz, Injector and method for delivering gaseous chemicals to a surface.
  21. Bourdon Bernard (Orsay FRX), Method of attacking a thin film by decomposition of a gas in a plasma.
  22. Kalbskopf Reinhard (Onex CHX) Baumberger Otto (Carouge CHX), Nozzle for the continuous depositing of a layer of solid material on a substrate.
  23. Gorin Georges J. (Emeryville CA) Hoog Josef T. (Novato CA), Plasma reactor apparatus.
  24. Awaya Nobuyoshi (Isehara JPX) Arita Yoshinobu (Atsugi JPX), Process for growing a thin metallic film.
  25. Awaya Nobuyoshi (Isehara JPX) Arita Yoshinobu (Isehara JPX), Process for selectively growing thin metallic film of copper or gold.
  26. Tokuda Mitsuo (Tachikawa JPX) Azuma Junzou (Yokohama JPX) Otsubo Toru (Fujisawa JPX) Yamaguchi Yasuhiro (Chigasaki JPX) Sasaki Ichirou (Yokohama JPX), Processing apparatus and method for plasma processing.
  27. Moslehi Mehrdad M. (Dallas TX) Davis Cecil J. (Greenville TX) Matthews Robert T. (Plano TX), Programmable multizone gas injector for single-wafer semiconductor processing equipment.
  28. Tappan James E. (Milpitas) Yasuda Arthur K. (San Francisco) Denison Dean R. (San Jose) Mundt Randall S. (Pleasanton CA), Reaction chamber design and method to minimize particle generation in chemical vapor deposition reactors.
  29. Giammarco Nicholas J. (Newburgh NY) Kaplita George A. (New Windsor NY), Reactive ion etching apparatus.
  30. Law Kam S. (Union City CA) Leung Cissy (Fremont CA) Tang Ching C. (San Francisco CA) Collins Kenneth S. (San Jose CA) Chang Mei (Cupertino CA) Wong Jerry Y. K. (Union City CA) Wang David Nin-Kou (Cup, Reactor chamber self-cleaning process.
  31. Moulene, Daniel; Gourdon, Pierre, Temperature conditioning support for small objects such as semi-conductor components and thermal regulation process using said support.
  32. Cathey David A. (Boise ID) Freeman John C. (Boise ID) Dale James (Boise ID) Crane William J. (Boise ID) Powell Eric A. (Boise ID) Musser Jeffrey V. (Boise ID), Temperature controlled anode for plasma dry etchers for etching semiconductor.

이 특허를 인용한 특허 (12)

  1. Walczak,Walter S., Annular cold plate with reflexive channels.
  2. Okamoto,Kazutaka; Doi,Masayuki; Okamura,Hisanori; Aono,Yasuhisa; Kagawa,Manabu; Hirano,Satoshi; Aota,Kinya, Cooling plate and manufacturing method thereof, and sputtering target and manufacturing method thereof.
  3. Bhatia,Ritwik; Xia,Li Qun; Peterson,Chad; M'Saad,Hichem, Decreasing the etch rate of silicon nitride by carbon addition.
  4. Huang, Tsan-Hua; Han, Tsung-Hsun; Wong, Paul; Wu, Miao-Chan, Gas injector and cover plate assembly for semiconductor equipment.
  5. Huang, Tsan-Hua; Han, Tsung-Hsun; Wong, Paul; Wu, Miao-Chan, Gas injector and cover plate assembly for semiconductor equipment.
  6. Kim, Dae Youn; Kim, Hie Chul; Jang, Hyun Soo, Gas supply plate for semiconductor manufacturing apparatus.
  7. Honma, Manabu; Hishiya, Katsuyuki, Gas-separating plate for reactor for manufacturing semiconductor.
  8. Honma, Manabu; Hishiya, Katsuyuki, Gas-separating plate for reactor for manufacturing semiconductor.
  9. Honma, Manabu; Hishiya, Katsuyuki, Gas-separating plate for reactor for manufacturing semiconductor.
  10. Tsuei, Lun; Sen, Soovo; Lee, Ju-Hyung; Rocha-Alvarez, Juan Carlos; Shmurun, Inna; Zhao, Maosheng; Kim, Troy; Venkataraman, Shankar, Heated gas distribution plate for a processing chamber.
  11. Dunham, Scott William, Plasma generator assembly for use in CVD and PECVD processes.
  12. Yang, Il-Kwang; Song, Byoung-Gyu; Kim, Yong-Ki; Kim, Kyong-Hun; Shin, Yang-Sik, Showerhead having cooling system and substrate processing apparatus including the showerhead.
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