초록 ▼

An electronic assembly that incorporates a heat sink. The subassembly includes an integrated circuit package that is mounted to a substrate. The substrate is mounted to a spacer block which includes a pin field that contains a plurality of pins. The heat sink is coupled to the integrated circuit pac

An electronic assembly that incorporates a heat sink. The subassembly includes an integrated circuit package that is mounted to a substrate. The substrate is mounted to a spacer block which includes a pin field that contains a plurality of pins. The heat sink is coupled to the integrated circuit package by a clip that wraps around the sink and is attached to the spacer block.

대표청구항 ▼

1. An electronic assembly, comprising:a socket including a pin socket; a spacer block including a latch, and a pin for insertion into said pin socket of said socket; a substrate mounted to said spacer block; an integrated circuit package mounted to said substrate; a heat sink adjacent to said integr

1. An electronic assembly, comprising:a socket including a pin socket; a spacer block including a latch, and a pin for insertion into said pin socket of said socket; a substrate mounted to said spacer block; an integrated circuit package mounted to said substrate; a heat sink adjacent to said integrated circuit package; a fan mounted on said heat sink; a clip that is wrapped around both said heat sink and said fan for attachment to said latch of said spacer block.