$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Method and apparatus for separating composite member using fluid 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-035/00
출원번호 US-0047327 (1998-03-25)
우선권정보 JP-0075498 (1997-03-27); JP-0138477 (1997-05-28)
발명자 / 주소
  • Kazuaki Ohmi JP
  • Takao Yonehara JP
  • Kiyofumi Sakaguchi JP
  • Kazutaka Yanagita JP
출원인 / 주소
  • Canon Kabushiki Kaisha JP
대리인 / 주소
    Fitzpatrick, Cella, Harper & Scinto
인용정보 피인용 횟수 : 47  인용 특허 : 18

초록

To separate a composite member consisting of a plurality of bonded members without destructing or damaging it, a fluid is jetted against the composite member from a nozzle to separate it into a plurality of members at a position different from a bonding position.

대표청구항

1. A separation apparatus comprising:a holding means for holding a composite member having a plurality of mutually bonded members; a jetting means for jetting a fluid against a side surface of the composite member; and a movement mechanism for relatively moving the composite member and the jetting m

이 특허에 인용된 특허 (18)

  1. Munoz Jose P. (West Bloomfield MI), Adjustable fluid jet cleaner.
  2. Frank Walter (Burgkirchen DEX) Pemwieser Albert (Ach ATX) Spatzier Gerhard (Eggelsberg ATX), Apparatus and method of automatically separating stacked wafers.
  3. Cha Gi-ho,KRX ; Lee Byoung-hun,KRX, Apparatus and methods for wafer debonding using a liquid jet.
  4. Hayase Iwao (Itami JPX), Apparatus for producing semiconductor wafers.
  5. Henley Francois J. ; Cheung Nathan, Controlled cleavage process using pressurized fluid.
  6. Domann Hannes (Geesthact DEX), Method and apparatus for producing a water/abrasive mixture for cutting and cleaning objects and for the precise removal.
  7. Klingel Hans (Moglingen DEX), Method and machine tool for cutting workpieces.
  8. Goesele Ulrich M. (Durham NC) Lehmann Volker (Durham NC), Method for bubble-free bonding of silicon wafers.
  9. Sato Nobuhiko,JPX ; Yonehara Takao,JPX ; Sakaguchi Kiyofumi,JPX, Method for producing semiconductor substrate.
  10. Matsushita Takeshi,JPX ; Tayanaka Hiroshi,JPX, Method for separating a device-forming layer from a base body.
  11. Bozler Carl O. (Sudbury MA) Fan John C. C. (Chestnut Hill MA) McClelland Robert W. (Norwell MA), Method of producing sheets of crystalline material and devices made therefrom.
  12. Sakaguchi Kiyofumi,JPX ; Yonehara Takao,JPX, Process for producing semiconductor article.
  13. Sakaguchi Kiyofumi,JPX ; Yonehara Takao,JPX ; Nishida Shoji,JPX ; Yamagata Kenji,JPX, Process for producing semiconductor article.
  14. Sakaguchi Kiyofumi,JPX ; Yonehara Takao,JPX, Process for production of semiconductor substrate.
  15. Bruel Michel,FRX, Process for the manufacture of thin films of semiconductor material.
  16. Bruel Michel,FRX ; Poumeyrol Thierry,FRX, Process for the production of a structure having a thin semiconductor film on a substrate.
  17. Bruel Michel (Veurey FRX), Process for the production of thin semiconductor material films.
  18. Yonehara Takao (Atsugi JPX), Semiconductor member and process for preparing semiconductor member.

이 특허를 인용한 특허 (47)

  1. Iwasaki, Yukiko; Nishida, Shoji; Sakaguchi, Kiyofumi; Ukiyo, Noritaka, Anodizing apparatus.
  2. Barge, Thierry; Schwarzenbach, Walter; Waechter, Jean-Marc; Truong, Thuan; Ghyselen, Bruno, Apparatus and method for splitting substrates.
  3. Geurts, Peter Johannes Lodewijk; Costelloe, Nathan Thomas, Device for deblocking optical workpieces, in particular eyeglass lenses.
  4. Nayfeh, Ammar Munir; Chui, Chi On; Saraswat, Krishna C.; Yonehara, Takao, Germanium substrate-type materials and approach therefor.
  5. Nayfeh,Ammar Munir; Chui,Chi On; Saraswat,Krishna C.; Yonehara,Takao, Germanium substrate-type materials and approach therefor.
  6. Sugiyama, Eiji; Dozen, Yoshitaka; Fukumoto, Yumiko; Kuwabara, Hideaki; Yamazaki, Shunpei, Manufacturing method of semiconductor device including peeling layers from substrates by etching.
  7. Sugiyama, Eiji; Dozen, Yoshitaka; Ohno, Yumiko; Kuwabara, Hideaki; Yamazaki, Shunpei, Manufacturing method of semiconductor device using peeling.
  8. Yanagita, Kazutaka; Kohda, Mitsuharu; Sakaguchi, Kiyofumi; Fujimoto, Akira, Method and apparatus for separating member.
  9. Yanagita, Kazutaka; Kohda, Mitsuharu; Sakaguchi, Kiyofumi; Fujimoto, Akira, Method and apparatus for separating member.
  10. Yanagita, Kazutaka; Kohda, Mitsuharu; Sakaguchi, Kiyofumi; Fujimoto, Akira, Method and apparatus for separating member.
  11. Yanagita,Kazutaka; Sakaguchi,Kiyofumi, Method and apparatus for separating sample.
  12. Okabe, Takehito; Sato, Nobuhiko; Kurotobi, Makoto; Takeda, Kenichi; Ifuku, Toshihiro, Method for producing a piezoelectric film actuator.
  13. Huang, Yu-Ling; Tsai, Lung Hui, Method for removing the circumferential edge of a dielectric layer.
  14. Wijngaards, David D. L.; Reinten, Hans; Stolk, Hendrik J.; Westland, Alex N., Method of manufacturing a piezoelectric ink jet device.
  15. Yonehara, Takao; Sakaguchi, Kiyofumi, Method of manufacturing a thin-film semiconductor device used for a display region and peripheral circuit region.
  16. Noguchi,Takashi; Xianyu,Wenxu; Yin,Huaxiang, Method of manufacturing single crystal Si film.
  17. Sakaguchi, Kiyofumi; Yonehara, Takao, Method of separation of semiconductor device.
  18. Mazure,Carlos; Ghyselen,Bruno, Methods for producing a multilayer semiconductor structure.
  19. Vuorio, Taisto, Nozzle.
  20. Vuorio, Taisto, Nozzle.
  21. Ghyselen, Bruno; Bensahel, Daniel; Skotnicki, Thomas, Process for transferring a layer of strained semiconductor material.
  22. Ghyselen, Bruno; Bensahel, Daniel; Skotnicki, Thomas, Process for transferring a layer of strained semiconductor material.
  23. Ghyselen, Bruno; Bensahel, Daniel; Skotnicki, Thomas, Process for transferring a layer of strained semiconductor material.
  24. Lichtensteiger, Lukas; Pfeffer, Christian, Production of free-standing solid state layers by thermal processing of substrates with a polymer.
  25. Yanagita, Kazutaka; Ohmi, Kazuaki; Sakaguchi, Kiyofumi, Sample processing system.
  26. Yanagita, Kazutaka; Ohmi, Kazuaki; Sakaguchi, Kiyofumi, Sample processing system.
  27. Yanagita, Kazutaka; Ohmi, Kazuaki; Sakaguchi, Kiyofumi, Sample processing system.
  28. Yanagita, Kazutaka; Ohmi, Kazuaki; Sakaguchi, Kiyofumi, Sample separating apparatus and method, and substrate manufacturing method.
  29. Yanagita, Kazutaka; Ohmi, Kazuaki; Sakaguchi, Kiyofumi, Sample separating apparatus and method, and substrate manufacturing method.
  30. Yanagita, Kazutaka; Yonehara, Takao; Omi, Kazuaki; Sakaguchi, Kiyofumi, Sample separating apparatus and method, and substrate manufacturing method.
  31. Yanagita, Kazutaka; Yonehara, Takao; Omi, Kazuaki; Sakaguchi, Kiyofumi, Sample separating apparatus and method, and substrate manufacturing method.
  32. Sekiguchi,Yoshinobu; Yonehara,Takao; Koto,Makoto; Okuda,Masahiro; Shimada,Tetsuya, Semiconductor film manufacturing method and substrate manufacturing method.
  33. Yonehara, Takao; Yamagata, Kenji; Sekiguchi, Yoshinobu; Nishi, Kojiro, Semiconductor member, semiconductor article manufacturing method, and LED array using the manufacturing method.
  34. Yonehara, Takao; Yamagata, Kenji; Sekiguchi, Yoshinobu; Nishi, Kojiro, Semiconductor member, semiconductor article manufacturing method, and LED array using the manufacturing method.
  35. Sakaguchi,Kiyofumi; Sato,Nobuhiko, Semiconductor substrate, semiconductor device, and method of manufacturing the same.
  36. Yonehara, Takao; Sekiguci, Yoshinobu, Semiconductor substrate, semiconductor device, light emitting diode and producing method therefor.
  37. Sakaguchi, Kiyofumi, Substrate and manufacturing method therefor.
  38. Sakaguchi, Kiyofumi, Substrate and manufacturing method therefor.
  39. Rayssac, Olivier; Letertre, Fabrice, Substrate cutting device and method.
  40. Rayssac,Olivier; Letertre,Fabrice, Substrate cutting device and method.
  41. Martinez,Muriel; Barge,Thierry; Soubie,Alain; Lagahe Blanchard,Chrystelle; Berne,C?cile; Rayssac,Olivier, Substrate layer cutting device and method.
  42. Martinez,Muriel; Barge,Thierry; Soubie,Alain; Lagahe Blanchard,Chrystelle; Berne,C��cile; Rayssac,Olivier, Substrate layer cutting device and method.
  43. Yonehara,Takao, Substrate, manufacturing method therefor, and semiconductor device.
  44. Yonehara,Takao; Shimada,Tetsuya, Thin film transistor and method of fabricating the same.
  45. Sakaguchi, Kiyofumi; Yonehara, Takao, Thin-film semiconductor device and method of manufacturing the same.
  46. Yonehara,Takao; Sakaguchi,Kiyofumi, Thin-film semiconductor device and method of manufacturing the same.
  47. Jin, Hotae; Oh, Seonju; Kim, HeuiSeog, Wafer dividing apparatus and methods.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로