초록 ▼

The electrical junctions of either or both sides of a thermoelectric module are placed in direct thermal contact with a heat source or sink or a material to be thermally modified (that is, heated or cooled), thereby eliminating the conventional substrate typically found in such modules and its assoc

The electrical junctions of either or both sides of a thermoelectric module are placed in direct thermal contact with a heat source or sink or a material to be thermally modified (that is, heated or cooled), thereby eliminating the conventional substrate typically found in such modules and its associated thermal resistance. In one embodiment, the conductive junction passes through a conduit carrying a material to be heated or cooled. In the conduit, the conductive material can be configured into an effective heat transfer shape such as a vane which extends through non-conducting conduit walls. In another embodiment, the geometry of the conductor forming the electrical junction forms a pipe or tube through which material to be heated or cooled is passed. A protection layer of high thermal conductivity can be applied to the conductive surfaces in order to prevent corrosion or short-circuiting of the device in applications where an electrolytic or ionic fluid is passed by the junction.

대표청구항 ▼

1. A thermoelectric module for thermally modifying a material, the module comprising:at least one P-type thermoelectric element; at least one N-type thermoelectric element; and an electrical connection between the P-type element and the N-type element, the electrical connection being positioned in d

1. A thermoelectric module for thermally modifying a material, the module comprising:at least one P-type thermoelectric element; at least one N-type thermoelectric element; and an electrical connection between the P-type element and the N-type element, the electrical connection being positioned in direct thermal contact with the material and wherein the P-type element and the N-type element abut the electrical connection.