초록 ▼

A cooling arrangement useful for semiconductors or solid-state assemblages mounts the semiconductor or other solid-state device directly onto a first surface of a thermally conductive "heat spreader." The heat spreader contains microchannels which open into coolant fluid ports on the second side of

A cooling arrangement useful for semiconductors or solid-state assemblages mounts the semiconductor or other solid-state device directly onto a first surface of a thermally conductive "heat spreader." The heat spreader contains microchannels which open into coolant fluid ports on the second side of the heat spreader. The heat spreader, in turn, is mounted on a coolant fluid distribution or circulation plate. In one embodiment, the coolant fluid distribution plate also includes a micropump for circulating coolant fluid through the microchannels of the heat spreader. In another embodiment, the coolant fluid distribution plate simply distributes coolant applied to its fluid input port to those heat spreaders mounted thereon, and a plurality of coolant fluid distribution plates are mounted on a coolant fluid circulation plate, which uses a micropump to circulate coolant fluid to the various distribution plates and ultimately to the heat spreaders. Thus, coolant fluid is communicated directly into the support for the semiconductor chip or other solid-state device, for good heat transfer with low temperature drop.(178)

대표청구항 ▼

1. A monolithic solid-state chip including a planar dielectric substrate defining first and second broad surfaces, and also defining electrical conductors lying on said first surface, said solid state chip producing heat during operation;a thermally conductive plate including a first broad surface d

1. A monolithic solid-state chip including a planar dielectric substrate defining first and second broad surfaces, and also defining electrical conductors lying on said first surface, said solid state chip producing heat during operation;a thermally conductive plate including a first broad surface directly connected to said second surface of said solid-state chip, and also including a second broad surface substantially parallel with said first broad surface, said thermally conductive plate including at least one microchannel extending between coolant fluid input and output ports and between said first and second broad surfaces of said thermally conductive plate, said microchannel having a cross-sectional area smaller than about 0.001 square inch; and a source of pressurized coolant fluid coupled to said input port of said thermally conductive plate.